Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics

Authors: Coenen, D., Sar, H., Marinins, A., Smyth, S., McKee, A., Ban, Y., Van Campenhout, J., Oprins, H.

Source: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 31(2: Pwr. and Effic. Scaling in Semiconductor Lasers):1-9 Apr, 2025

Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation

Authors: Vermeersch, B., Mishra, S., Brunion, M., Zografos, O., Lofrano, M., Oprins, H., Myers, J., Tokei, Z., Hellings, G.

Source: 2024 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2024 IEEE International. :1-4 Dec, 2024

Relation: 2024 IEEE International Electron Devices Meeting (IEDM)

Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures

Authors: Giacomini Rocha, L.M., Bilgic, R., Naeim, M., Das, S., Oprins, H., Yousefzadeh, A., Konijnenburg, M., Milojevic, D., Myers, J., Ryckaert, J., Biswas, D.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(11):2144-2148 Nov, 2024

Enhancement of Direct Liquid Jet Impingement Cooling through Laser-Fabricated Micro Pin-Fins on the Chip-Backside

Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plasv, G., Beyne, E., De Wolf, I.

Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-10 May, 2024

Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation

Authors: Mishra, S., Vermeersch, B., Sankatali, V., Kukner, H., Sharma, A., Mirabeli, G., Bufler, F. M., Brunion, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Catthoor, F., Weckx, P., Hellings, G., Myers, J., Ryckaert, J.

Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plas, G., Beyne, E., De Wolf, I.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1180-1188 Jul, 2024

Liquid jet impingement cooling of high-performance interposer packages: a hybrid CFD – FEM modeling study

Authors: Oprins, H., Wei, Tiwei, Cherman, Vladimir, Beyne, E.

Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Micro-Scale Jet Cooling: A Numerical Study on Improvement Options

Authors: Elsinger, G., Oprins, H., Cherman, V., Van der Plas, G., Beyne, E., De Wolf, I.

Source: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

Authors: Mishra, S., Sankatali, V., Vermeersch, B., Brunion, M., Lofrano, M., Abdi, D., Oprins, H., Biswas, D., Zografos, O., Hiblot, G., Van Der Plas, G., Weckx, P., Hellings, G., Myers, J., Catthoor, F., Ryckaert, J.

Source: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-7 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis

Authors: Coenen, D., Oprins, H., Berciano, M., Muliuk, G., Heyn, P.D., Campenhout, J.V., De Wolf, I.

Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 41(18):6000-6006 Sep, 2023

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

Authors: Coenen, D., Oprins, H., Degraeve, R., Wolf, I.D.

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 42(7):2264-2275 Jul, 2023

Thermal Performance Analysis of Mempool RISC-V Multicore SoC

Authors: Venkateswarlu, S., Mishra, S., Oprins, H., Vermeersch, B., Brunion, M., Han, J., Stan, M.R., Weckx, P., Catthoor, F.

Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 30(11):1668-1676 Nov, 2022

Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators

Authors: Coenen, D., Croes, K., Tsiara, A., Oprins, H., Simons, V., Pedreira, O.V., Ban, Y., Van Campenhout, J., De Wolf, I.

Source: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(3):417-423 Sep, 2022

Analysis of Thermal Crosstalk in Photonic Integrated Circuit Using Dynamic Compact Models

Authors: Coenen, D., Oprins, H., De Heyn, P., Van Campenhout, J., De Wolf, I.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(8):1350-1357 Aug, 2022

Thermal Modelling of Silicon Photonic Ring Modulator with Substrate Undercut

Authors: Coenen, D., Oprins, H., Ban, Y., Ferraro, F., Pantouvaki, M., Van Campenhout, J., De Wolf, I.

Source: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 40(13):4357-4363 Jul, 2022

Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications

Authors: Wei, T.-W., Oprins, H., Cherman, V., Yang, Z., Rivera, K., Van der Plas, G., Pawlak, B. J., England, L., Beyne, E., Baelmans, M.

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1422-1429 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Thermal, Mechanical and Reliability assessment of Hybrid bonded wafers, bonded at 2.5μm pitch

Authors: Cherman, V., Van Huylenbroeck, S., Lofrano, M., Chang, X., Oprins, H., Gonzalez, M., Van der Plas, G., Beyer, G., Rebibis, K. J., Beyne, E.

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :548-553 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Authors: Wei, T., Oprins, H., Cherman, V., Yang, Z., Rivera, K.C., Plas, G.V.d., Pawlak, B.J., England, L., Beyne, E., Baelmans, M.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(3):415-425 Mar, 2021

Thermal Analysis of a 3D Flip-chip Fan-out Wafer Level Package (fcFOWLP) for High Bandwidth 3D Integration

Authors: Oprins, H., Beyne, E.

Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1234-1242 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Thermal Analysis of Polymer 3D Printed Jet Impingement Coolers for High Performance 2.5D Si Interposer Packages

Authors: Wei, T.-W., Oprins, H., Cherman, V., De Wolf, I., Van der Plas, G., Beyne, E., Baelmans, M.

Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1243-1252 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)