AC filter inductor design for three-phase PWM inverter

Authors: Mizutani, Daisuke, Matsumori, Hiroaki, Kosaka, Takashi, Matsui, Nobuyuki, Miyazaki, Tatsuya, Okawauchi, Yuta

Source: 2020 23rd International Conference on Electrical Machines and Systems (ICEMS) Electrical Machines and Systems (ICEMS), 2020 23rd International Conference on. :1501-1505 Nov, 2020

Relation: 2020 23rd International Conference on Electrical Machines and Systems (ICEMS)

Flux Profiling Control-Based Noise and Vibration Reduction of SR Motor for Automobile Traction Drive

Authors: Kosaka, Takashi, Shin, Sunyong, Morishita, Soshi, Mizutani, Daisuke, Matsumori, Hiroaki, Mastui, Nobuyuki

Source: 2019 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2019 IEEE. :7098-7104 Sep, 2019

Relation: 2019 IEEE Energy Conversion Congress and Exposition (ECCE)

Improved Structure for Package Substrates with Embedded Thin-Film Capacitor

Authors: Akahoshi, Tomoyuki, Mizutani, Daisuke, Fukui, Kei, Yamawaki, Seigo, Fujisaki, Hidehiko, Watanabe, Manabu, Koide, Masateru

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1294-1299 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module

Authors: Iwai, Toshiki, Sakai, Taiji, Mizutani, Daisuke, Sakuyama, Seiki, Iida, Kenji, Inaba, Takayuki, Fujisaki, Hidehiko, Tamura, Akira, Miyazawa, Yoshinori

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1952-1957 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Correlation between Insertion Loss and Interface Relative Conductivity

Authors: Fukumori, Taiga, Akahoshi, Tomoyuki, Mizutani, Daisuke, Sakuyama, Seiki

Source: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :320-324 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

Simulation Approach to Predict Warpage based on Resin Curing Behavior during Substrate Manufacturing Process

Authors: Furuyama, Masaharu, Nagaoka, Hideaki, Akahoshi, Tomoyuki, Mizutani, Daisuke, Sakuyama, Seiki, Nagatake, Mami, Itoh, Nobutaka

Source: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :162-166 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

Glass Multilayer Package Substrate using Conductive Paste Via Connection

Authors: Iwai, Toshiki, Sakai, Taiji, Mizutani, Daisuke, Sakuyama, Seiki, Iida, Kenji, Inaba, Takayuki, Fujisaki, Hidehiko, Tamura, Akira, Miyazawa, Yoshinori

Source: 2018 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2018 IEEE. :105-108 Nov, 2018

Relation: 2018 IEEE CPMT Symposium Japan (ICSJ)

Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin

Authors: Nagaoka, Hideaki, Furuyama, Masaharu, Akahoshi, Tomoyuki, Mizutani, Daisuke, Sakuyama, Seiki, Nagatake, Mami, Itoh, Nobutaka

Source: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :135-138 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

A Novel Inorganic Substrate by Three Dimensionally Stacked Glass Core Technology

Authors: Iwai, Toshiki, Sakai, Taiji, Mizutani, Daisuke, Sakuyama, Seiki, Iida, Kenji, Inaba, Takayuki, Fujisaki, Hidehiko, Miyazawa, Yoshinori

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1987-1992 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Development of large-size CPU package structure using embedded thin film capacitor substrate

Authors: Koide, Masateru, Fukuzono, Kenji, Watanabe, Manabu, Fujisaki, Hidehiko, Yamawaki, Seigo, Fukui, Kei, Mizutani, Daisuke, Akahoshi, Tomoyuki, Nonomura, Kazuhiro, Adachi, Hiroyuki, Yamada, Jun

Source: 2017 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2017 IEEE. :159-162 Nov, 2017

Relation: 2017 IEEE CPMT Symposium Japan (ICSJ)

Investigation of pre-processing method to detect selective attention to auditory oddball sequences

Authors: Mizutani, Daisuke, Kanoh, Shin'ichiro

Source: 2017 10th Biomedical Engineering International Conference (BMEiCON) Biomedical Engineering International Conference (BMEiCON), 2017 10th. :1-5 Aug, 2017

Relation: 2017 10th Biomedical Engineering International Conference (BMEiCON)

Development of CPU Package Embedded with Multilayer Thin Film Capacitor for Stabilization of Power Supply

Authors: Akahoshi, Tomoyuki, Mizutani, Daisuke, Fukui, Kei, Yamawaki, Seigo, Fujisaki, Hidehiko, Watanabe, Manabu, Koide, Masateru

Source: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :179-184 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Perioperative Antiplatelet Therapy for the Stent-Assisted Coil Embolization: Results of the Questionnaire Survey

Authors: Matsubara, Hirofumi, Mizutani, Daisuke, Egashira, Yusuke, Enomoto, Yukiko

Source: Journal of neuroendovascular therapy. 17(2):56-60

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN631922919&indx=1&recIds=ETOCRN631922919

Viscoelastic analysis of multistage stacked via structure in build-up substrate

Authors: Nagaoka, Hideaki, Akahoshi, Tomoyuki, Furuyama, Masaharu, Mizutani, Daisuke

Source: 2016 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2016 International Conference on. :548-552 Apr, 2016

Relation: 2016 International Conference on Electronics Packaging (ICEP)

Measurement of high-frequency conductivity affected by conductor surface roughness using dielectric rod resonator method

Authors: Iwai, Toshiki, Mizutani, Daisuke, Tani, Motoaki

Source: 2015 IEEE International Symposium on Electromagnetic Compatibility (EMC) Electromagnetic Compatibility (EMC), 2015 IEEE International Symposium on. :634-639 Aug, 2015

Relation: 2015 IEEE International Symposium on Electromagnetic Compatibility - EMC 2015

Simulation of differential skew considering fiber kink effects

Authors: Fukumori, Taiga, Nagaoka, Hideaki, Mizutani, Daisuke, Tani, Motoaki

Source: IEEE CPMT Symposium Japan 2014 CPMT Symposium Japan (ICSJ), 2014 IEEE. :43-46 Nov, 2014

Relation: 2014 IEEE CPMT Symposium Japan (ICSJ)

Development of second-level connection method for large-size CPU package

Authors: Baba, Shunji, Koide, Masateru, Watanabe, Manabu, Fukuzono, Kenji, Yamamoto, Tsuyoshi, Sakuyama, Seiki, Shimizu, Kozo, Okamoto, Keishiro, Mizutani, Daisuke

Source: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :68-73 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Electrical characteristics of build-up substrates using new via structures

Authors: Akahoshi, Tomoyuki, Mizutani, Daisuke, Tani, Motoaki, Abe, Kenichirou, Baba, Syunji, Koide, Masateru

Source: 2014 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2014 International Conference on. :490-493 Apr, 2014

Relation: 2014 International Conference on Electronics Packaging (ICEP)

The effect of surface roughness on high frequency transmission line

Authors: Iwai, Toshiki, Mizutani, Daisuke, Tani, Motoaki

Source: 2013 3rd IEEE CPMT Symposium Japan CPMT Symposium Japan (ICSJ), 2013 IEEE 3rd. :1-4 Nov, 2013

Relation: 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

Characterization of signal via structure in multilayer printed circuit boards up to 50 GHz

Authors: Fukumori, Taiga, Mizutani, Daisuke

Source: 2012 2nd IEEE CPMT Symposium Japan CPMT Symposium Japan, 2012 2nd IEEE. :1-4 Dec, 2012

Relation: 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)