Unique composite architecture of phosphor-in-glass film coated on different heat-conducting substrates for high-brightness laser lighting

Authors: Xin Liu, Mingxiang Chen, Jiuzhou Zhao, Hongjin Zhang, Yang Peng, Qing Wang

Source: Journal of Advanced Ceramics, Vol 14, Iss 2, p 9221027 (2025)

Subject Terms: luminescent materials, phosphor-in-glass film (pigf), heat-conducting substrate (hcs), laser lighting, optical–thermal performances, Clay industries. Ceramics. Glass, TP785-869

File Description: electronic resource

Relation: https://www.sciopen.com/article/10.26599/JAC.2024.9221027; https://doaj.org/toc/2226-4108; https://doaj.org/toc/2227-8508

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Laser spot associated high-saturation phosphor-in-glass film for transmissive and reflective high-brightness laser lighting

Authors: Zikang Yu, Jiuzhou Zhao, Qing Wang, Yun Mou, Mingxiang Chen, Yang Peng

Source: Journal of Advanced Ceramics, Vol 12, Iss 9, Pp 1821-1832 (2023)

Subject Terms: phosphor-in-glass (pig) film, white laser lighting, high luminescence saturation, laser spot regulation, opto-thermal performances, Clay industries. Ceramics. Glass, TP785-869

File Description: electronic resource

Relation: https://www.sciopen.com/article/10.26599/JAC.2023.9220790; https://doaj.org/toc/2226-4108; https://doaj.org/toc/2227-8508

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Role of Kupffer cells in tolerance induction after liver transplantation

Authors: Weixiong Zheng, Lingxiang Yang, Shiming Jiang, Mingxiang Chen, Jinzheng Li, Zuojing Liu, Zhongjun Wu, Jianping Gong, Yong Chen

Source: Frontiers in Cell and Developmental Biology, Vol 11 (2023)

Subject Terms: Kupffer, liver transplantation, immune tolerance, macrophage polarization, acute rejection, Biology (General), QH301-705.5

File Description: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fcell.2023.1179077/full; https://doaj.org/toc/2296-634X

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Exploration of the Mechanisms of Differential Indole Alkaloid Biosynthesis in Dedifferentiated and Cambial Meristematic Cells of Catharanthus roseus Using Transcriptome Sequencing

Authors: Pengfei Zhou, Mingxiang Chen

Source: Frontiers in Genetics, Vol 13 (2022)

Subject Terms: indole alkaloid biosynthesis, MAPK signaling, periwinkle, plant-hormone signaling, tissue culture, vindoline, Genetics, QH426-470

File Description: electronic resource

Relation: https://www.frontiersin.org/articles/10.3389/fgene.2022.867064/full; https://doaj.org/toc/1664-8021

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VvMYBPA2 Regulated the Accumulation of Flavan-3-ols though Forming a Trimeric Complex in ‘Zaoheibao’ Grape

Authors: Changmei Liang, Jianyong Guo, Mingxiang Chen, Xuehui Zhang, Guorong Zhang, Pengfei Zhang, Jinjun Liang, Pengfei Wen

Source: Agriculture, Vol 12, Iss 9, p 1414 (2022)

Subject Terms: grape, flavan-3-ols, proanthocyanidins, VvMYBPA2, MBW complex, Agriculture (General), S1-972

File Description: electronic resource

Relation: https://www.mdpi.com/2077-0472/12/9/1414; https://doaj.org/toc/2077-0472

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Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives

Authors: Qing Wang, Yang Peng, Yun Mou, Mingxiang Chen

Source: Micromachines, Vol 13, Iss 9, p 1539 (2022)

Subject Terms: through hole filling, high aspect-ratio, defect-free filling, copper interconnection, Mechanical engineering and machinery, TJ1-1570

File Description: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/9/1539; https://doaj.org/toc/2072-666X

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Study on Nanoporous Graphene-Based Hybrid Architecture for Surface Bonding

Authors: Xiaohui Song, Mingxiang Chen, Jingshuang Zhang, Rui Zhang, Wei Zhang

Source: Nanomaterials, Vol 12, Iss 14, p 2483 (2022)

Subject Terms: surface bonding, nanoporous graphene, Chemistry, QD1-999

File Description: electronic resource

Relation: https://www.mdpi.com/2079-4991/12/14/2483; https://doaj.org/toc/2079-4991

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Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

