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1Conference
Authors: Fraboulet, D., Jehl, X., Mariolle, D., Le Royer, C., Le Carval, G., Scheiblin, P., Rivallin, P., Mollard, L., Deleroyelle, D., Nier, M.E., Toffoli, A., Molas, G., De Salvo, B., Deleonibus, S., Sanquer, M.
Source: 32nd European Solid-State Device Research Conference Solid-State Device Research Conference, 2002. Proceeding of the 32nd European. :395-398 2002
Relation: 32nd European Solid-State Device Research Conference
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2Conference
Authors: Cassan, E., Lardenois, S., Pascal, D., Vivien, L., Heitzmann, M., Bouzaida, N., Mollard, L., Orobtchouk, R., Laval, S.
Source: Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) Interconnect technology Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International. :39-41 2003
Relation: IEEE International Interconnect Technology Conference
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3Conference
Authors: Orobtchouk, R., Schnell, N., Benyattou, T., Lardenois, S., Pascal, D., Cordat, A., Laval, S., Cassan, E., Koster, A., Bouchier, D., Bouzaida, N., Dal'zotto, B., Florin, B., Heitzmann, M., Lamouchi, Z., Louis, D., Mollard, L., Renaud, D., Gautier, J.
Source: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) Interconnect technology conference Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International. :83-85 2002
Relation: Proceedings of the IEEE 2002 International Interconnect Technology Conference
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4Academic Journal
Authors: Mollard, L., Destefanis, G., Baier, N.
Source: Journal of Electronic Materials; Aug2009, Vol. 38 Issue 8, p1805-1813, 9p
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5Academic Journal
Authors: Gravrand, O., Mollard, L., Largeron, C.
Source: Journal of Electronic Materials; Aug2009, Vol. 38 Issue 8, p1733-1740, 8p
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6Conference
Authors: Mollard, L., Dal'zotto, B., Tedesco, S., Bertrand, G.
Source: 2002 International Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and nanotechnology Microprocesses and Nanotechnology Conference, 2002. Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International. :124-125 2002
Relation: Digest of Papers. Microprocesses and Nanotechnology 2002. 2002 International Microprocesses and Nanotechnology Conference
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7Conference
Authors: Rothman, J., Vojetta, G., Moselle, B., Mollard, L., Gout, S., Chamonal, J. P.
Source: JOURNAL OF ELECTRONIC MATERIALS. 39(7):837-845
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8Conference
Authors: Perrais, G., Derelle, S., Mollard, L., Chamonal, J. P., Destefanis, G., Vincent, G., Bernhardt, S., Rothman, J.
Source: JOURNAL OF ELECTRONIC MATERIALS. 38(8):1790-1799
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9Conference
Authors: Rothman, J., Baier, N., Ballet, P., Mollard, L., Fournier, M., Gout, J. S., Chamonal, J. P.
Source: JOURNAL OF ELECTRONIC MATERIALS. 38(8):1707-1716
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10Conference
Authors: Rothman, J., Perrais, G., Ballet, P., Mollard, L., Gout, S., Chamonal, J.-P.
Source: JOURNAL OF ELECTRONIC MATERIALS. 37(9):1303-1310
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11Conference
Authors: Gravrand, O., Borniol, E., Bisotto, S., Mollard, L., Destefanis, G.
Source: JOURNAL OF ELECTRONIC MATERIALS. 36(8):981-987
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12Conference
Authors: Tortai, J. H., Thiault, J., Tiron, R., Mollard, L., Haefele, S., Vychub, S., Lewellen, J., Brooker, P.
Source: PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. 5835:82-88
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13Conference
Authors: Mollard, L., Cunge, G., Tedesco, S., Dal zotto, B., Foucher, J.
Source: MICROELECTRONIC ENGINEERING. 61-62:755-762
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14Conference
Authors: Mollard, L., Tedesco, S., Dal zotto, B., Jaubert, V., Pain, L., Fanget, G., Comboroure, C.
Source: MICROELECTRONIC ENGINEERING. 57-58:269-275
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15Academic Journal
Authors: Lobre, C., Jalabert, D., Vickridge, I., Briand, E., Benzeggouta, D., Mollard, L., Jouneau, P.H., Ballet, P.
Source: In Nuclear Inst. and Methods in Physics Research, B 15 October 2013 313:76-80
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16Periodical
Authors: Baier, N., Cervera, C., Gravrand, O., Mollard, L., Lobre, C., Destefanis, G., Bourgeois, G., Zanatta, J. P., Boulade, O., Moreau, V.
Source: JOURNAL OF ELECTRONIC MATERIALS. 44(9):3144-3150
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17Periodical
Authors: Lobre, C., Jouneau, P. H., Mollard, L., Ballet, P.
Source: JOURNAL OF ELECTRONIC MATERIALS. 43(8):2908-2914
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18Periodical
Authors: Mollard, L., Bourgeois, G., Lobre, C., Gout, S., Viollet-Bosson, S., Baier, N., Destefanis, G., Gravrand, O., Barnes, J. P., Milesi, F.
Source: JOURNAL OF ELECTRONIC MATERIALS. 43(3):802-807
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19Academic Journal
Authors: Mollard, L., Riu, J., Royo, S., Dieppedale, C., Hamelin, A., Koumela, A., Verdot, T., Frey, L., Le Rhun, G., Castellan, G., Licitra, C.
Source: Micromachines; May2023, Vol. 14 Issue 5, p1019, 13p
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20Periodical
Authors: Chahdi Beltrame, M., del Bueno, M.L., Cervantes, G., Mollard, L., Lenz, M., Quiñonez, E., Mattera, F.J.
Source: HPB. 24(S1):S579-S579