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1Academic Journal
Authors: Coenen, D., Sar, H., Marinins, A., Smyth, S., McKee, A., Ban, Y., Van Campenhout, J., Oprins, H.
Source: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 31(2: Pwr. and Effic. Scaling in Semiconductor Lasers):1-9 Apr, 2025
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2Conference
Authors: Vermeersch, B., Mishra, S., Brunion, M., Zografos, O., Lofrano, M., Oprins, H., Myers, J., Tokei, Z., Hellings, G.
Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024
Relation: 2024 IEEE International Electron Devices Meeting (IEDM)
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3Academic Journal
Authors: Giacomini Rocha, L.M., Bilgic, R., Naeim, M., Das, S., Oprins, H., Yousefzadeh, A., Konijnenburg, M., Milojevic, D., Myers, J., Ryckaert, J., Biswas, D.
Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(11):2144-2148 Nov, 2024
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4Conference
Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plasv, G., Beyne, E., De Wolf, I.
Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-10 May, 2024
Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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5Conference
Authors: Mishra, S., Vermeersch, B., Sankatali, V., Kukner, H., Sharma, A., Mirabeli, G., Bufler, F. M., Brunion, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Catthoor, F., Weckx, P., Hellings, G., Myers, J., Ryckaert, J.
Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
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6Academic Journal
Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plas, G., Beyne, E., De Wolf, I.
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1180-1188 Jul, 2024
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7Conference
Authors: Oprins, H., Wei, Tiwei, Cherman, Vladimir, Beyne, E.
Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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8Conference
Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plas, G., Beyne, E., De Wolf, I.
Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023
Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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9Conference
Authors: Mishra, S., Sankatali, V., Vermeersch, B., Brunion, M., Lofrano, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Hiblot, G., Van Der Plas, G., Weckx, P., Hellings, G., Myers, J., Catthoor, F., Ryckaert, J.
Source: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023
Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)
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10Academic Journal
Authors: Coenen, D., Oprins, H., Berciano, M., Muliuk, G., Heyn, P.D., Campenhout, J.V., De Wolf, I.
Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 41(18):6000-6006 Sep, 2023
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11Academic Journal
Authors: Coenen, D., Oprins, H., Degraeve, R., Wolf, I.D.
Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 42(7):2264-2275 Jul, 2023
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12Academic Journal
Authors: Venkateswarlu, S., Mishra, S., Oprins, H., Vermeersch, B., Brunion, M., Han, J., Stan, M.R., Weckx, P., Catthoor, F.
Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(11):1668-1676 Nov, 2022
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13Academic Journal
Authors: Coenen, D., Croes, K., Tsiara, A., Oprins, H., Simons, V., Pedreira, O.V., Ban, Y., Van Campenhout, J., De Wolf, I.
Source: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(3):417-423 Sep, 2022
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14Academic Journal
Authors: Coenen, D., Oprins, H., De Heyn, P., Van Campenhout, J., De Wolf, I.
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1350-1357 Aug, 2022
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15Academic Journal
Authors: Coenen, D., Oprins, H., Ban, Y., Ferraro, F., Pantouvaki, M., Van Campenhout, J., De Wolf, I.
Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 40(13):4357-4363 Jul, 2022
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16Conference
Authors: Wei, T.-W., Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., Baelmans, M.
Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1422-1429 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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17Conference
Authors: Cherman, V., Van Huylenbroeck, S., Lofrano, M., Chang, X., Oprins, H., Gonzalez, M., Van der Plas, G., Beyer, G., Rebibis, K. J., Beyne, E.
Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :548-553 Jun, 2020
Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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18Academic Journal
Authors: Wei, T., Oprins, H., Cherman, V., Yang, Z., Rivera, K.C., Plas, G.V.d., Pawlak, B.J., England, L., Beyne, E., Baelmans, M.
Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(3):415-425 Mar, 2021
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19Conference
Authors: Oprins, H., Beyne, E.
Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1234-1242 May, 2019
Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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20Conference
Authors: Wei, T.-W., Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., Baelmans, M.
Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1243-1252 May, 2019
Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)