Showing 1 - 20 results of 45,277 Refine Results
  1. 1
    Conference

    Source: 2024 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2024 IEEE. :662-669 Oct, 2024

    Relation: 2024 IEEE Energy Conversion Congress and Exposition (ECCE)

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  5. 5
    Conference

    Source: 2024 IEEE 17th Pacific Visualization Conference (PacificVis) PACIFICVIS Pacific Visualization Conference (PacificVis), 2024 IEEE 17th. :252-261 Apr, 2024

    Relation: 2024 IEEE 17th Pacific Visualization Conference (PacificVis)

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    Academic Journal

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  9. 9
    Conference

    Source: 2024 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2024 IEEE International. :1-3 Jun, 2024

    Relation: 2024 IEEE International Interconnect Technology Conference (IITC)

  10. 10
    Academic Journal
  11. 11
    Report

    Authors: Adderley, P. A., Ahmed, S., Allison, T., Bachimanchi, R., Baggett, K., BastaniNejad, M., Bevins, B., Bevins, M., Bickley, M., Bodenstein, R. M., Bogacz, S. A., Bruker, M., Burrill, A., Cardman, L., Creel, J., Chao, Y. -C., Cheng, G., Ciovati, G., Chattopadhyay, S., Clark, J., Clemens, W. A., Croke, G., Daly, E., Davis, G. K., Delayen, J., De Silva, S. U., Dickson, R., Diaz, M., Drury, M., Doolittle, L., Douglas, D., Feldl, E., Fischer, J., Freyberger, A., Ganni, V., Geng, R. L., Ginsburg, C., Gomez, J., Grames, J., Gubeli, J., Guo, J., Hannon, F., Hansknecht, J., Harwood, L., Henry, J., Hernandez-Garcia, C., Higgins, S., Higinbotham, D., Hofler, A. S., Hiatt, T., Hogan, J., Hovater, C., Hutton, A., Jones, C., Jordan, K., Joyce, M., Kazimi, R., Keesee, M., Kelley, M. J., Keppel, C., Kimber, A., King, L., Kjeldsen, P., Kneisel, P., Koval, J., Krafft, G. A., Lahti, G., Larrieu, T., Lauze, R., Leemann, C., Legg, R., Li, R., Lin, F., Machie, D., Mammosser, J., Macha, K., Mahoney, K., Marhauser, F., Mastracci, B., Matalevich, J., McCarter, J., McCaughan, M., Merminga, L., Michaud, R., Morozov, V., Mounts, C., Musson, J., Nelson, R., Oren, W., Overton, R. B., Palacios-Serrano, G., Park, H. -K., Phillips, L., Philip, S., Pilat, F., Plawski, T., Poelker, M., Powers, P., Powers, T., Preble, J., Reilly, T., Rimmer, R., Reece, C., Robertson, H., Roblin, Y., Rode, C., Satogata, T., Seidman, D. J., Seryi, A., Shabalina, A., Shin, I., Slominski, R., Slominski, C., Spata, M., Spell, D., Spradlin, J., Stirbet, M., Stutzman, M. L., Suhring, S., Surles-Law, K., Suleiman, R., Tennant, C., Tian, H., Turner, D., Tiefenback, M., Trofimova, O., Valente, A. -M., Wang, H., Wang, Y., White, K., Whitlatch, C., Whitlatch, T., Wiseman, M., Wissman, M. J., Wu, G., Yang, S., Yunn, B., Zhang, S., Zhang, Y.

    Source: Phys. Rev. Accel. Beams 27 (2024) 084802

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  13. 13
    Report

    Source: IEEE/RSJ International Conference on Intelligent Robots and Systems, Chicago, IL, USA, 2014, pp. 2661-2666

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  17. 17
    Report

    Authors: SuperCDMS Collaboration, Albakry, M. F., Alkhatib, I., Alonso-González, D., Amaral, D. W. P., Anczarski, J., Aralis, T., Aramaki, T., Arnquist, I. J., Langroudy, I. Ataee, Azadbakht, E., Bathurst, C., Bhattacharyya, R., Biffl, A. J., Brink, P. L., Buchanan, M., Bunker, R., Cabrera, B., Calkins, R., Cameron, R. A., Cartaro, C., Cerdeño, D. G., Chang, Y. -Y., Chaudhuri, M., Chen, J. -H., Chen, R., Chott, N., Cooley, J., Coombes, H., Cushman, P., Cyna, R., Das, S., De Brienne, F., Dharani, S., di Vacri, M. L., Diamond, M. D., Elwan, M., Fascione, E., Figueroa-Feliciano, E., Fouts, K., Fritts, M., Germond, R., Ghaith, M., Golwala, S. R., Hall, J., Harms, S. A. S., Harris, K., Hassan, N., Hong, Z., Hoppe, E. W., Hsu, L., Huber, M. E., Iyer, V., Jardin, D., Kashyap, V. K. S., Keller, S. T. D., Kelsey, M. H., Kennard, K. T., Kubik, A., Kurinsky, N. A., Lee, M., Leyva, J., Liu, J., Liu, Y., Loer, B., Asamar, E. Lopez, Lukens, P., MacFarlane, D. B., Mahapatra, R., Mammo, J. S., Mast, N., Mayer, A. J., Theenhausen, H. Meyer zu, Michaud, É., Michielin, E., Mirabolfathi, N., Mirzakhani, M., Mohanty, B., Monteiro, D., Nelson, J., Neog, H., Novati, V., Orrell, J. L., Osborne, M. D., Oser, S. M., Pandey, L., Pandey, S., Partridge, R., Pedreros, D. S., Peng, W., Perna, L., Perry, W. L., Podviianiuk, R., Poudel, S. S., Pradeep, A., Pyle, M., Rau, W., Reid, E., Ren, R., Reynolds, T., Rios, M., Roberts, A., Robinson, A. E., Ryan, J. L., Saab, T., Sadek, D., Sadoulet, B., Sahoo, S. P., Saikia, I., Sander, J., Sattari, A., Schmidt, B., Schnee, R. W., Scorza, S., Serfass, B., Simchony, A., Sincavage, D. J., Sinervo, P., Street, J., Sun, H., Tanner, E., Terry, G. D., Toback, D., Verma, S., Villano, A. N., von Krosigk, B., Watkins, S. L., Wen, O., Williams, Z., Wilson, M. J., Winchell, J., Wykoff, K., Yellin, S., Young, B. A., Yu, T. C., Zatschler, B., Zatschler, S., Zaytsev, A., Zhang, E., Zheng, L., Zuniga, A., Zurowski, M. J.

  18. 18
    Conference

    Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

    Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

  19. 19
    Conference

    Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

    Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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