Flip chip interconnects based on carbon nanofibers-solder composites

Authors: Passalacqua, E., Laprais, C., Bylund, M., Li, Q., Marknas, V., Andersson, R., Saleem, Amin M., Desmaris, V.

Source: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2229-2234 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Ultrathin High-Density Capacitors based on Carbon Nanofibers Fabricated on Silicon, Alumina and Glass Interposer Materials

Authors: Passalacqua, E., Saleem, A. M., Bylund, M., Andersson, R., Marknas, V., Krause, S., Kabir, S., Desmaris, V.

Source: 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO) Nanotechnology (IEEE-NANO), 2020 IEEE 20th International Conference on. :213-216 Jul, 2020

Relation: 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO)