Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling

Authors: Wunderle, B., Dermitzaki, E., Holck, O., Bauer, J., Walter, H., Shaik, Q., Ratzke, K., Faupel, F., Michel, B., Reichl, H.

Source: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1404-1413 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

Molecular dynamics simulation and mechanical characterisation for the establishment of structure-property correlations for epoxy resins in microelectronics packaging applications

Authors: Wunderle, B., Dermitzaki, E., Holck, O., Bauer, J., Walter, H., Shaik, Q., Ratzke, K., Faupel, F., Michel, B.

Source: EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 10th International Conference on. :1-11 Apr, 2009

Relation: 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Molecular dynamics approach to structure–property correlation in epoxy resins for thermo-mechanical lifetime modeling

Authors: Wunderle, B., Dermitzaki, E., Hölck, O., Bauer, J., Walter, H., Shaik, Q., Rätzke, K., Faupel, F., Michel, B., Reichl, H.

Source: In Microelectronics Reliability 2010 50(7):900-909