Digital Twins for IC Packages and Electronics-enabled Systems

Authors: Inamdar, Adwait, Gromala, Przemyslaw, Bailey, Christopher, Nguyen, Luu, Chan, Benson, Ryu, Jong, Rezaie, Farnood, Detofsky, Abram, Van Driel, Willem D., Zhang, GuoQi

Source: 2024 IEEE Smart World Congress (SWC) SWC Smart World Congress (SWC), 2024 IEEE. :2125-2132 Dec, 2024

Relation: 2024 IEEE Smart World Congress (SWC)

Software Mention Recognition with a Three-Stage Framework Based on BERTology Models at SOMD 2024

Authors: Thi, Thuy Nguyen, Viet, Anh Nguyen, Van, Thin Dang, Thuy, Ngan Nguyen Luu

Subject Terms: Computer Science - Software Engineering, Computer Science - Artificial Intelligence, Computer Science - Computation and Language

Access URL: http://arxiv.org/abs/2405.01575

High-Performance FPGA Embedded System for Deep learning-based Thermal Object Tracking

Authors: Nguyen, Luu, Phan, Tung, Thai, Chien, Ninh, Huong, Tran, Hai

Source: 2022 International Conference on Advanced Mechatronic Systems (ICAMechS) Advanced Mechatronic Systems (ICAMechS), 2022 International Conference on. :95-101 Dec, 2022

Relation: 2022 International Conference on Advanced Mechatronic Systems (ICAMechS)

Remapping the EFI in Automotive Engine Control Unit Using Piggy-Back ECU

Authors: Thuong, Phu, Nguyen, Luu

Source: 2022 6th International Conference on Green Technology and Sustainable Development (GTSD) Green Technology and Sustainable Development (GTSD), 2022 6th International Conference on. :588-594 Jul, 2022

Relation: 2022 6th International Conference on Green Technology and Sustainable Development (GTSD)

Practical Considerations in Repairing Reed-Solomon Codes

Authors: Dinh, Thi Xinh, Nhi Nguyen, Luu Y, Mohan, Lakshmi J., Boztas, Serdar, Luong, Tran Thi, Dau, Son Hoang

Source: 2022 IEEE International Symposium on Information Theory (ISIT) Information Theory (ISIT), 2022 IEEE International Symposium on. :2607-2612 Jun, 2022

Relation: 2022 IEEE International Symposium on Information Theory (ISIT)

An Open Dataset of Sensor Data from Soil Sensors and Weather Stations at Production Farms

Authors: Mousoulis, Charilaos, Wang, Pengcheng, Do, Nguyen Luu, Waimin, Jose F, Raghunathan, Nithin, Rahimi, Rahim, Shakouri, Ali, Bagchi, Saurabh

Subject Terms: Computer Science - Computers and Society

Access URL: http://arxiv.org/abs/2302.09072

Prospective validation study: a non-invasive circulating tumor DNA-based assay for simultaneous early detection of multiple cancers in asymptomatic adults.

Authors: Nguyen, Luu Hong Dang¹ (AUTHOR), Nguyen, Thi Hue Hanh¹ (AUTHOR), Le, Van Hoi² (AUTHOR), Bui, Vinh Quang³ (AUTHOR), Nguyen, Lan Hieu⁴ (AUTHOR), Pham, Nhu Hiep⁵ (AUTHOR), Phan, Thanh Hai⁶ (AUTHOR), Nguyen, Huu Thinh⁷ (AUTHOR), Tran, Van Song⁸ (AUTHOR), Bui, Chi Viet⁹ (AUTHOR), Vo, Van Kha¹⁰ (AUTHOR), Nguyen, Pham Thanh Nhan¹¹ (AUTHOR), Dang, Ha Huu Phuoc¹² (AUTHOR), Pham, Van Dung¹³ (AUTHOR), Cao, Van Thinh¹⁴ (AUTHOR), Phan, Ngoc Minh¹ (AUTHOR), Tieu, Ba Linh¹ (AUTHOR), Nguyen, Giang Thi Huong¹ (AUTHOR), Vo, Dac Ho¹ (AUTHOR), Tran, Trung Hieu¹ (AUTHOR)

Source: BMC Medicine. 2/14/2025, Vol. 23 Issue 1, p1-14. 14p.

