EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks

Authors: Jin, Wentian, Chen, Liang, Sadiqbatcha, Sheriff, Peng, Shaoyi, Tan, Sheldon X.-D.

Source: 2021 58th ACM/IEEE Design Automation Conference (DAC) Design Automation Conference (DAC), 2021 58th ACM/IEEE. :919-924 Dec, 2021

Relation: 2021 58th ACM/IEEE Design Automation Conference (DAC)

HAT-DRL: Hotspot-Aware Task Mapping for Lifetime Improvement of Multicore System using Deep Reinforcement Learning

Authors: Zhang, Jinwei, Sadiqbatcha, Sheriff, Gao, Yuanqi, O'Dea, Michael, Yu, Nanpeng, Tan, Sheldon X.-D.

Source: 2020 ACM/IEEE 2nd Workshop on Machine Learning for CAD (MLCAD) Machine Learning for CAD (MLCAD), 2020 ACM/IEEE 2nd Workshop on. :77-81 Nov, 2020

Relation: 2020 ACM/IEEE 2nd Workshop on Machine Learning for CAD (MLCAD)

Full-Chip Thermal Map Estimation for Commercial Multi-Core CPUs with Generative Adversarial Learning

Authors: Jin, Wentian, Sadiqbatcha, Sheriff, Zhang, Jinwei, Tan, Sheldon X.-D.

Source: 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2020 IEEE/ACM International Conference. :1-9 Nov, 2020

Relation: 2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD)

EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects

Authors: Jin, Wentian, Sadiqbatcha, Sheriff, Sun, Zeyu, Zhou, Han, Tan, Sheldon X.-D.

Source: 2020 IEEE 38th International Conference on Computer Design (ICCD) ICCD Conference on Computer Design (ICCD), 2020 IEEE 38th International. :296-303 Oct, 2020

Relation: 2020 IEEE 38th International Conference on Computer Design (ICCD)

Accurate Power Density Map Estimation for Commercial Multi-Core Microprocessors

Authors: Zhang, Jinwei, Sadiqbatcha, Sheriff, Jin, Wentian, Tan, Sheldon X.-D.

Source: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE). :1085-1090 Mar, 2020

Relation: 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Machine Learning Based Online Full-Chip Heatmap Estimation

Authors: Sadiqbatcha, Sheriff, Zhao, Yue, Zhang, Jinwei, Amrouch, Hussam, Henkel, Jorg, Tan, Sheldon X.-D.

Source: 2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2020 25th Asia and South Pacific. :229-234 Jan, 2020

Relation: 2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)

Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging

Authors: Sadiqbatcha, Sheriff, Zhao, Hengyang, Amrouch, Hussam, Henkel, Jorg, Tan, Sheldon X.-D.

Source: 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2019. :48-53 Mar, 2019

Relation: 2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires

Authors: Sadiqbatcha, Sheriff, Cook, Chase, Sun, Zeyu, Tan, Sheldon X.-D.

Source: 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2018 15th International Conference on. :21-24 Jul, 2018

Relation: 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)

Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models

Authors: Cook, Chase, Sadiqbatcha, Sheriff, Sun, Zeyu, Tan, Sheldon X.-D.

Source: 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2018 15th International Conference on. :5-8 Jul, 2018

Relation: 2018 15th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)

Accelerating electromigration aging for fast failure detection for nanometer ICs

Authors: Sun, Zeyu, Sadiqbatcha, Sheriff, Zhao, Hengyang, Tan, Sheldon X.-D.

Source: 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC) Design Automation Conference (ASP-DAC), 2018 23rd Asia and South Pacific. :623-630 Jan, 2018

Relation: 2018 23rd Asia and South Pacific Design Automation Conference (ASP-DAC)

Particle swarm optimization for solving a class of type-1 and type-2 fuzzy nonlinear equations

Authors: Sadiqbatcha, Sheriff, Jafarzadeh, Saeed, Ampatzidis, Yiannis

Source: 2017 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) Fuzzy Systems (FUZZ-IEEE), 2017 IEEE International Conference on. :1-5 Jul, 2017

Relation: 2017 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE)

EM-GAN: Fast Stress Analysis for Multi-Segment Interconnect Using Generative Adversarial Networks

Authors: Jin, Wentian, Sadiqbatcha, Sheriff, Zhang, Jinwei, Tan, Sheldon X. -D.

Subject Terms: Computer Science - Machine Learning, Computer Science - Neural and Evolutionary Computing, Electrical Engineering and Systems Science - Image and Video Processing, Statistics - Machine Learning

Access URL: http://arxiv.org/abs/2004.13181

Fuzzified DC power flow analysis

Authors: Sadiqbatcha, Sheriff, Jafarzadeh, Saeed

Source: 2016 North American Power Symposium (NAPS) North American Power Symposium (NAPS), 2016. :1-6 Sep, 2016

Relation: 2016 North American Power Symposium (NAPS)

An analytical approach for solving type-1 and type-2 fully fuzzy linear systems of equations

Authors: Sadiqbatcha, Sheriff, Jafarzadeh, Saeed

Source: 2016 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) Fuzzy Systems (FUZZ-IEEE), 2016 IEEE International Conference on. :453-460 Jul, 2016

Relation: 2016 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE)

Hot-spot aware thermoelectric array based cooling for multicore processors

Authors: Zhang, Jinwei, Sadiqbatcha, Sheriff, Chen, Liang, Thi, Cuong, Sachdeva, Sachin, Amrouch, Hussam, Tan, Sheldon X.-D.

Source: In Integration March 2023 89:73-82

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Reliability based hardware Trojan design using physics-based electromigration models

Authors: Cook, Chase, Sadiqbatcha, Sheriff, Sun, Zeyu, Tan, Sheldon X.-D.

Source: In Integration May 2019 66:9-15

Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach.

Authors: Chen, Liang¹, Sadiqbatcha, Sheriff¹, Amrouch, Hussam² amrouch@iti.uni-stuttgart.de, Tan, Sheldon X.-D.¹ stan@ece.ucr.edu

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Sep2022, Vol. 41 Issue 9, p3066-3077. 12p.

Subject Terms: *Finite element method, Thermoelectric cooling, Heat conduction, Partial differential equations, Packaging design

Real-Time Full-Chip Thermal Tracking: A Post-Silicon, Machine Learning Perspective.

Authors: Sadiqbatcha, Sheriff¹ (AUTHOR) ssadi003@ucr.edu, Zhang, Jinwei¹ (AUTHOR) jzhan319@ucr.edu, Amrouch, Hussam² (AUTHOR) amrouch@iti.uni-stuttgart.de, Tan, Sheldon X.-D.¹ (AUTHOR) stan@ece.ucr.edu

Source: IEEE Transactions on Computers. Jun2022, Vol. 71 Issue 6, p1411-1424. 14p.

Subject Terms: Machine learning, Infrared imaging, Thermography, Temperature sensors, Construction cost estimates, Microprocessors, Artificial satellite tracking

Full-Chip Power Density and Thermal Map Characterization for Commercial Microprocessors Under Heat Sink Cooling.

Authors: Zhang, Jinwei¹ jzhan319@ucr.edu, Sadiqbatcha, Sheriff¹, O'Dea, Michael¹, Amrouch, Hussam², Tan, Sheldon X.-D.¹

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. May2022, Vol. 41 Issue 5, p1453-1466. 14p.

Subject Terms: Heat sinks, Power density, Multicore processors, Microprocessors, Cooling, Thermography, Thermal conductivity

Company/Entity: Intel Corp. 047897855 INTC