Defect improvement by optimizing electroplating in BEOL sub-50nm pitch

Authors: Ahmed, Shafaat, Shah, Ketan, Cheng, Tien-Jen, da Silva, Adam, Sharma, Mukta, Lin, Teng-Yin, Koli, Dinesh, Mahalingam, Anbu Selvam K M, Grunow, Stephan, Child, Craig

Source: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2017 28th Annual SEMI. :18-23 May, 2017

Relation: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Nested interconnect macro electrical yield improvement for advanced triple patterning integration

Authors: Silvestre, Mary Claire, He, Ming, Mahalingam, Anbu Selvam K M, Child, Craig, Roux, Alycia, Low, Chun Hui, Fisher, Daniel, Zhou, Yue, Park, DeNeil, Karakoy, Mert

Source: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2017 28th Annual SEMI. :10-14 May, 2017

Relation: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Trench first metal hardmask post-lithography novel rework process for defectivity and yield improvement

Authors: Silvestre, Mary Claire, Gogna, Mukesh, Mahalingam, Anbu Selvam K M, Ramanathan, Eswar, Ordonio, Christopher, Schaller, John

Source: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :446-450 May, 2016

Relation: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Metal wiring critical dimension shrink using ALD spacer in BEOL sub-50nm pitch

Authors: Shah, Ketan, Periasamy, Prakash, Chandrasekhar, Ashwini, Mahalingam, Anbu Selvam K M, Pal, Shyam, Ordonio, Christopher, Welti, Peter, Low, Chun Hui, Child, Craig

Source: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :316-319 May, 2016

Relation: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Optimization of wet clean and its impact on sub-50 nm pitch BEOL yield

Authors: Islam, A K M Sajjadul, Periasamy, Prakash, Chandrasekhar, Ashwini, Mahalingam, Anbu Selvam K M, Witt, Christian, Child, Craig

Source: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Advanced Semiconductor Manufacturing Conference (ASMC), 2016 27th Annual SEMI. :364-366 May, 2016

Relation: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

Optimizing Cu barrier thickness for interconnects performance, reliability and yield

Authors: Shen, Tian, Rajagopalan, Balajee, Silvestre, Mary Claire, Ramanathan, Eswar, Mahalingam, Anbu Selvam K M, Zhang, Wenyi, Yeap, Kong Boon, Justison, Patrick

Source: 2016 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2016 IEEE International. :IT-1-1-IT-1-4 Apr, 2016

Relation: 2016 IEEE International Reliability Physics Symposium (IRPS)