A Method for Die-level Fracture Toughness Evaluation by Nano-Indentation on Ring

Authors: Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Mo, Zhi Qiang

Source: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2024 IEEE 26th. :966-969 Dec, 2024

Relation: 2024 IEEE 26th Electronics Packaging Technology Conference (EPTC)

Impact of High Temperature Storage for Prolonged Duration on Cu Leadframe Material Properties for Automotive Applications

Authors: Zhu, Xintong, Rajoo, Ranjan, Yip, Kim Hong, Ang, Poh Chuan, Nistala, Ramesh Rao, Mo, Zhi Qiang

Source: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1030-1036 Dec, 2023

Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

Comparison of Mechanical Properties of Nickel-Palladium Plated and Tin-Plated Copper Leadframe Material at Elevated Temperatures

Authors: Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Mo, Zhi Qiang

Source: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :753-758 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

Dicing Blade Characterization Using Nano-indentation

Authors: Zhu, Xintong, Rajoo, Ranjan, Nistala, Ramesh Rao, Chan, Kai Chong, Mo, Zhi Qiang

Source: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :144-147 Dec, 2021

Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

Enabling fine pitch Cu & Ag alloy wire bond assessment for 28nm ultra low-k structure

Authors: Beleran, John D., Milanes, Ninoy, Mehta, Gaurav, Suthiwongsunthorn, Nathapong, Rajoo, Ranjan, Chong, Chan Kai

Source: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :490-497 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Study on low-cost QFN packages for high-frequency applications

Authors: Zheng, Boyu, Cubillo, Joseph Romen, Katti, Guruprasad, Jin, Cheng, Rajoo, Ranjan, Chan, Kai Chong

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :401-406 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications

Authors: Zhang, Xiaowu, Rajoo, Ranjan, Che, F. X., Selvanayagam, C. S., Choi, W. K., Gao, Shan, Lo, G. Q., Kwong, D.-L.

Source: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-5 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Moisture characteristics of wafer level compression molding compounds

Authors: Rajoo, Ranjan, Xiaowu Zhang

Source: 2011 IEEE 13th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th. :147-152 Dec, 2011

Relation: 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011)

Application of piezoresistive stress sensor in wafer bumping and drop impact test of embedded ultra thin device

Authors: Zhang, Xiaowu, Rajoo, Ranjan, Selvanayagam, Cheryl S., Kumar, Aditya, Rao, Vempati Srinivasa, Khan, Navas, Kripesh, V., Lau, John H., Kwong, D.-L., Sundaram, V., Tummula, Rao R.

Source: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1276-1282 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package

Authors: Che, F. X., Chai, T. C., Lim, Sharon P. S., Rajoo, Ranjan, Zhang, Xiaowu

Source: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1428-1435 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Embedding of 15um thin chip and passives in thin flexible substrate

Authors: Rajoo, Ranjan, Lim, Y.Y, Chong, S.C, Paing, Myo, Moses, Fernandez Daniel, Justin See Toh Wai Hong, Sekhar, Vasarla Nagendra, Soon Wee Ho, Thew, Serene, Justin Wee Kim Soon, Xiaowu Zhang

Source: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :489-496 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

Reliability and failure analysis study of multi-die embedded micro wafer level packages

Authors: Sekhar, V. N., Rao, V. S., Sharma, Gaurav, Rajoo, Ranjan, Serene Thew Mei Ling, Khong Chee Houe, Chong Ser Choong, Cheng Cheng Kuo

Source: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :668-672 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance

Authors: Lim, Ying Ying, Rajoo, Ranjan, Chong, Ser Choong

Source: 2010 12th Electronics Packaging Technology Conference Electronics Packaging Technology Conference (EPTC), 2010 12th. :681-686 Dec, 2010

Relation: 2010 12th Electronics Packaging Technology Conference - (EPTC 2010)

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Authors: Sharma, Gaurav, Rao, Vempati Srinivas, Kumar, Aditya, Su, Nandar, Ying, Lim Ying, Houe, Khong Chee, Lim, Sharon, Sekhar, Vasarla Nagendra, Rajoo, Ranjan, Kripesh, Vaidyanathan, Lau, John H.

Source: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :1537-1543 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

A self-contained disposable cartridge microsystem for dengue viral ribonucleic acid extraction

Authors: Zhang, Li, Rafei, Siti Mohamed, Xie, Ling, Chew, Michelle Bi-Rong, Ji, Hong Miao, Chen, Yu, Rajoo, Ranjan, Ong, Kian-Leong, Tan, Rosemary, Lau, Suk-Hiang, Chow, Vincent T.K., Heng, Chew-Kiat, Teo, Keng-Hwa, Kang, Tae Goo

Source: In Sensors & Actuators: B. Chemical 2011 160(1):1557-1564

METHOD FOR FORMING AND RELEASING INTERCONNECTS

Micro-impact testing apparatus

Bend testing apparatus and method of carrying out the same

Micro-Impact Testing Apparatus

Bend testing apparatus and method of carrying out the same