Showing 1 - 20 results of 50 Refine Results
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    Conference

    Source: 2023 IEEE International Conference on Robotics and Automation (ICRA) Robotics and Automation (ICRA), 2023 IEEE International Conference on. :6102-6108 May, 2023

    Relation: 2023 IEEE International Conference on Robotics and Automation (ICRA)

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    Conference

    Source: 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO) Robotics and Biomimetics (ROBIO), 2022 IEEE International Conference on. :1439-1444 Dec, 2022

    Relation: 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO)

  4. 4
    Conference

    Source: 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO) Robotics and Biomimetics (ROBIO), 2022 IEEE International Conference on. :1615-1622 Dec, 2022

    Relation: 2022 IEEE International Conference on Robotics and Biomimetics (ROBIO)

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    Conference

    Source: 2021 IEEE International Conference on Real-time Computing and Robotics (RCAR) Real-time Computing and Robotics (RCAR), 2021 IEEE International Conference on. :217-222 Jul, 2021

    Relation: 2021 IEEE International Conference on Real-time Computing and Robotics (RCAR)

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    Conference

    Source: 2021 IEEE International Conference on Mechatronics (ICM) Mechatronics (ICM), 2021 IEEE International Conference on. :1-6 Mar, 2021

    Relation: 2021 IEEE International Conference on Mechatronics (ICM)

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    Academic Journal

    Authors: Liao, Jianfeng1, liaojianfeng@hanyang.ac.kr, Kim, Hwan Yong1, hwankim@hanyang.ac.kr, Shin, Min Ho2, minhoshin57@wsu.ac.kr

    Source: Buildings (2075-5309); Jan2025, Vol. 15 Issue 2, p180, 13p

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  9. 9
    Academic Journal

    Authors: Yan, Wenwen1,2, 20120119@kust.edu.cn, Liao, Jianfeng3, liaojianfeng@hanyang.ac.kr, Zhai, Hui1, zhaihui@kust.edu.cn

    Source: Buildings (2075-5309); Sep2024, Vol. 14 Issue 9, p2855, 25p

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    Academic Journal

    Authors: Feng, Yunfei1,2, fengyf1@shanghaitech.edu.cn, Ding, Bocheng1,2, dingbch@shanghaitech.edu.cn, Wu, Ruichang1,2, wurch@shanghaitech.edu.cn, Jin, Xin1,2, jinxin@shanghaitech.edu.cn, Wu, Kefei1,2, wukf1@shanghaitech.edu.cn, Liao, Jianfeng1,2, liaojf@shanghaitech.edu.cn, Huang, Jianye1,2, huangjy1@shanghaitech.edu.cn, Liu, Xiaojing1,2, liuxj@shanghaitech.edu.cn

    Source: Applied Sciences (2076-3417); Mar2024, Vol. 14 Issue 5, p2190, 12p

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    Academic Journal
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    Academic Journal

    Authors: Liao, Jianfeng1,2, liaojianfeng@hanyang.ac.kr, Cui, Xiao1, Kim, Hwanyong1, hwankim@hanyang.ac.kr

    Source: Buildings (2075-5309); Jul2023, Vol. 13 Issue 7, p1581, 21p

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  17. 17
    Academic Journal

    Source: In Tunnelling and Underground Space Technology incorporating Trenchless Technology Research January 2018 71:166-179

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