Showing 1 - 20 results of 2,871 Refine Results
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    Academic Journal

    Source: IEEE Transactions on Signal Processing IEEE Trans. Signal Process. Signal Processing, IEEE Transactions on. 68:6380-6393 2020

    Linked Full Text
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    Book

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    Conference

    Source: 2004 IEEE Aerospace Conference Proceedings (IEEE Cat. No.04TH8720) Aerospace conference Aerospace Conference, 2004. Proceedings. 2004 IEEE. 2:954-965 Vol.2 2004

    Relation: 2004 IEEE Aerospace Conference Proceedings

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    Academic Journal

    Authors: Porter, C. D. (ORCID 0000-0002-9104-2390), Heckler, A. F. (ORCID 0000-0001-5494-7855)

    Source: Physical Review Physics Education Research. Jul-Dec 2020 16(2).

    Peer Reviewed: Y

    Page Count: 12

    Sponsoring Agency: National Science Foundation (NSF), Division of Materials Research (DMR)

  10. 10
    Conference

    Source: 11th IEEE International Conference on Advanced Thermal Processing of Semiconductors. RTP 2003 Advanced thermal processing of semiconductors Advanced Thermal Processing of Semiconductors, 2003. RTP 2003. 11th IEEE International Conference on. :187-193 2003

    Relation: International Conference on Advanced Thermal Processing of Semiconductors

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    Book

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    Conference

    Source: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat. No.99CH37027) Ultrasonics Ultrasonics Symposium, 1999. Proceedings. 1999 IEEE. 2:1413-1417 vol.2 1999

    Relation: 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium

  17. 17
    Conference

    Source: Proceedings of the 1999 American Control Conference (Cat. No. 99CH36251) American control conference American Control Conference, 1999. Proceedings of the 1999. 2:1134-1137 vol.2 1999

    Relation: Proceedings of the 1999 American Control Conference

  18. 18
    Conference

    Source: 1997 IEEE Ultrasonics Symposium Proceedings. An International Symposium (Cat. No.97CH36118) Ultrasonics symposium Ultrasonics Symposium, 1997. Proceedings., 1997 IEEE. 2:1131-1135 vol.2 1997

    Relation: 1997 IEEE Ultrasonics Symposium Proceedings An International Symposium

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    Academic Journal

    Source: Physical Review Physics Education Research. Jan-Jun 2019 15(1).

    Peer Reviewed: Y

    Page Count: 10

    Sponsoring Agency: National Science Foundation (NSF)

    Geographic Terms: Ohio (Columbus)