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  1. 1
    Academic Journal

    Source: IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing IEEE J. Sel. Top. Appl. Earth Observations Remote Sensing Selected Topics in Applied Earth Observations and Remote Sensing, IEEE Journal of. 18:6279-6298 2025

    Linked Full Text
  2. 2
    Conference

    Source: 2015 6th International Conference on Automation, Robotics and Applications (ICARA) Automation, Robotics and Applications (ICARA), 2015 6th International Conference on. :283-288 Feb, 2015

    Relation: 2015 6th International Conference on Automation, Robotics and Applications (ICARA 2015)

  3. 3
    Conference

    Source: 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on. :235-238 2002

    Relation: IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging

  4. 4
    Conference

    Source: Proceedings of Electrical/Electronics Insulation Conference Electrical electronics insulation and electrical manufacturing and coil winding Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition. :215-219 1993

    Relation: Proceedings of Electrical/Electronics Insulation Conference

  5. 5
    Conference

    Source: 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. Solid-state circuits Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC. 2003 IEEE International. :422-504 vol.1 2003

    Relation: Proceedings of IEEE International Solid-State Circuits Conference

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    Academic Journal

    Source: IEEE Transactions on Aerospace and Electronic Systems IEEE Trans. Aerosp. Electron. Syst. Aerospace and Electronic Systems, IEEE Transactions on. AES-7(3):506-520 May, 1971