Design and Implementation of a Multiconnectivity IoT Modem for Highly Reliable Consumer Applications

Authors: Lin, C., Shen, C., Shih, H.

Source: IEEE Consumer Electronics Magazine IEEE Consumer Electron. Mag. Consumer Electronics Magazine, IEEE. 13(5):47-60 Sep, 2024

Multimodality Molecular Imaging of Brain Tumor Using Simultaneous [18F]FET-PET/MRSI

Authors: Ma, C., Han, P. K., Marin, T., Zhuo, Y., Shih, H. A., Fakhri, G. El

Source: 2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector Conference (RTSD) Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector Conference (RTSD), 2024 IEEE. :1-2 Oct, 2024

Relation: 2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector Conference (RTSD)

AI-URG: Account Identity-Based Uncertain Graph Framework for Fraud Detection

Authors: Chang, Y., Shih, H., Lin, T.

Source: IEEE Transactions on Computational Social Systems IEEE Trans. Comput. Soc. Syst. Computational Social Systems, IEEE Transactions on. 11(3):3706-3728 Jun, 2024

Polarization and Reliability Enhancement for Ferroelectric Capacitors by Interface Engineering Through Crystalline TaN

Authors: Chen, Y., Wang, C., Shih, H., Kuo, C., Wu, Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(5):3433-3438 May, 2024

A Real-Time 1280 × 720 Object Detection Chip With 585 MB/s Memory Traffic

Authors: Chang, K., Shih, H., Chang, T., Tsai, S., Yang, C., Wu, C., Huang, C.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(6):816-825 Jun, 2022

Package on System Level Solder Joint Stress Analysis Under Shock Test

Authors: Shih, H.-C., Liao, H., Chen, R., Liao, Y., Tarng, D., Hung, C.P.

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1509-1516 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Thermally Robust Perpendicular SOT-MTJ Memory Cells With STT-Assisted Field-Free Switching

Authors: Tsou, Y., Chen, W., Shih, H., Liu, P., Liu, C.W., Li, K., Shieh, J., Yen, Y., Lai, C., Wei, J., Tang, D.D., Sun, J.Y.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(12):6623-6628 Dec, 2021

Phosphor-in-Glass for High Performance WLEDs by Reduction Phosphor Interaction and AR Coating

Authors: Shih, H., Liu, C., Cheng, W.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 33(20):1143-1146 Oct, 2021

A Side-Pumping Package Design for Hybrid-Quantum-Dot Light Emitting Diodes

Authors: Huang, C., Lee, T., Yang, J., Shih, H., Hsu, S., Chen, T., Lin, C.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 33(16):804-807 Aug, 2021

High Performance and Reliability of Two-Inch Phosphor-in-Glass for White Light-Emitting Diodes Employing Novel Wet-Type Cold Isostatic Pressing

Authors: Shih, H., Liu, C., Cheng, W.

Source: IEEE Photonics Journal IEEE Photonics J. Photonics Journal, IEEE. 13(3):1-10 Jun, 2021

5G Millimeter-Wave Substrate-Integrated Waveguide Quad-Channel Diplexer With High In-Band and Wideband Isolation

Authors: Chi, P., Shih, H., Yang, T.

Source: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 31(6):650-653 Jun, 2021

Multiskin Color Segmentation Through Morphological Model Refinement

Authors: Shih, H., Chen, J.

Source: IEEE Transactions on Emerging Topics in Computational Intelligence IEEE Trans. Emerg. Top. Comput. Intell. Emerging Topics in Computational Intelligence, IEEE Transactions on. 5(2):225-235 Apr, 2021

Real Time Environmental/Biological Monitoring System

Authors: Abu-El Humos, Ali, Shih, H., Hasan, M., Eldek, A.

Source: 2019 International Conference on Computational Science and Computational Intelligence (CSCI) CSCI Computational Science and Computational Intelligence (CSCI), 2019 International Conference on. :1179-1183 Dec, 2019

Relation: 2019 International Conference on Computational Science and Computational Intelligence (CSCI)

An Experimental Investigation Into Thin Silicon Die Strength Evaluation

Authors: Shih, H.-C., Tsai, F., Shih, M.-K., Tarng, D., Hung, C.P.

Source: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :187-190 Oct, 2019

Relation: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Extended Electrical and Photonic Characterization of GaN-Based Ultra-Violet MicroLEDs With an ITO Emission Window Layer

Authors: Tsai, Y., Huang, S., Huang, H., Yang, S., Liang, K., Kuo, W., Fang, Y., Wu, C., Wang, S., Shih, H., Xu, Z., Cho, M., Shen, S., Lin, C.

Source: IEEE Photonics Journal IEEE Photonics J. Photonics Journal, IEEE. 12(6):1-9 Dec, 2020

A Low-Power and Small Chip-Area Multi-Rate Human Body Communication DPFSK Transceiver for Wearable Devices

Authors: Shih, H., Chang, Y., Yang, C., Chen, C.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 67(7):1234-1238 Jul, 2020

High Speed Directly Modulated Fabry-Perot Lasers With an Ultra-Short Cavity Length

Authors: Tsai, Y., Wang, S., Huang, H., Shih, H., Lu, P., Lin, W., Lin, C.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 32(9):534-537 May, 2020

The effect of the COVID-19 pandemic on the diagnosis and progression of oral cancer

Authors: Cwintal, M., Shih, H., Idrissi Janati, A., Gigliotti, J.

Source: In International Journal of Oral & Maxillofacial Surgery August 2024 53(8):629-634

Image Classification Using Synchronized Rotation Local Ternary Pattern

Authors: Shih, H., Cheng, H., Fu, J.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 20(3):1656-1663 Feb, 2020

Write Margin Analysis of Spin–Orbit Torque Switching Using Field-Assisted Method

Authors: Tsou, Y., Chiu, J., Shih, H., Liu, C.W.

Source: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits IEEE J. Explor. Solid-State Comput. Devices Circuits Exploratory Solid-State Computational Devices and Circuits, IEEE Journal on. 5(2):173-181 Dec, 2019