Novel Design Strategy for High-Endurance $(> 10^{10})$ and Fast-Erase Oxide-Semiconductor Channel FeFET

Authors: Chen, Zhuo, Kim, Hyun-Cheol, Zheng, Wei, Izmailov, Roman, Truijen, Brecht, Subhechha, Subhali, Walke, Amey M., Chasin, Adrian, Popovici, Mihaela I., Li, Jie, Kruv, Anastasiia, Tang, Hongwei, Xi, Fengben, Van den Bosch, Geert, Rosmeulen, Maarten, Ronchi, Nicolo, Afanas'ev, Valeri, Van Houdt, Jan

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

Novel High Density 3D Buffer Memory Enabled by IGZO Channel Charge Coupled Device

Authors: Kishore, Rishabh, Mahato, Swaraj Bandhu, Subhechha, Subhali, Lee, Jiwon, Bonne, Ruben, Wan, Yiqun, Rassoul, Nouredine, Rachidi, Sana, Li, Jie, Jiang, Yuchao, Wang, Bowen, Belmonte, Attilio, Kar, Gouri Sankar, Rosmeulen, Maarten

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

Three-dimensional Optical Reconstruction of colloidal electrokinetics via multiplane imaging

Authors: de Jong, Flip, Diez-Silva, Pablo, Chen, Jui-Kai, Pérez-Peláez, Raúl, Seth, Sudipta, Balakrishnan, Harishankar, Shih, Bing-Yang, Rosmeulen, Maarten, Nonell, Santi, Rocha, Susana, Klymchenko, Andrey, Liz-Marzán, Luis, Bresolí-Obach, Roger, Marqués, Manuel I., Buscalioni, Rafael Delgado, Hofkens, Johan, Louis, Boris

Subject Terms: Condensed Matter - Soft Condensed Matter, 70-05(primary), 76-05(primary), 78-05(primary)

Access URL: http://arxiv.org/abs/2503.23839

Modeling the Operation of Charge Trap Flash Memory: A Monte Carlo Approach to Carrier Distribution and (De)trapping

Authors: Hellemans, Thomas, Verreck, Devin, Arreghini, Antonio, Van den Bosch, Geert, Rosmeulen, Maarten, Houssa, Michel, Van Houdt, Jan

Source: 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2024 International Conference on. :01-04 Sep, 2024

Relation: 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

Understanding the Time Dependent Write and Read Performance of IGZO-channel FeFETs

Authors: Chen, Zhuo, Ronchi, Nicolo, Banerjee, Kaustuv, Izmailov, Roman, Walke, Amey M., Popovici, Mihaela I., Dekkers, Harold, Pavel, Alexandru, Van Den Bosch, Geert, Rosmeulen, Maarten, Afanas'Ev, Valeri, Van Houdt, Jan

Source: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC) Solid-State Electronics Research Conference (ESSERC), 2024 IEEE European. :661-664 Sep, 2024

Relation: 2024 IEEE European Solid-State Electronics Research Conference (ESSERC)

Improved MW of IGZO-channel FeFET by Reading Scheme Optimization and Interfacial Engineering

Authors: Chen, Zhuo, Ronchi, Nicolo, Walke, Amey, Banerjee, Kaustuv, Popovici, Mihaela Ioana, Katcko, Kostantine, Van Den Bosch, Geert, Rosmeulen, Maarten, Afanas'Ev, Valeri, Van Houdt, Jan

Source: 2023 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2023 IEEE International. :1-4 May, 2023

Relation: 2023 IEEE International Memory Workshop (IMW)

Modeling of in-plane distortions and overlay errors encountered during 3-D NAND flash device fabrication

Authors: Okudur, Oguzhan Orkut, Gonzalez, Mario, Van Den Bosch, Geert, Rosmeulen, Maarten

Source: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-5 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

A DTCO Framework for 3D NAND Flash Readout

Authors: Gerardi, Mattia, Sharma, Arvind, Xiang, Yang, Kaczmarek, Jakub, Redondo, Fernando Garcia, Rosmeulen, Maarten, Bardon, Marie Garcia

Source: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2024. :1-2 Mar, 2024

Relation: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE)

Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication

Authors: Okudur, Oguzhan Orkut, Gonzalez, Mario, Van den bosch, Geert, Rosmeulen, Maarten

Source: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

Not only dielectrophoresis: The crucial role of electrokinetic phenomena in a dielectric particle’s response to an oscillating electric field

