Formation of Au Hollow Micro-Bump Arrays for Low Temperature Au-Au Bonding

Authors: Goto, Shintaro, Takeuchi, Kai, Huong Thu, Le Hac, Matsumae, Takashi, Takagi, Hideki, Kurashima, Yuichi, Higurashi, Eiji

Source: 2024 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2024 IEEE. :150-151 Nov, 2024

Relation: 2024 IEEE CPMT Symposium Japan (ICSJ)

Effect of Ar-Fast Atom Beam Irradiaon on n-Ga2O3/n-Si Electrical Conductance

Authors: Matsumae, Takashi, Kurashima, Yuichi, Nemoto, Ryoichi, Sasaki, Kohei, Suyama, Atsushi, Yokota, Kazuhiro, Miida, Takashi, Kurachi, Ikuo, Takagi, Hideki

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Au Flat Micro-Bump Arrays Fabricated by Transfer and Coining of Au Thin Films

Authors: Goto, Shintaro, Takeuchi, Kai, Huong Thu, Le Hac, Matsumae, Takashi, Takagi, Hideki, Kurashima, Yuichi, Higurashi, Eiji

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Crystal Orientation Dependence of Low-Temperature Bonding Using Germanium and Diamond Substrates

Authors: Minowa, Yuki, Matsumae, Takashi, Kurashima, Yuichi, Hayase, Masanori, Takagi, Hideki

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

20-mm-Square GaN/Diamond Bonding Without Vacuum Process

Authors: Matsumae, Takashi, Kurashima, Yuichi, Takahashi, Yukiko, Akabane, Yuko, Takagi, Hideki

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Preparation of GaN-HEMTs Devices Bonded to 150μ m Thick Diamond Substrate

Authors: Shirayanagi, Yusuke, Tomohisa, Shingo, Kasamura, Keiji, Toyoda, Hiroki, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Kubota, Akihisa, Takenaga, Takashi

Source: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2024 8th International Workshop on. :1-1 Oct, 2024

Relation: 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces

Authors: Koseki, Shogo, Ogino, Mika, Takeuchi, Kai, Thu, Le Hac Huong, Matsumae, Takashi, Takagi, Hideki, Kurashima, Yuichi, Tsuda, Takahiro, Tokuhisa, Tomoaki, Shimizu, Toshikazu, Higurashi, Eiji

Source: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :129-130 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

Direct bonding of Germanium and Diamond substrates by reduction process

Authors: Minowa, Yuki, Matsumae, Takashi, Hayase, Masanori, Kurashima, Yuichi, Takagi, Hideki

Source: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :119-120 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

Direct bonding of germanium and diamond substrates by hydrophilic bonding

Authors: Minowa, Yuki, Matsumae, Takashi, Hayase, Masanori, Kurashima, Yuichi, Takagi, Hideki

Source: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :171-172 Apr, 2023

Relation: 2023 International Conference on Electronics Packaging (ICEP)

Low-temperature bonding of HCl-dipped Ge substrate with diamond heat-spreader through atomically thin layer

Authors: Minowa, Yuki ^{a, b}, Matsumae, Takashi ^{b, ⁎}, Kurashima, Yuichi ^b, Takagi, Hideki ^b, Hayase, Masanori ^a

Source: In Materialia March 2025 39

Room temperature bonding of Au plating through surface smoothing using polyimide template stripping

Authors: Takeuchi, Kai ^a, Koseki, Shogo ^a, Thu, Le Hac Huong ^b, Matsumae, Takashi ^b, Takagi, Hideki ^b, Kurashima, Yuichi ^b, Tsuda, Takahiro ^c, Tokuhisa, Tomoaki ^c, Shimizu, Toshikazu ^c, Higurashi, Eiji ^{a, ⁎}

Source: In Sensors and Actuators: A. Physical 1 March 2025 383

Micropatterning process of diamond substrates by stamping Ni imprint molds

Authors: Matsumae, Takashi ^⁎, Nishimori, Hiroaki, Kurashima, Yuichi, Takagi, Hideki

Source: In Diamond & Related Materials February 2025 152

Direct Bonding of Diamond and Si Substrates at Low Temperatures Under Atmospheric Conditions

Authors: Matsumae, Takashi, Kurashima, Yuichi, Umezawa, Hitoshi, Takagi, Hideki

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1436-1441 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Formation of smooth Au surfaces produced by multiple thin-film transfer process based on template stripping for low-temperature bonding

Authors: Higurashi, Eiji, Yamamoto, Michitaka, Nishimura, Ryutaro, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :223-228 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Wafer-scale Au-Au surface activated bonding using atmospheric-pressure plasma

Authors: Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Miyake, Toshihiro, Suga, Tadatomo, Itoh, Toshihiro, Higurashi, Eiji

Source: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :361-364 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

Room-Temperature Wafer Bonding Using Smooth Au Thin Films for Integrated Plasmonic Devices

Authors: Yamamoto, Michitaka, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo, Itoh, Toshihiro, Higurashi, Eiji

Source: 2018 International Conference on Optical MEMS and Nanophotonics (OMN) Optical MEMS and Nanophotonics (OMN), 2018 International Conference on. :1-5 Jul, 2018

Relation: 2018 International Conference on Optical MEMS and Nanophotonics (OMN)

Surface activated bonding of Au/Ta layers after degas annealing for MEMS packaging

Authors: Matsumae, Takashi, Yuichi, Kurashima, Higurashi, Eiji, Takagi, Hideki

Source: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :270-275 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

Direct bonding of diamond and Si substrates using NH3/H2O2 cleaning

Authors: Fukumoto, Shoya, Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Umezawa, Hitoshi, Hayase, Masanori, Higurashi, Eiji

Source: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :41-42 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)

Surface activated bonding of Nb-Nb for surperconducting device interconnect

Authors: Takahashi, Yuta, Fujino, Masahisa, Matsumae, Takashi, Nakagawa, Hiroshi, Kikuchi, Katsuya, Taino, Tohru

Source: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :21-22 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)

Room-Temperature bonding of AlN ceramic and Si semiconductor substrates for improved thermal management

Authors: Matsumae, Takashi, Kurashima, Yuichi, Takagi, Hideki, Nishizono, Kazunori, Amano, Tsutomu, Higurashi, Eiji

Source: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :5-6 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)