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    Academic Journal

    Authors: Shi, Min1, shi_min@ncepu.edu.cn, Hou, Jingzhao1, 120212227077@ncepu.edu.cn, Li, Zhaoxin2, cszli@hotmail.com, Zhu, Dengming3, mdzhu@ict.ac.cn

    Source: Journal of Intelligent Manufacturing; Feb2025, Vol. 36 Issue 2, p1477-1490, 14p

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  4. 4
    Academic Journal

    Authors: Altukhaim, Samirah1,2 (AUTHOR), George, Daniel1 (AUTHOR), Nagaratnam, Kiruba3 (AUTHOR), Kondo, Toshiyuki4 (AUTHOR), Hayashi, Yoshikatsu1 (AUTHOR) y.hayashi@reading.ac.uk

    Source: Scientific Reports. 3/1/2024, Vol. 14 Issue 1, p1-10. 10p.

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    Academic Journal
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    Academic Journal

    Authors: Beyvers, Marie C.1 (AUTHOR), Voudouris, Dimitris1 (AUTHOR), Fiehler, Katja1,2 (AUTHOR) katja.fiehler@psychol.uni-giessen.de

    Source: Scientific Reports. 11/18/2023, Vol. 13 Issue 1, p1-11. 11p.

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  7. 7
    Academic Journal

    Authors: Marangoni, Sabrine1 (AUTHOR), Beatty, Julia2 (AUTHOR), Steagall, Paulo V.1,2 (AUTHOR) pmortens@cityu.edu.hk

    Source: PLoS ONE. 9/28/2023, Vol. 18 Issue 9, p1-14. 14p.

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    Academic Journal
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    Academic Journal

    Authors: Lim, Chaeeun1 (AUTHOR) chaeeun_lim@brown.edu, Vishwanath, Dhanraj2 (AUTHOR), Domini, Fulvio1 (AUTHOR)

    Source: Scientific Reports. 1/31/2025, Vol. 15 Issue 1, p1-15. 15p.

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  16. 16
    Conference

    Authors: Xu, Haotian1 (AUTHOR) 201906110412@zjut.edu.cn

    Source: AIP Conference Proceedings. 2024, Vol. 3144 Issue 1, p1-13. 13p.

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    Academic Journal

    Authors: Terfurth, Leonie1, leonie.terfurth@tu-berlin.de, Gramann, Klaus1, klaus.gramann@tu-berlin.de, Gehrke, Lukas1, lukas.gehrke@tu-berlin.de

    Source: ACM Transactions on Computer-Human Interaction (TOCHI); Jun2024, Vol. 31 Issue 3, p1-21, 21p

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  18. 18
    Academic Journal

    Authors: Zhang, Hongtao1, 258004n@gs.kochi-tech.ac.jp, Yoshida, Shinichi2

    Source: Applied Sciences (2076-3417); Apr2024, Vol. 14 Issue 8, p3429, 33p

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    Academic Journal

    Authors: Kumra, Sulabh1,2 (AUTHOR) sk2881@rit.edu, Joshi, Shirin1,3 (AUTHOR), Sahin, Ferat1 (AUTHOR)

    Source: Sensors (14248220). Aug2022, Vol. 22 Issue 16, p6208-6208. 25p.

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