Authors: Shih, Bing-Yang ^{a, b}, Fransen, Senne ^{a, ⁎}, Valvo, Edmondo ^{a, c}, Willems, Kherim ^a, Van Roy, Willem ^a, Van Dorpe, Pol ^{a, b}, Rosmeulen, Maarten ^a

Source: In Journal of Electrostatics January 2025 133

Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication

Authors: Okudur, Oguzhan Orkut, Gonzalez, Mario, Van den Bosch, Geert, Rosmeulen, Maarten

Source: In Microelectronics Reliability June 2023 145

Substrate transfer for GaN-based LEDs on 200mm Si

Authors: Pham, Ngao P., Rosmeulen, Maarten, Li, Zilan, Sabuncuoglu, Deniz, Osman, Haris

Source: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th. :324-328 Dec, 2013

Relation: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

Gan-on-Si process defect detection and analysis for HB-LEDs and power devices

Authors: Halder, Sandip, Stiers, Karen, Kandaswamy, Prem Kumar, Rosmeulen, Maarten, Carbonell, Laureen, Saripalli, Yoga, Osman, Haris, Rosseel, Erik, Mani, Antonio, Hu, Qiona, Vedula, Srinivas, Polli, Marco

Source: ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI. :371-374 May, 2013

Relation: 2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Effects of Geometry and Cycling on the Radiation Response of Charge-Trapping NAND Memory Devices With SiON Tunneling Oxide

Authors: Cao, Jingchen, Wynocker, Isabella, Zhang, En Xia, Reed, Robert A., Alles, Michael L., Schrimpf, Ronald D., Fleetwood, Daniel M., Arreghini, Antonio, Rosmeulen, Maarten, Bastos, Joao P., Bosch, Geert Van den, Linten, Dimitri

Source: IEEE transactions on nuclear science. 70(4):634-640

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100179778541.0x000001&indx=1&recIds=ETOCvdc_100179778541.0x000001

Electrolithic Memory: A New Device for Ultrahigh-Density Data Storage

Authors: Fransen, Senne, Willems, Kherim, Philipsen, Harold, Verreck, Devin, Van Roy, Willem, Henry, Olivier Y. F., Arreghini, Antonio, Van den bosch, Geert, Furnemont, Arnaud, Rosmeulen, Maarten

Source: IEEE transactions on electron devices. 69(5):2377-2383

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100147939407.0x000001&indx=1&recIds=ETOCvdc_100147939407.0x000001

Total-Ionizing-Dose Effects on Polycrystalline-Si Channel Vertical-Charge-Trapping Nand Devices

Authors: Cao, Jingchen, Wang, Peng Fei, Li, Xun, Guo, Zixiang, Zhang, En Xia, Reed, Robert A., Alles, Michael L., Schrimpf, Ronald D., Fleetwood, Daniel M., Arreghini, Antonio, Rosmeulen, Maarten, Bastos, Joao P., Bosch, Geert Van den, Linten, Dimitri

Source: IEEE transactions on nuclear science. 69(3):314-320

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100144071660.0x000001&indx=1&recIds=ETOCvdc_100144071660.0x000001

Stress and wafer warpage analysis of GaN thin film induced by transfer bonding process on 200mm Si substrate

Authors: Lofrano, Melina, Pham, Nga, Rosmeulen, Maarten, Soussan, Philippe

Source: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013 14th International Conference on. :1-5 Apr, 2013

Relation: 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Wafer bow of substrate transfer process for GaNLED on Si 8 inch

Authors: Pham, Nga P., Rosmeulen, Maarten, Bryce, George, Tezcan, Deniz S., Majeed, B., Osman, Haris

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :202-205 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

An Ultra-Thin Hybrid Floating Gate Concept for Sub-20nm NAND Flash Technologies

Authors: Wellekens, Dirk, Blomme, Pieter, Rosmeulen, Maarten, Schram, Tom, Cacciato, Antonio, Debusschere, Ingrid, Van Aerde, Steven, Van Houdt, Jan

Source: 2011 3rd IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2011 3rd IEEE International. :1-4 May, 2011

Relation: 2011 3rd IEEE International Memory Workshop (IMW)

Impact of Mechanical Stress on 3-D NAND Flash Current Conduction

Authors: Kruv, Anastasiia, Arreghini, Antonio, Verreck, Devin, Gonzalez, Mario, Van den bosch, Geert, De Wolf, Ingrid, Rosmeulen, Maarten

Source: IEEE transactions on electron devices. 67(11):4891-4896

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100108986959.0x000001&indx=1&recIds=ETOCvdc_100108986959.0x000001