Surface-modification technology by using Radical Shower Treatment (RST) process in submicron interposer for Fan-out packaging applications

Authors: Murayama, Takahide, Sakuishi, Toshiyuki, Morikawa, Yasuhiro

Source: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :246-250 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

Wafer level 3D stacked technology solution for future IoT devices

Authors: Murayama, Takahide, Sakuishi, Toshiyuki, Suzuki, Akiyoshi, Morikawa, Yasuhiro

Source: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :23-26 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

Highly accurate wiring fabrication technologies by plasma dry processes for 3D-IC and fan-out packaging

Authors: Morikawa, Yasuhiro, Murayama, Takahide, Sakuishi, Toshiyuki, Sato, Muneyuki, Suzuki, Akiyoshi, Suu, Koukou

Source: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2018. :1-6 Feb, 2018

Relation: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific)

Micro thin-film li-ion battery stacking challenge by backside via last TSV technology

Authors: Murayama, Takahide, Suzuki, Akiyoshi, Sakuishi, Toshiyuki, Morikawa, Yasuhiro

Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :183-186 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

High-density via fabrication technology solution for heterogeneous integration

Authors: Morikawa, Yasuhiro, Murayama, Takahide, Sakuishi, Toshiyuki, Sato, Muneyuki, Suzuki, Akiyoshi

Source: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific) Microelectronics Symposium (Pan Pacific), 2017 Pan Pacific. :1-6 Feb, 2017

Relation: 2017 Pan Pacific Microelectronics Symposium (Pan Pacific)

Novel WLCSP technology solution for fusion device of CMOS integrated circuit with MEMS

Authors: Murayama, Takahide, Sakuishi, Toshiyuki, Morikawa, Yasuhiro

Source: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :554-559 Nov, 2016

Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Novel ICP Plasma Etching for Backside TSV

Authors: Sakuishi, Toshiyuki, Murayama, Takahide, Morikawa, Yasuhiro

Source: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-3 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Advantage of direct etching method and process integration for TSV reliability

Authors: Sakuishi, Toshiyuki, Murayama, Takahiro, Morikawa, Yasuhiro

Source: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :69-73 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

High aspect ratio TSV etching process for high-capacitor

Authors: Murayama, Takahide, Sakuishi, Toshiyuki, Morikawa, Yasuhiro, Tani, Noriaki, Saitou, Kazuya

Source: IEEE CPMT Symposium Japan 2014 CPMT Symposium Japan (ICSJ), 2014 IEEE. :150-153 Nov, 2014

Relation: 2014 IEEE CPMT Symposium Japan (ICSJ)

Low cost TSV integration for advanced packaging technologies

Authors: Morikawa, Yasuhiro, Murayama, Takahide, Sakuishi, Toshiyuki, Tanaka, Ai, Nakamuta, Yuu, Suu, Koukou

Source: 2012 2nd IEEE CPMT Symposium Japan CPMT Symposium Japan, 2012 2nd IEEE. :1-4 Dec, 2012

Relation: 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

A novel scallop free TSV etching method in magnetic neutral loop discharge plasma

Authors: Morikawa, Yasuhiro, Murayama, Takahide, Sakuishi, Toshiyuki, Yoshii, Manabu, Suu, Koukou

Source: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :794-795 May, 2012

Relation: 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC)

Highly Accurate of Via (Blind via hole) Fabrication Technology for Advanced High Density Packaging

Authors: Morikawa, Yasuhiro, Sato, Muneyuki, Murayama, Takahide, Sakuishi, Toshiyuki, Fujinaga, Tetsushi

Source: Erekutoronikusu Jisso Gakkaishi. 21(3):190-192

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN616401669&indx=1&recIds=ETOCRN616401669