Molecular Direct Bonding and Transfer of 2D MoS2 Layer over a Full 200 mm Silicon Wafer

Authors: Fournel, F., Cadot, S., Rolland, E., Le Van-Jodin, L., Brunet, P., Meyer, T., Pinchart, C.

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

SmartSiC™ for Manufacturing of SiC Power Devices

Authors: Daval, N., Drouin, A., Biard, H., Viravaux, L., Radisson, D., Rouchier, S., Gaudin, G., Widiez, J., Allibert, F., Rolland, E., Vladimirova, K., Gelineau, G., Troutot, N., Navone, C., Berre, G., Bosch, D., Leow, Y.L, Duboust, A., Bethoux, J-M., Boulet, R., Chapelle, A., Cela, E., Lavaitte, G., Bouville-Lallart, A., Bhargava, S., Schwarzenbach, W., Maddalon, C., Radu, I., Odoul, S., Delprat, D., Bonnin, O., Maleville, C.

Source: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :85-87 Mar, 2022

Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

Engineered SiC materials for power technologies

Authors: Schwarzenbach, W., Rouchier, S., Berre, G., Boulet, R., Ledoux, O., Cela, E., Drouin, A., Chapelle, A., Monnoye, S., Biard, H., Alassaad, K., Viravaux, L., Mohamed, N. Ben, Radisson, D., Picun, G., Lavaitte, G., Bouville-Lallart, A., Roi, J., Widiez, J., Abadie, K., Rolland, E., Fournel, F., Gelineau, G., Mazen, F., Moulin, A., Moulin, C., Delprat, D., Daval, N., Odoul, S., Sandri, P., Maleville, C.

Source: 2022 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2022 International Conference on. :55-56 Sep, 2022

Relation: 2022 International Conference on IC Design and Technology (ICICDT)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Authors: Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.

Source: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-5 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

Influence of Substrate Resistivity on Porous Silicon Small-Signal RF Properties

Authors: Godet, G., Augendre, E., Lugo-Alvarez, J., Jacquinot, H., Gaillard, F.X., Lorne, T., Rolland, E., Taris, T., Servant, F.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(11):4654-4657 Nov, 2020

Record Performance of 500°C Low-Temperature nMOSFETs for 3D Sequential Integration using a Smart CutTM Layer Transfer Module

Authors: Brunet, L., Reboh, S., Januel, T., Garros, X., Frutuoso, T. Mota, Casse, M., Sklenard, B., Brevard, L., Ribotta, M., Magalhaes-Lucas, A., Kanyandekwe, J., Hartmann, J.-M., Milesi, F., Mazen, F., Acosta-Alba, P., Kerdiles, S., Tavernier, A., Loup, V., Morales, C., Larrey, V., Fournel, F., Van-Jodin, L. Le, Leforestier, S., Rolland, E., Romano, G., Gaudin, G., Lugo, J., Lacord, J., Maitrejean, S., Arcamone, J., Batude, P., Radu, I., Fenouillet-Beranger, C., Andrieu, F.

Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

150 mm SiC Engineered Substrates for High-Voltage Power Devices
European conference on silicon carbide and related materials

Authors: Rouchier, S., Gaudin, G., Widiez, J., Allibert, F., Rolland, E., Vladimirova, K., Gélineau, G., Troutot, N., Navone, C., Berre, G.

Source: Materials science forum. 1062:131-135

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607653778&indx=1&recIds=ETOCCN607653778

Evaluation of Crystal Quality and Dopant Activation of Smart Cut™ - Transferred 4H-SiC Thin Film

Authors: Gelineau, G., Widiez, J., Rolland, E., Vladimirova, K., Moulin, A., Prudkovskiy, V., Troutot, N., Gergaud, P., Mariolle, D., Barbet, S.

Source: Materials science forum. 1089:71-80

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN632587002&indx=1&recIds=ETOCRN632587002

Innovative Solutions for the Nanoscale Packaging of Silicon-Based and Biological Nanowires: Development of a Generic Characterization and Integration Platform

Authors: Thuaire, A., Reynaud, P., Brun, C., Sordes, D., Carmignani, C., Rolland, E., Baillin, X., Cheramy, S., Poupon, G.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 6(12):1804-1814 Dec, 2016

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding

Authors: Beilliard, Y., Moreau, S., Di Cioccio, L., Coudrain, P., Romano, G., Nowodzinski, A., Aussenac, F., Jouneau, P.-H., Rolland, E., Signamarcheix, T.

Source: 2014 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2014 International. :1-8 Dec, 2014

Relation: 2014 International 3D Systems Integration Conference (3DIC)

COVID-19 : expériences, aspects organisationnels et éthiques dans un établissement de soins pour personnes polyhandicapées et multihandicapées

Alternate Title: Covid-19: Organizational measures and ethical questions in rehabilitation center for persons with severe handicap and disability (English)

Authors: Grimont-Rolland, E.

