Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing

Authors: Kiat Goh, Simon Chun, Hemanth Kumar, Cheemalamarri, Hu, Liangxing, Shervonne, Woon, Jaafar, Norhanani, Khoon Sherry, Yap Lee, Huang, Ding, Lau, Chit Siong, Kumar Karuppannan, Senthil, Li, Hongyu, Tan, Chuan Seng, Chui, King-Jien

Source: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :404-408 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)