Authors: Jiaxin Liu, Yun Mou, Yueming Huang, Jiuzhou Zhao, Yang Peng, Mingxiang Chen

Source: Micromachines, Vol 13, Iss 6, p 958 (2022)

Subject Terms: Ag nanoparticle, sintering, bonding material, high-temperature reliability, high-power LED, Mechanical engineering and machinery, TJ1-1570

File Description: electronic resource

Relation: https://www.mdpi.com/2072-666X/13/6/958; https://doaj.org/toc/2072-666X

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Low temperature enhanced flexible conductive film by Ag flake/ion composite ink

Authors: Yun Mou, Hao Wang, Yang Peng, Jiaxin Liu, Hao Cheng, Qinglei Sun, Mingxiang Chen

Source: Materials & Design, Vol 186, Iss , Pp - (2020)

Subject Terms: Materials of engineering and construction. Mechanics of materials, TA401-492

File Description: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S0264127519307774; https://doaj.org/toc/0264-1275

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Bonding Strength Test and Tensile Failure Study for Direct Plated Copper Ceramic Substrate

Authors: Yongtong, Wang, Zhe, Wang, Jinglong, Liu, Yang, Peng, Mingxiang, Chen

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Flow Field Simulation Assisted Investigation of Aspect Ratio on Transformation Mechanism of Micro Through Holes Cu Electroplating Performance

Authors: Qing, Wang, Yao, Tong, Mingxiang, Chen

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Copper Filling of High Aspect Ratio Through Ceramic Holes: Effect of Convection on Electrochemical Behavior of Additives

Authors: Qing, Wang, Jiaxin, Liu, Yilin, Wu, Mingxiang, Chen

Source: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Mesoscopic characterization and modeling of microcracking in cementitious materials by the extended finite element method

Authors: Junjie Huang, Mingxiang Chen, Jian Sun

Source: Theoretical and Applied Mechanics Letters, Vol 4, Iss 4 (2014)

Subject Terms: microcracks, extended finite element method, mesoscopic modeling, concrete, Engineering (General). Civil engineering (General), TA1-2040

File Description: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2095034915303226; https://doaj.org/toc/2095-0349

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Experiment analysis of multi-functional Trombe wall modul based on enhanced heat transfer micro-channel plate

Authors: Zhongting, Hu, Pengkun, Yu, Mingxiang, Chen, Zhihao, Hou, Shenghan, Gao, Yonglong, Chen

Source: Taiyangneng xuebao. 43(2):249-259

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN629893932&indx=1&recIds=ETOCRN629893932

Research of large-scale directed assembly of carbon nanotube film

Authors: Qiang Lv, Jian Xu, Mingxiang Chen, Zhiyin Gan

Source: 2011 International Conference on Electric Information and Control Engineering Electric Information and Control Engineering (ICEICE), 2011 International Conference on. :4382-4385 Apr, 2011

Relation: 2011 International Conference on Electric Information and Control Engineering (ICEICE)

Die bonding of silicon and other materials with active solder

Authors: Cong Peng, Mingxiang Chen, Sheng Liu

Source: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on. :275-278 Aug, 2010

Relation: 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Rapid and Selective Induction Heating for Sensor Packaging

Authors: Mingxiang Chen, Xinjian Yi, Liulin Yuan, Zhiyin Gan, Sheng liu

Source: 2005 6th International Conference on Electronic Packaging Technology Electronics Packaging Technology Electronic Packaging Technology, 2005 6th International Conference on. :1-4 2005

Relation: 2005 6th International Conference on Electronics Packaging Technology

Eutectic bonding on large silicon die using deposited gold-tin multilayer composites

Authors: Mingxiang Chen, Sihai Chen, Xinjian Yi, Shan Dong, Sheng Liu

Source: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :147-150 2003

Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

Research on wafer scale bonding method based on gold-tin eutectic solders [MEMS packaging]

Authors: Sihai Chen, Mingxiang Chen, Xinjian Yi, Honghai Zhang, Sheng Liu

Source: Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. Electronic packaging technology Electronic Packaging Technology Proceedings, 2003. ICEPT 2003. Fifth International Conference on. :187-189 2003

Relation: ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings

Thermo-mechanical analysis of a wafer level packaging by induction heating

Authors: Wenming Liu, Mingxiang Chen, Yanyan Xi, Changyong Lin, Sheng Liu

Source: 2008 International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on. :1-5 Jul, 2008

Relation: 2008 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)