Array Packaging with Integrated Mirrors for High Power Multi-Chip UVC-LED Modules

Authors: Hansen, Ulli, Hu, Xiaodong, Maus, Simon, Gyenge, Oliver

Source: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-5 Sep, 2024

Relation: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

Low Stress Solution of Anodic Bonding Technology with SW-YY® Glass for Sensitive MEMS

Authors: Hu, Xiaodong, Mackowiak, Piotr, Baeuscher, Manuel, Zhang, Yucheng, Wang, Bei, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Ehrmann, Oswin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Source: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :251-255 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensor

Authors: Hu, Xiaodong, Mackowiak, P., Zhang, Yucheng, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Meng, Maozhou, Ngo, Ha-Duong

Source: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-6 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Investigation of residual stress effect during the anodic bonding process with different bondable materials for wafer level packaging design

Authors: Hu, Xiaodong, Meng, Maozhou, Baeuscher, Manuel, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Mackowiak, Piotr, Mukhopadhyay, Biswajit, Vokmer, N., Ehrmann, Oswin, Dieter Lang, Klaus, Ngo, Ha-Duong

Source: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :325-330 Nov, 2016

Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Characterization of anodic bondable LTCC for wafer-level packaging

Authors: Hu, Xiaodong, Bauscher, Manuel, Mackowiak, Piotr, Zhang, Yucheng, Hoelck, Ole, Walter, Hans, Ihle, Martin, Ziesche, Steffen, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Mukhopadhyay, Biswajit, Ehrmann, Oswin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Source: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :501-505 Nov, 2016

Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Hermetic wafer-level glass sealing enabling reliable low cost sensor packaging

Authors: Hansen, Ulli, Maus, Simon, Topper, Michael

Source: 2013 IEEE 63rd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd. :1524-1530 May, 2013

Relation: 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC)

Low temperature glass-thin-films for use in power applications

Authors: Leib, Juergen, Gyenge, Oliver, Hansen, Ulli, Maus, Simon, Hauck, Karin, Ndip, Ivan, Toepper, Michael

Source: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :255-261 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Wafer-level glass-caps for advanced optical applications

Authors: Leib, Juergen, Gyenge, Oliver, Hansen, Ulli, Maus, Simon, Hauck, Karin, Zoschke, Kai, Toepper, Michael

Source: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1642-1648 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Anodic bonding at low voltage using microstructured borosilicate glass thin-films

Authors: Leib, Juergen, Hansen, Ulli, Maus, Simon, Feindt, Holger, Hauck, Karin, Zoschke, Kai, Toepper, Michael

Source: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-4 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices

Authors: Hansen, Ulli, Maus, Simon, Leib, Juergen, Toepper, Michael

Source: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-5 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

Thin hermetic borosilicate glass layers for highly reliable chip-passivations in wafer-level-packaging

Authors: Hansen, Ulli, Leib, Jurgen, Maus, Simon, Gyenge, Oliver, Topper, Michael

Source: 2009 European Microelectronics and Packaging Conference Microelectronics and Packaging Conference, 2009. EMPC 2009. European. :1-7 Jun, 2009

Relation: 2009 European Microelectronics and Packaging Conference (EMPC)

Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology

Authors: Leib, Juergen, Gyenge, Oliver, Hansen, Ulli, Maus, Simon, Fischer, Thorsten, Zoschke, Kai, Toepper, Michael

Source: 2009 59th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2009. ECTC 2009. 59th. :886-891 May, 2009

Relation: 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009)

Wafer-Level Glass Capping as Drop-in for Miniaturized, Advanced Optical COB Packaging

Authors: Seidemann, Volker, Gyenge, Oliver, Hansen, Ulli, Heuser, Thorsten, Maus, Simon, Mund, Dietrich, Espertshuber, Klaus, Wilke, Ralph, Leib, Jurgen

Source: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :600-604 Jun, 2007

Relation: 2007 57th Electronic Components and Technology Conference

Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrate

Method for manufacturing an arrangement with a component on a carrier substrate and a method for manufacturing a semi-finished product

Method for producing a dielectric layer in an electroacoustic component, and electroacoustic component

METHOD FOR MANUFACTURING AN ARRANGEMENT WITH A COMPONENT ON A CARRIER SUBSTRATE, AN ARRANGEMENT AND METHOD FOR MANUFACTURING A SEMI-FINISHED PRODUCT, AND A SEMI-FINISHED PRODUCT

METHOD FOR PRODUCING A DIELECTRIC LAYER IN AN ELECTROACOUSTIC COMPONENT, AND ELECTROACOUSTIC COMPONENT

(Invited) MEMS Capping By Anodic Bonding of Evaporated Glass Thin Films
Pacific Rim Meeting on Electrochemical and Solid-State Science 2016

Authors: Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Hu, Xiaodong

Source: Meeting abstracts / Electrochemical Society. 230(3):2100-2100

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN602105260&indx=1&recIds=ETOCCN602105260

Hermetic SMD-type reflector cavity packaging for DUV LEDs

Authors: Kim, Jong Kyu, Krames, Michael R., Strassburg, Martin, Hansen, Ulli, Maus, Simon, Gyenge, Oliver, Hu, Xiaodong, Queisser, Marco, Marx, Sebastian

Source: Proceedings of SPIE; March 2020, Vol. 11302 Issue: 1 p113021F-113021F-6, 1017196p