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    Conference

    Source: 2024 IEEE Latin American Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2024 IEEE Latin American. :1-4 May, 2024

    Relation: 2024 IEEE Latin American Electron Devices Conference (LAEDC)

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    Conference

    Source: 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON) Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON), 2023 IEEE CHILEAN Conference on. :1-5 Dec, 2023

    Relation: 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies (CHILECON)

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    Conference

    Source: 2023 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE) Advanced Topics in Electrical Engineering (ATEE), 2023 13th International Symposium on. :1-4 Mar, 2023

    Relation: 2023 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE)

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    Academic Journal

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    Conference

    Source: 2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT) Computing, Power and Communication Technologies (GlobConPT), 2022 IEEE Global Conference on. :1-4 Sep, 2022

    Relation: 2022 IEEE Global Conference on Computing, Power and Communication Technologies (GlobConPT)

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    Conference

    Source: 2021 IEEE Fifth Ecuador Technical Chapters Meeting (ETCM) Technical Chapters Meeting (ETCM), 2021 IEEE Fifth Ecuador. :1-7 Oct, 2021

    Relation: 2021 IEEE Fifth Ecuador Technical Chapters Meeting (ETCM)

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    Conference

    Source: 2020 IX International Congress of Mechatronics Engineering and Automation (CIIMA) Mechatronics Engineering and Automation (CIIMA), 2020 IX International Congress of. :1-6 Nov, 2020

    Relation: 2020 IX International Congress of Mechatronics Engineering and Automation (CIIMA)

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    Academic Journal

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    Academic Journal

    Source: IEEE Transactions on Power Delivery IEEE Trans. Power Delivery Power Delivery, IEEE Transactions on. 36(4):2298-2307 Aug, 2021

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