Transference of Evolved Unmanned Aerial Vehicle Controllers to a Wheeled Mobile Robot

Authors: Barlow, G.J., Mattos, L.S., Grant, E., Oh, C.K.

Source: Proceedings of the 2005 IEEE International Conference on Robotics and Automation Robotics and Automation, 2005. ICRA 2005. Proceedings of the 2005 IEEE International Conference on. :2087-2092 2005

Relation: Proceedings of the 2005 IEEE International Conference on Robotics and Automation

Diagnosis and failure analysis for scan failure

Authors: Song, Z.G., Neo, S.P., Tun, T., Oh, C.K., Lo, K.F.

Source: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Physical and Failure Analysis of Integrated Circuits Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005. Proceedings of the 12th International Symposium on the. :181-184 2005

Relation: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Copper corrosion issue and analysis on copper damascene process

Authors: Song, Z.G., Neo, S.P., Oh, C.K., Redkar, S., Lee, Y.P.

Source: Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2004. IPFA 2004. Proceedings of the 11th International Symposium on the. :71-74 2004

Relation: Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004

Autonomous controller design for unmanned aerial vehicles using multi-objective genetic programming

Authors: Oh, C.K., Barlow, G.J.

Source: Proceedings of the 2004 Congress on Evolutionary Computation (IEEE Cat. No.04TH8753) Evolutionary computation Evolutionary Computation, 2004. CEC2004. Congress on. 2:1538-1545 Vol.2 2004

Relation: Proceedings of the 2004 Congress on Evolutionary Computation

Incremental evolution of autonomous controllers for unmanned aerial vehicles using multi-objective genetic programming

Authors: Barlow, G.J., Oh, C.K., Grant, E.

Source: IEEE Conference on Cybernetics and Intelligent Systems, 2004. Cybernetics and intelligent systems Cybernetics and Intelligent Systems, 2004 IEEE Conference on. 2:689-694 2004

Relation: 2004 IEEE Conference on Cybernetics and Intelligent Systems

Unique defects and analyses with copper damascene process for multilevel metallization

Authors: Song, Z.G., Loh, S.K., Gunawardana, M., Oh, C.K., Redkar, S.

Source: Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the. :12-15 2003

Relation: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

A new paradigm of using TEM in yield enhancement failure analysis for sub-micron integrated circuit devices

Authors: Oh, C.K., Song, Z.G., Neo, S.P., Ang, G.B., Magdeliza, G., Redkar, S.

Source: ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575) Semiconductor electronics Semiconductor Electronics, 2002. Proceedings. ICSE 2002. IEEE International Conference on. :22-26 2002

Relation: ICSE 2002. IEEE International Conference on Semiconductor Electronics. Proceedings

Front-end processing defect localization by contact-level passive voltage contrast technique and root cause analysis

Authors: Song, Z.G., Dai, J.Y., Ansari, S., Oh, C.K., Redkar, S.

Source: Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2002. IPFA 2002. Proceedings of the 9th International Symposium on the. :97-100 2002

Relation: Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Failure Analysis of A Unique Poly Defect

Authors: Neo, S.P., Song, Z.G., Oh, C.K, Zhao, S. P.

Source: 2006 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics, 2006. ICSE '06. IEEE International Conference on. :696-698 Nov, 2006

Relation: 2006 IEEE International Conference on Semiconductor Electronics

Atomic layer etching of silicon by using a low-angle forward reflected ar neutral beam

Authors: Park, S.D., Oh, C.K., Yeom, G.Y.

Source: The 33rd IEEE International Conference on Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. Plasma Science, 2006. ICOPS 2006. IEEE Conference Record - Abstracts. The 33rd IEEE International Conference on. :467-467 2006

Relation: 2006 The 33rd IEEE International Conference on Plasma Science

A new and effective method in failure analysis of gate oxide polysilicon capacitor structure

Authors: Oh, C.K., Teo, H.T., Lo, K.F.

