Dual-Parallel-Pixel-Row Decoupling Method for Camera-Based Three-Degree-of-Freedom Interferometers

Authors: Hu, P., Lin, X., Molnar, G., Werner, C., Fu, H., Yang, R., Flugge, J., Yu, L.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(16):26190-26198 Aug, 2024

Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis

Authors: Wane, S., Kendig, D., Dinh, T.V., Alkhalifeh, K., Cabrera, A. E., Tran, Q.H., Shakouri, M., Shakouri, A., Salmon, L., Molnar, G., Ridier, K., Bajon, D., Nyssens, L., Pip, A., Vanbrabant, M., Rack, M., Tihon, D., Craeye, C., Simon, P., Raskin, J.-P., Lederer, D., Bousseksou, A.

Source: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2023 IEEE Texas Symposium on. :1-6 Apr, 2023

Relation: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)

Picosecond Femtojoule Resistive Switching in Nanoscale VO$_{2}$ Memristors

Authors: Schmid, S. W., Pósa, L., Török, T. N., Sánta, B., Pollner, Z., Molnár, G., Horst, Y., Volk, J., Leuthold, J., Halbritter, A., Csontos, M.

Source: ACS Nano 2024, 18, 21966-21974

Subject Terms: Condensed Matter - Mesoscale and Nanoscale Physics

Access URL: http://arxiv.org/abs/2403.13530

Spectrally Efficient UWB Pulse Shaping Based on Polynomially Weighted Gaussian Pulses With Maximally Flat Amplitude Spectra

Authors: Milos, A., Molnar, G., Vucic, M.

Source: IEEE Communications Letters IEEE Commun. Lett. Communications Letters, IEEE. 27(7):1869-1873 Jul, 2023

Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging

Authors: Frascaroli, J., Tonini, M., Colombo, S., Livellara, L., Mariani, L., Targa, P., Fumagalli, R., Samu, V., Nagy, M., Molnar, G., Horvath, A., Bartal, Z., Kiss, Z., Sipocz, T., Mica, I.

Source: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 35(3):540-545 Aug, 2022

Smart Sensing of Vital-Signs: Co-Design of Tunable Quantum-Spin Crossover Materials with Secure Photonics and RF Front-End-Module

Authors: Wane, S., Tran, Q.H., Cabrera, A. E., Salmon, L., Molnar, G., Huard, V., Bousseksou, A.

Source: 2021 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2021 IEEE Texas Symposium on. :1-4 May, 2021

Relation: 2021 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)

Review of applications of Defect Photoluminescence Imaging (DPLI) during IC processing

Authors: Jastrzebski, L., Duru, R., Le-Cunff, D., Cannac, M., Joblot, S., Mica, I., Polignano, M. L., Galbiati, A., Monge, P., Roffarello, Nadudvari, G., Kiss, Z., Lajtos, I., Pongracz, A., Molnar, G., Nagy, M., Dudas, L., Basa, P., Greenwood, B., Gambino, J.

Source: 2019 19th International Workshop on Junction Technology (IWJT) Junction Technology (IWJT), 2019 19th International Workshop on. :1-6 Jun, 2019

Relation: 2019 19th International Workshop on Junction Technology (IWJT)

Implant Optimization for a 180nm BCD Technology

Authors: Greenwood, B., Kimball, J., Sridaran, S., Truong, K., Lee, A., Menon, S., Gambino, J.P., Jastrzebski, L., Nadudvari, G., Roszol, L., Nagy, M., Molnar, G., Kiss, Z., Pongracz, A., Byrnes, J.

Source: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2019 30th Annual SEMI. :1-5 May, 2019

Relation: 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Gamification and microcontent orientated methodological solutions based on bring-your-own device logic in higher education

Authors: Nagy, K., Molnar, G., Szenkovits, B., Horvath-Czinger, J., Szuts, Z.

Source: 2018 9th IEEE International Conference on Cognitive Infocommunications (CogInfoCom) Cognitive Infocommunications (CogInfoCom), 2018 9th IEEE International Conference on. :000385-000388 Aug, 2018

Relation: 2018 IEEE 9th International Conference on Cognitive Infocommunications (CogInfoCom)

Issues of Lifelong Learning - Behavioral ends of teaching and learning through ICT

Authors: Kalman, A., Molnar, G., Szuts, Z.

