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1Conference
Authors: Chang, H. C., Liao, P. J., Chen, S. H., Chang, Y.K., Li, C.P., Liao, W. C., Hsieh, M. H., Yang, H. W., Lee, J. H., Huang, C. M., He, Jun
Source: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :01-04 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
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2Report
Authors: Croxford, Emma, Gao, Yanjun, Pellegrino, Nicholas, Wong, Karen K., Wills, Graham, First, Elliot, Liao, Frank J., Goswami, Cherodeep, Patterson, Brian, Afshar, Majid
Subject Terms: Computer Science - Computation and Language, Computer Science - Artificial Intelligence
Access URL: http://arxiv.org/abs/2409.18170
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3Conference
Authors: Chang, Y. K., Liao, P. J., Liu, Y. S., Chen, P. S., Sou, K. P., Wang, C. H., Huang, T. J., Chuang, W. H., Lee, J. H.
Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Relation: 2023 International Electron Devices Meeting (IEDM)
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4Conference
Authors: Chang, P. C., Liao, P. J., Wu, C. H., Chang, Y. C., Hou, D. H., Ambrosi, E., Lee, H. Y., Lee, J. H., Bao Taiwan, X. Y.
Source: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-5 Mar, 2023
Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)
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5Report
Authors: Liao, Jason J. Z., Asatiani, Ekaterine, Liu, Qingyang, Hou, Kevin
Subject Terms: Statistics - Methodology, Statistics - Applications
Access URL: http://arxiv.org/abs/2309.15333
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6Academic Journal
Authors: Liao, Ray J. T.
Source: Reading in a Foreign Language. Oct 2021 33(2):168-190.
Peer Reviewed: Y
Page Count: 23
Descriptors: Multiple Choice Tests, Test Format, Comparative Analysis, Reading Tests, Second Language Learning, Second Language Instruction, English (Second Language), Reading Comprehension, College Students, Student Attitudes, Verbal Communication, Reading Writing Relationship, Intensive Language Courses
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7Report
Authors: Miao, Guanhong, Liao, Jason J. Z., Yang, Jing, Anderson, Keaven
Subject Terms: Statistics - Applications, 62P10
Access URL: http://arxiv.org/abs/2206.12536
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8Conference
Authors: Ambrosi, E., Wu, C. H., Lee, H. Y., Hsu, C. F., Lee, C. M., Vaziri, S., Datye, I. M., Chen, Y. Y., Hou, D. H., Chang, P. C., Heh, D. W., Liao, P. J., Lee, T. Y., Chang, M. F., Wong, H.-S. P., Bao, X. Y.
Source: 2022 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2022 International. :18.7.1-18.7.4 Dec, 2022
Relation: 2022 IEEE International Electron Devices Meeting (IEDM)
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9Conference
Authors: Yu, Z., Saini, B., Liao, P. J., Chang, Y. K., Hou, V., Nien, C. H., Shih, Y. C., Yeong, S. H., Afanas'Ev, V., Huang, F., Baniecki, J. D., Mehta, A., Chang, C. S., Wong, H.-S. P., Tsai, W., McIntyre, P. C.
Source: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022
Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
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10Conference
Authors: Joshi, Kaustubh, Lee, Yung-Huei, Yao, Yu-Cheng, Chang, Shu-Wen, Bian, Siao-Syong, Liao, P. J., Shih, Jiaw-Ren, Chen, Min-Jan
Source: 2019 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2019 IEEE International. :1-6 Mar, 2019
Relation: 2019 IEEE International Reliability Physics Symposium (IRPS)
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11Academic Journal
Authors: Liao, Ray J. T. (ORCID
0000-0003-4246-1449 )Source: Language Testing. Jan 2023 40(1):86-106.
Peer Reviewed: Y
Page Count: 21
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12Conference
Authors: Huang, Y-H., Liao, P. J., Lee, Y-H., Chen, M. J., Ho, T.Y., Chang, Lucy
Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018
Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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13Conference
Authors: Chang, Y. K., Liao, P. J., Yeong, S. H., Lin, Y.-M., Lee, J. H., Lin, C. T., Yu, Z., Tsai, W., McIntyre, P. C.
Source: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :3A.1-1-3A.1-5 Mar, 2022
Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)
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14Conference
Authors: Chang, P. C., Liao, P. J., Heh, D. W., Lee, C., Hou, D. H., Ambrosi, E., Wu, C. H., Lee, H. Y., Lee, J. H., Bao, X. Y.
Source: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :4A.3-1-4A.3-5 Mar, 2022
Relation: 2022 IEEE International Reliability Physics Symposium (IRPS)
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15Conference
Authors: Wu, C. H., Lee, C. M., Chen, Y. S., Lee, H. Y., Ambrosi, E., Hsu, C. F., Vaziri, S., Chen, Y. Y., Nien, C. H., Hwang, R. L., Liao, P. J., Hou, D. H., Lee, Y.-H., Lee, T. Y., Chen, T. C., Chang, M. F., Wong, H.-S. P., Bao, X. Y.
Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021
Relation: 2021 Symposium on VLSI Technology
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16Conference
Authors: Ambrosi, E., Wu, C. H., Lee, H. Y., Chang, P. C., Hsu, C. F., Lee, C. M., Chang, C. C., Chen, Y. Y, Heh, D. W., Hou, D. H., Liao, P. J., Lee, T. Y., Chang, M. F., Wong, H.-S. P., Bao, X. Y.
Source: 2021 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2021 IEEE International. :28.5.1-28.5.4 Dec, 2021
Relation: 2021 IEEE International Electron Devices Meeting (IEDM)
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17Conference
Authors: Lee, Y.-H., Liao, P. J., Joshi, K., Huang, D. S.
Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-7 Jul, 2017
Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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18Conference
Authors: Chiang, H. L., Chen, T. C., Wang, J. F., Mukhopadhyay, S., Lee, W. K., Chen, C. L., Khwa, W. S., Pulicherla, B., Liao, P. J., Su, K. W., Yu, K. F., Wang, T., Wong, H. S. P., Diaz, C. H., Cai, J.
Source: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Relation: 2020 IEEE Symposium on VLSI Technology
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19Academic Journal
Authors: Park, GoMee (ORCID
0000-0001-5107-0568 ), Ye, Yafei (ORCID0000-0002-3446-7085 ), Liao, Ray J. T. (ORCID0000-0003-4246-1449 )Source: International Journal of Science Education. 2022 44(18):2763-2782.
Peer Reviewed: Y
Page Count: 20
Descriptors: Science Instruction, Printed Materials, Electronic Publishing, Instructional Materials, Connected Discourse, Reading Comprehension, Middle School Students, Textbooks, Comparative Analysis, Technology Uses in Education, Pandemics, COVID-19, Form Classes (Languages), Teaching Methods, English (Second Language), Second Language Learning, English Language Learners
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20Report
Authors: Xie, H. D., Huang, R. Z., Han, X. J., Yan, X., Zhao, H. H., Xie, Z. Y., Liao, H. J., Xiang, T.
Source: Phys. Rev. B 97, 075111 (2018)
Subject Terms: Condensed Matter - Strongly Correlated Electrons, Quantum Physics
Access URL: http://arxiv.org/abs/1711.09207