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    Conference

    Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :258-262 Oct, 2017

    Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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    Academic Journal
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    Academic Journal

    Authors: Li, Si-Qi1,2,3 (AUTHOR) lisiqi@hlju.edu.cn, Li, Yi-Ru1,3 (AUTHOR), Han, Jia-Cheng1,3 (AUTHOR), Qin, Peng-Fei1,3 (AUTHOR), Du, Ke1,3 (AUTHOR)

    Source: Bulletin of Earthquake Engineering. Apr2024, Vol. 22 Issue 6, p2797-2827. 31p.

    Geographic Terms: SICHUAN Sheng (China)

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    Academic Journal

    Authors: Li, Chi-Min1, cmli@ntou.edu.tw, Li, Yi-Ru1

    Source: Wireless Personal Communications; Jun2021, Vol. 118 Issue 4, p3523-3537, 15p

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