Source: 2018 9th IEEE International Conference on Cognitive Infocommunications (CogInfoCom) Cognitive Infocommunications (CogInfoCom), 2018 9th IEEE International Conference on. :000395-000398 Aug, 2018

Relation: 2018 IEEE 9th International Conference on Cognitive Infocommunications (CogInfoCom)

Micro-photoluminescence imaging of dislocation generation in 0.18μm power semiconductor devices with deep trenches

Authors: Greenwood, B., Gambino, J.P., Watanabe, Y., Jastrzebski, L., Nadudvari, G., Cseh, D. T., Roszol, L., Molnar, G., Lajtos, I.

Source: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2018 29th Annual. :5-9 Apr, 2018

Relation: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Anisotropic magnetoresistance (AMR) of cobalt: hcp-Co vs. fcc-Co

Authors: El-Tahawy, M. ^{a, b, c}, Péter, L. ^a, Kiss, L.F. ^a, Gubicza, J. ^b, Czigány, Zs. ^d, Molnár, G. ^d, Bakonyi, I. ^{a, ⁎}

Source: In Journal of Magnetism and Magnetic Materials 15 October 2022 560

Giant magnetoresistance and structure of electrodeposited Co/Cu multilayers: the influence of layer thicknesses and Cu deposition potential

Authors: Rajasekaran, N., Mani, J., Tóth, B. G., Molnár, G., Mohan, S., Péter, L., Bakonyi, I.

Source: Journal of the Electrochemical Society 162 (6), D204-D212 (2015)

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/1702.01065

Influence of Cu deposition potential on the giant magnetoresistance and surface roughness of electrodeposited Ni-Co/Cu multilayers

Authors: Tóth, B. G., Péter, L., Dégi, J., Révész, Á., Oszetzky, D., Molnár, G., Bakonyi, I.

Source: Electrochimica Acta 91, 122-129 (2013)

Subject Terms: Condensed Matter - Materials Science

Access URL: http://arxiv.org/abs/1609.00597

Time-domain symmetry as criterion for band-pass equalizer design

Authors: Vucic, M., Molnar, G., Babic, H.

Source: 2005 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and systems Circuits and Systems (ISCAS), 2005 IEEE International Symposium on. :3283-3286 Vol. 4 2005

Relation: 2005 IEEE International Symposium on Circuits and Systems (ISCAS)

Development of an FPGA-based data acquisition module for small animal PET

Authors: Hegyesi, Gy., Imrek, J., Kalinka, G., Molnar, J., Novak, D., Vegh, J., Balkay, L., Emri, M., Molnar, G., Tron, L., Bagamery, I., Bukki, T., Rozsa, S., Szabo, Zs., Kerek, A.

Source: IEEE Symposium Conference Record Nuclear Science 2004. Nuclear science symposium Nuclear Science Symposium Conference Record, 2004 IEEE. 5:2957-2961 2004

Relation: 2004 IEEE Nuclear Science Symposium Conference Record

Bernoulli Low-Pass Filters

Authors: Molnar, G., Vucic, M.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 61(2):85-89 Feb, 2014

Combined theoretical and experimental studies of P3HT and PTB7 polymers for organic photodiodes

Authors: Farouil, L., Alary, F., Bedel-Pereira, E., Seguy, I., Roul, J., Routaboul, C., Shalabaeva, V., Molnar, G., Heully, J.L.

Source: 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC) Nanotechnology Materials and Devices Conference (NMDC), 2016 IEEE. :1-2 Oct, 2016

Relation: 2016 IEEE Nanotechnology Materials and Devices Conference (NMDC)

Temperature dependent electrical characteristics of silicide/silicon junctions

Authors: Horvath, Zs.J., Donoval, D., Peto, G., Molnar, G., Van Tuyen, V.

Source: ASDAM 2000. Conference Proceedings. Third International EuroConference on Advanced Semiconductor Devices and Microsystems (Cat. No.00EX386) Advanced semiconductor devices and microsystems Advanced Semiconductor Devices and Microsystems, 2000. ASDAM 2000. The Third International EuroConference on. :39-42 2000

Relation: Proceedings of International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)

Closed-Form Design of CIC Compensators Based on Maximally Flat Error Criterion

Authors: Molnar, G., Vucic, M.

Source: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 58(12):926-930 Dec, 2011