Subject Terms: *CIRCULATING tumor DNA, *EARLY diagnosis, *MULTIPLE tumors, *MEDICAL care, *MEDICAL needs assessment, *ASYMPTOMATIC patients

Geographic Terms: VIETNAM

A Novel User Pairing Scheme for Non-orthogonal Multiple Access Backscatter Communication

Authors: Nguyen, Luu X., Nguyen, Chuyen T., Phan, Vu X., Pham, Anh T.

Source: 2020 IEEE Eighth International Conference on Communications and Electronics (ICCE) Communications and Electronics (ICCE), 2020 IEEE Eighth International Conference on. :509-514 Jan, 2021

Relation: 2020 IEEE Eighth International Conference on Communications and Electronics (ICCE)

Conceptual metaphor 'FINANCE IS PLANT' in Vietnamese online newspapers

Authors: Nguyen Luu Diep Anh

Source: Tạp chí Khoa học và Công nghệ, Pp 23-31 (2024)

Subject Terms: conceptual metaphor, mapping, finance, plant, source domain, target domain, Technology

File Description: electronic resource

Relation: https://jst-ud.vn/jst-ud/article/view/9042; https://doaj.org/toc/1859-1531

Access URL: https://doaj.org/article/f796744a60144a38b01bdaea989f62b5

Seebeck and Nernst effects in the mixed state of strongly fluctuating superconductors

Authors: Nguyen, Luu Huu ^{a, b, 1}, Vi, Tran Ky ^c, Tinh, Bui Duc ^{d, ⁎, 1}

Source: In Physica B: Condensed Matter 15 December 2024 695

Angle-dependent Hall resistivity and longitudinal resistivity of type-II superconductor

Authors: Nguyen, Luu Huu, Vi, Tran Ky, Cuong, Nguyen Chinh, Tinh, Bui Duc

Source: In Solid State Communications 15 December 2024 394

How the online presence of mothers changed over time during the COVID pandemic: A longitudinal study

Authors: Lendvai, Lilla ^{a, ⁎}, Hevesi, Judit ^b, Végh, Judit ^c, Dúll, Andrea ^d, Nguyen Luu, Lan Anh ^a

Source: In Women's Studies International Forum November-December 2024 107

Cu Pillar with Nanocopper Caps: The Next Interconnection Node Beyond Traditional Cu Pillar

Authors: Sosa, Ramon A., Mohan, Kashyap, Nguyen, Luu, Tummala, Rao, Antoniou, Antonia, Smet, Vanessa

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :655-660 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Non-destructive Failure Analysis of Various Chip to Package Interaction Anomalies in FCBGA Packages Subjected to Temperature Cycle Reliability Testing

Authors: B. Reddy, Vishnu V., Ume, I. Charles, Williamson, Jaimal, Nguyen, Luu

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1333-1338 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Effect of Intermetallic Compound Growth on Electromigration Failure Mechanism in Low-Profile Solder Joints

Authors: Madanipour, Hossein, Kim, Yi-Ram, Kim, Choong-Un, Shahane, Ninad, Mishra, Dibyajat, Noguchi, T., Yoshino, M., Nguyen, Luu

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1316-1323 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion

Authors: Lall, Pradeep, Zhang, Yunli, Suhling, Jeff, Nguyen, Luu

Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :83-89 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Study of the Effect of Solder-Joint Voiding using X-ray MicroCT Data-based FE Models with Experimental Validation

Authors: Lall, Pradeep, Kothari, Nakul, Deshpande, Shantanu, Nguyen, Luu

Source: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1160-1167 May, 2019

Relation: 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Novel Corrosion Prevention Treatments for Cu Wire Bonded Device to Improve Bonding Reliability

Authors: Asokan, Muthappan, Caperton, Josh, Thompson, Zach, Chyan, Oliver, Chowdhury, Mahmud, O'Connor, Shawn, Nguyen, Luu

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :139-143 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Reliability of Copper, Gold, Silver, and PCC Wirebonds Subjected to Harsh Environment

Authors: Lall, Pradeep, Deshpande, Shantanu, Nguyen, Luu

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :724-734 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion Subjected to Highly-Accelerated Stress Test

Authors: Lall, Pradeep, Luo, Yihua, Nguyen, Luu

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1628-1638 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)