Flip-Chip Approach for 500 GHz Broadband Interconnects

Authors: Sinha, S., Doerner, R., Schmuckle, F., Monayakul, S., Hrobak, M., Weimann, N.G., Krozer, V., Heinrich, W.

Source: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 65(4):1215-1225 Apr, 2017

Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

Authors: Weimann, N.G., Monayakul, S., Sinha, S., Schmuckle, F., Hrobak, M., Stoppel, D., John, W., Kruger, O., Doerner, R., Janke, B., Krozer, V., Heinrich, W.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(4):494-501 Apr, 2017

Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly

Authors: Monayakul, S., Sinha, S., Schmuckle, F. J., Hrobak, M., Stoppel, D., Kruger, O., Janke, B., Weimann, N. G.

Source: 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th. :141-144 Oct, 2015

Relation: 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

Flip-Chip Interconnects for 250 GHz Modules

Authors: Monayakul, S., Sinha, S., Wang, C.-T., Weimann, N., Schmuckle, F. J., Hrobak, M., Krozer, V., John, W., Weixelbaum, L., Wolter, P., Kruger, O., Heinrich, W.

Source: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 25(6):358-360 Jun, 2015