The ferrite-embedded drop-in circulator for millimeter wave communication systems

Authors: Okada, Y., Shimada, Y., Furuya, M., Myoh, O., Shimoto, T., Senba, N.

Source: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :188-192 2000

Relation: 2000 Proceedings. 50th Electronic Components and Technology Conference

Low cost multi-layer ceramic package for flip-chip MMIC up to W-band

Authors: Ito, M., Maruhashi, K., Ikuina, K., Senba, N., Takahashi, N., Ohata, K.

Source: 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) Microwave symposium Microwave Symposium Digest. 2000 IEEE MTT-S International. 1:57-60 vol.1 2000

Relation: 2000 IEEE MTT-S International Microwave Symposium Digest

New MCM composed of D/L base substrate, high-density-wiring CSP and 3D memory modules

Authors: Shibuya, A., Hazeyama, I., Shimoto, T., Takahashi, N., Senba, N., Kimura, M., Shimada, Y., Matsuzawa, H., Mori, F.

Source: 1997 Proceedings 47th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1997. Proceedings., 47th. :491-496 1997

Relation: 1997 Proceedings 47th Electronic Components and Technology Conference

3-dimensional memory module

Authors: Takahashi, N., Senba, N., Shimada, Y., Morizaki, I., Tokuno, K.

Source: 1996 Proceedings 46th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1996. Proceedings., 46th. :113-118 1996

Relation: 1996 Proceedings 46th Electronic Components and Technology Conference

A silicon-on-silicon packaging technology for advanced ULSI chips

Authors: Kousaka, T., Senba, N., Nishizawa, A., Takahashi, N., Shimoto, T., Koike, T.

Source: Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93) Electronic components and technology Electronic Components and Technology Conference, 1993. Proceedings., 43rd. :941-947 1993

Relation: Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93)

Three-dimensional memory module

Authors: Takahashi, N., Senba, N., Shimada, Y., Morisaki, I., Tokuno, K.

Source: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B IEEE Trans. Comp., Packag., Manufact. Technol. B Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on. 21(1):15-19 Feb, 1998

New dimensions in memory

Authors: Takahashi, N., Senba, N., Shimada, Y., Morizaki, H., Tokuno, K.

Source: IEEE Circuits and Devices Magazine IEEE Circuits Devices Mag. Circuits and Devices Magazine, IEEE. 13(3):24-26 May, 1997

Low-cost 60 GHz-band antenna-integrated transmitter/receiver modules utilizing multi-layer low-temperature co-fired ceramic technology

Authors: Maruhashi, K., Ito, M., Desclos, L., Ikuina, K., Senba, N., Takahashi, N., Ohata, K.

Source: 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.00CH37056) Solid-state circuits Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International. :324-325 2000

Relation: 2000 IEEE International Solid-State Circuits Conference. Digest of Technical Papers

Si-on-Si MCMs As a low cost packaging solution

Authors: Kusaka, T., Senba, N., Nishizawa, A., Takahashi, N.

Source: Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on. :13-0_16 1994

Relation: Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies

Syntheses and Magnetic Property of the Salts of Positively-Charged Verdazyl Radicals and TCNQF~4^- Anion Radical
Interdisciplinary symposium on multifunctionality of inorganic, organic, and their hybrid solids

Authors: Azuma, N., Senba, N., Okuda, K., Ohara, K., Hosokoshi, Y., Inoue, K., Mukai, K.

Source: MOLECULAR CRYSTALS AND LIQUID CRYSTALS. 376:341-346

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN046205030&indx=1&recIds=ETOCCN046205030

Hollow Packaging Technology Employing Photosensitive Adhesive Resins
Microelectronics

Authors: Funaya, T., Senba, N., Matsui, K.

Source: PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. :190-195

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN039077826&indx=1&recIds=ETOCCN039077826

Effect of a health education program on climacteric women

Authors: Senba, N., Matsuo, H.

Source: CLIMACTERIC -CARNFORTH-. 13(6):561-569

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN281422016&indx=1&recIds=ETOCRN281422016

Silicon-Carbon Unsaturated Compounds-76. Photochemical and Thermal Behavior of 1-Silacyclobut-3-enes Generated from the Reaction of Pivaloyltris(trimethylsilyl)-silane with tert-Butylacetylene

Authors: Naka, A., Senba, N., Motoike, S., Fujimoto, H., Miura, T., Kobayashi, H., Yoshizawa, K., Ishikawa, M.

Source: ORGANOMETALLICS. 28(19):5641-5646

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN259473377&indx=1&recIds=ETOCRN259473377

Silicon-Carbon Unsaturated Compounds. 74. Thermal Behavior of 1-Silacyclobut-3-enes Generated from the Reaction of Acylpolysilanes with tert-Butylacetylene

Authors: Naka, A., Motoike, S., Senba, N., Ohshita, J., Kunai, A., Yoshizawa, K., Ishikawa, M.

Source: ORGANOMETALLICS. 27(12):2750-2755

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN231470863&indx=1&recIds=ETOCRN231470863

Silicon-Carbon Unsaturated Compounds. 71. Thermolysis of 1,2-Bis(acyl)tetrakis(trimethylsilyl)disilane with Disubstituted Acetylenes

Authors: Ohshita, J., Ohnishi, H., Naka, A., Senba, N., Ikadai, J., Kunai, A., Kobayashi, H., Ishikawa, M.

Source: ORGANOMETALLICS. 25(16):3955-3962

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN192370745&indx=1&recIds=ETOCRN192370745

Molecular Paramagnetic Semiconductor: Crystal Structures and Magnetic and Conducting Properties of the Ni(dmit)~2 Salts of 6-Oxoverdazyl Radical Cations (dmit = 1,3-Dithiol-2-thione-4,5-dithiolate)

Authors: Mukai, K., Senba, N., Hatanaka, T., Minakuchi, H., Ohara, K., Taniguchi, M., Misaki, Y., Hosokoshi, Y., Inoue, K., Azuma, N.

Source: INORGANIC CHEMISTRY. 43(2):566-576

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN144187221&indx=1&recIds=ETOCRN144187221

Perspective on Ash Recycle

Authors: Okuno, S., Honda, H., Senba, N.

Source: MITSUBISHI JUKO GIHO. 39(5):258-261

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN124255557&indx=1&recIds=ETOCRN124255557

Magnetic Semiconductor: Structural, Magnetic, and Conducting Properties of the Salts of the 6-Oxoverdazyl Radical Cation with M(dmit)~2 Anions (M = Ni, Zn, Pd, and Pt, dmit = 1,3-dithiol-2-thione-4,5-dithiolate)

Authors: Mukai, K., Hatanaka, T., Senba, N., Nakayashiki, T., Misaki, Y., Tanaka, K., Ueda, K., Sugimoto, T., Azuma, N.

Source: INORGANIC CHEMISTRY. 41(20):5066-5074

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN120487206&indx=1&recIds=ETOCRN120487206

Application of MSW (Municipal Solid Waste) Incinerator Residue Melting Furnace by Electric Arc Plasma
Technology for Global Environment

Authors: Nishikawa, S., Senba, N., Noma, A., Yasuda, S., Kawami, Y.

Source: MITSUBISHI JUKO GIHO. 36(3):122-125

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN068680013&indx=1&recIds=ETOCRN068680013

Using Thermal Stress Simulation to Estimate Stacked memory Module Reliability Under Thermal Cycle test
High Density Packaging and MCMs

Authors: Kitajo, S., Senba, N., Hashimoto, K., Ebihara, N., Ohkawa, S.

Source: PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. (E 3830):414-419

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN067001084&indx=1&recIds=ETOCRN067001084