Source: 2004 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on. :4 pp. 2004

Relation: 2004 IEEE International Conference on Semiconductor Electronics

Failure analysis on wafer edge issue in 0.13/spl mu/m technology

Authors: Indahwan, J., Song, Z.G., Tun, I., Oh, C.K., Lo, K.F.

Source: 2004 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on. :3 pp. 2004

Relation: 2004 IEEE International Conference on Semiconductor Electronics

Application of sodium hydroxide in analysis of gate oxide issue of leakage failures

Authors: Oo, A., Song, Z.G., Neo, S.P., Oh, C.K., Lo, K.F.

Source: 2004 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on. :3 pp. 2004

Relation: 2004 IEEE International Conference on Semiconductor Electronics

Copper dendrite growth and analysis on copper damascene process

Authors: Tun, T., Song Zhigang, Yoges, K., Oh, C.K., Lo, K.F.

Source: 2004 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on. :3 pp. 2004

Relation: 2004 IEEE International Conference on Semiconductor Electronics

Study and application of wright etch in sub-quarter-micron technology

Authors: Neo, S.P., Phong, O.L., Song, Z.G., Oh, C.K., Lo, K.F.

Source: 2004 IEEE International Conference on Semiconductor Electronics Semiconductor Electronics Semiconductor Electronics, 2004. ICSE 2004. IEEE International Conference on. :4 pp. 2004

Relation: 2004 IEEE International Conference on Semiconductor Electronics

A Sample Preparation Methodology for Effective Failure Analysis of Trench Power MOSFET
International symposium for testing and failure analysis; ISTFA 2013

Authors: Li, Y., Loh, S.K., Chen, C.Q., Ang, G.B., Quah, A.C.T., Neo, S.P., Oh, C.K., Yao, Y.J., Zhao, S.P.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. :549-552

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN087023756&indx=1&recIds=ETOCCN087023756

Nanoprobing as an Essential and Fast Methodology in Identification of Failure's Root Cause for Advanced Technology
International symposium for testing and failure analysis; ISTFA 2013

Authors: Ma, Y., Oh, C.K., Nyi, O., Zhang, C., Nedeau, D., Lim, S.K., King, M.C.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. :249-254

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN087023185&indx=1&recIds=ETOCCN087023185

Two Step Fabrication of Tungsten Nanotips by AC Electrochemical Etching and Laser Irradiation for Nanoprobing on Advanced Technology Nodes
International symposium for testing and failure analysis; ISTFA 2012; conference proceedings from the 38th international symposium for testing and failure analysis, November 11-15, 2012, Phoenix, Aruzona, USA

Authors: Dawood, M.K., Ng, T.H., Tan, H., Tan, P.K., Oh, C.K., Lam, J., Mai, Z.H.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. Conf 38^t^h:557-561

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN084615078&indx=1&recIds=ETOCCN084615078

Fault Isolation Techniques and Studies on Low Resistance Gross Short Failures
International symposium for testing and failure analysis; ISTFA 2012; conference proceedings from the 38th international symposium for testing and failure analysis, November 11-15, 2012, Phoenix, Aruzona, USA

Authors: Tan, P.K., Mai, Z.H., Lee, W.Y., Ma, Y.Z., He, R., Ng, T.H., Dawood, M.K., Low, G.R., Tan, H., Oh, C.K.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. Conf 38^t^h:406-410

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN084614815&indx=1&recIds=ETOCCN084614815

Study of Static Noise Margin, Cell Stability and Influence of Electron Beam on Sub-30 nm SRAM Using SEM-Based Nanoprobing with 8 Nanoprobes
International symposium for testing and failure analysis; ISTFA 2012; conference proceedings from the 38th international symposium for testing and failure analysis, November 11-15, 2012, Phoenix, Aruzona, USA

Authors: Ng, T.H., Dawood, M.K., Tan, P.K., Tan, H., Oh, C.K., Lam, J.C., Mai, Z.H.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. Conf 38^t^h:112-117

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN084614323&indx=1&recIds=ETOCCN084614323