Source: In Ethique et Santé December 2022 19(4):210-216

Die to wafer direct bonding: from fundamental mechanisms to optoelectronic and 3D applications

Authors: Fournel, F., Sanchez, L., Montmayeul, B., Castan, C., Laugier, M., Bally, L., Larrey, V., Mauguen, G., Cheramy, S., Jouve, A., Rolland, E., Morales, C., Szelag, B., Hassan, K., Adelimini, L., Rieutord, F.

Source: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2019 6th International Workshop on. :16-16 May, 2019

Relation: 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

WSS and ZoneBOND temporary bonding techniques comparison for 80μm and 55μm functional interposer creation

Authors: Jouve, A., Vial, K., Rolland, E., Coudrain, P., Aumont, C., Laviron, C., Fournel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Donche, C., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Cheramy, S., Sillon, N.

Source: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :101-106 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

Challenges and solutions for ultra-thin (50 μm) silicon using innovative ZoneBOND™ process

Authors: Vial, K., Jouve, A., Rolland, E., Coudrain, P., Aumont, C., Foumel, F., Pellat, M., Montmeat, P., Allouti, N., Eleouet, R., Argoud, M., Dechamp, J., Bally, L., Vignoud, L., Hida, R., Ratin, C., Magis, T., Loup, V., Kachtouli, R., Gabette, L., Mourier, T., Laviron, C., Cheramy, S., Sillon, N.

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :445-450 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

PENGARUH PEMBELAJARAN KEWIRAUSAHAAN, SIKAP KEWIRAUSAHAAN, DAN MOTIVASI KEWIRAUSAHAAN TERHADAP MINAT BERWIRAUSAHA

Authors: Maria Prilia Karibera, Rolland E Fanggidae, Ni Putu Nursiani, Alexandre Desousa Guterres

Source: Journal of Management Small and Medium Enterprises (SME's), Vol 16, Iss 1 (2023)

Subject Terms: Business, HF5001-6182

File Description: electronic resource

Relation: https://ejurnal.undana.ac.id/index.php/JEM/article/view/9710; https://doaj.org/toc/2502-2385; https://doaj.org/toc/2723-469X

Access URL: https://doaj.org/article/520c69e13fd34e329b3d00607bf27db1

Improvement of polymorphous/crystalline heterojunction solar cells using low temperature screen-printed pastes

Authors: Veschetti, Y., Muller, J.-C., Damon-Lacoste, J., Roca i Cabarrocas, P., Gudovskikh, A.S., Kleider, J.-P., Ribeyron, P.-J., Rolland, E.

Source: Conference Record of the Thirty-first IEEE Photovoltaic Specialists Conference, 2005. Photovoltaic Specialists Conference Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE. :1131-1134 2005

Relation: Conference Record of the Thirty-First IEEE Photovoltaic Specialists Conference

Microwave measurements of the complex permittivity of construction materials using Fresnel reflection coefficients and reflection ellipsometry

Authors: Sagnard, F., Vignat, C., Montcourtois, V., Rolland, E.

Source: IEEE Antennas and Propagation Society International Symposium. 2001 Digest. Held in conjunction with: USNC/URSI National Radio Science Meeting (Cat. No.01CH37229) Antennas and Propagation - APS 2001 Antennas and Propagation Society International Symposium, 2001. IEEE. 1:626-629 vol.1 2001

Relation: IEEE Antennas and Propagation Society International Symposium. 2001 Digest

PENGARUH KECERDASAN EMOSIONAL DAN KECERDASAN SPIRITUAL TERHADAP KINERJA KARYAWAN PADA KANTOR PUSAT BANK PEMBANGUNAN DAERAH NTT

Authors: Cindy Claudia F M Djara, Rolland E Fanggidae, Ni Putu Nursiani

Source: Journal of Management Small and Medium Enterprises (SME's), Vol 11, Iss 1 Mar (2020)

Subject Terms: Business, HF5001-6182

File Description: electronic resource

Relation: https://ejurnal.undana.ac.id/index.php/JEM/article/view/2322; https://doaj.org/toc/2502-2385; https://doaj.org/toc/2723-469X

Access URL: https://doaj.org/article/d2f48b3d87c0405ebd2b6176b9c9e89c

PENGARUH REWARD TERHADAP KEPUASAN KERJA KARYAWAN DI PDAM TIRTA LONTAR KABUPATEN KUPANG

Authors: Ephivania Eunike Foenay, Rolland E Fanggidae, Wehelmina Mariana Ndoen

Source: Journal of Management Small and Medium Enterprises (SME's), Vol 11, Iss 1 Mar (2020)

Subject Terms: Business, HF5001-6182

File Description: electronic resource

Relation: https://ejurnal.undana.ac.id/index.php/JEM/article/view/2320; https://doaj.org/toc/2502-2385; https://doaj.org/toc/2723-469X

Access URL: https://doaj.org/article/12dd9d3cfb70431ca077cdf93aef49f7

Lésions musculaires : l’approche échographique

Authors: Brasseur, J.-L., Renoux, J., Crema, M.D., Mercy, G., Monzani, Q., Coquart, B., Massein, A., Rolland, E.

Source: In Journal de Radiologie diagnostique et interventionnelle December 2017 98(6):252-266