Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction

Authors: Baek, Kyungmin, Han, Min-soo, Han, Il Young, Shin Lee, Jung, Sim, Jaeuk, Lee, Joongha, Min, Daeho, Lim, Kyeongbin, Rhee, Minwoo Daniel

Source: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1256-1259 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process
ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems

Authors: Min, Daeho, Han, Minsoo, Kim, Juno, Lee, Kangsan, Lim, Kyeongbin, Choi, Euisun, Seok, Seung Dae, Lee, Byeongjun, Rhee, Minwoo Daniel

Source: IPACK. 2022:V001T05A002-V001T05A002

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN607927817&indx=1&recIds=ETOCCN607927817

ACCURATE AND EFFICIENT PREDICTION ON SUCTION ERFORMANCE OF THERMAL VAPOR COMPRESSOR USING MULTI-PHASE FLOW COMPUTATIONS (AIAA 2017-4290)
AIAA computational fluid dynamics conference

Authors: Min, Daeho, Lee, Hoonsik, Kim, Hyeongjun, Lee, Hoon, Lee, Chaesoo, Kim, Chongam

Source: Papers American Institute of Aeronautics and Astronautics. 4284-4510:2098-2112

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN602678414&indx=1&recIds=ETOCCN602678414

Accurate and efficient computations of phase-changing flows in thermal vapor compressors

Authors: Min, Daeho, Kim, Hyeongjun, Lee, Hoon, Lee, Chaesoo, Kim, Chongam

Source: In Applied Thermal Engineering 5 January 2018 128:320-334