Measuring What Matters: A Fireside Chat With Joel Emer

Authors: Elgamal, M., Li, Y.L., Jeon, H., Jog, A.

Source: IEEE Micro Micro, IEEE. 45(1):104-112 Jan, 2025

An Analytics Framework to Evaluate Group Decision-Making Capabilities of the Fuzzy Best Worst Method

Authors: Li, Y.L., Tsang, Y.P., Wu, C.H., Lee, C.K.M.

Source: 2023 5th International Conference on Decision Science & Management (ICDSM) ICDSM Decision Science & Management (ICDSM), 2023 5th International Conference on. :34-37 Mar, 2023

Relation: 2023 5th International Conference on Decision Science & Management (ICDSM)

Board Level Probe-on-Pin Power Delivery Network Characterization

Authors: Chang, Patt, Li, Y.L., Hsu, Jimmy, Cheng, Yang Hung, Chen, Chien Hsun, Wei, Hao, Lee, Falconee, Qin, Shijuan, Liang, Kevin, Tzeng, Kate

Source: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022 IEEE International Symposium on. :542-545 Aug, 2022

Relation: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

RNAi-mediated knockdown of FANCF suppresses cell proliferation, migration, invasion, and drug resistance potential of breast cancer cells

Authors: Zhao, L., Li, N., Yu, J.K., Tang, H.T., Li, Y.L., He, M., Yu, Z.J., Bai, X.F., Zheng, Z.H., Wang, E.H., Wei, M.J.

Source: Brazilian Journal of Medical and Biological Research. January 2014 47(1)

Subject Terms: Fanconi anemia complementation group F protein, Breast neoplasms, Tumor cell line

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Access URL: http://old.scielo.br/scielo.php?script=sci_arttext&pid=S0100-879X2014000100024

Power Design Validation of Two-Stage Power System

Authors: Li, Y.L., Lee, Falconee, Liang, Kevin, Tzeng, Kate, Tien, Ming, Wu, Donghan, Tsai, Bryant, Chang, Patt, Tseng, Jim, Qin, Shijuan

Source: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022 IEEE International Symposium on. :546-548 Aug, 2022

Relation: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Restoration Strategy for Active Distribution Systems Considering Endogenous Uncertainty in Cold Load Pickup

Authors: Li, Y.L., Sun, W., Yin, W., Lei, S., Hou, Y.

Source: IEEE Transactions on Smart Grid IEEE Trans. Smart Grid Smart Grid, IEEE Transactions on. 13(4):2690-2702 Jul, 2022

A generalized incremental harmonic balance method by combining a data-driven framework for initial value selection of strongly nonlinear dynamic systems

Authors: Li, Y.L., Huang, J.L., Zhu, W.D.

Source: In International Journal of Non-Linear Mechanics February 2025 169

Enhanced Simulation Methodology For High-Speed Data Center Application

Authors: Hsiao, N., Hsu, J., Chen, D., Su, T., Li, Y.L.

Source: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :60-63 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Nonlocal general particle dynamics for fluid-structure interaction problems considering the structural failure

Authors: Li, Y.L. ^a, Zhou, X.P. ^{a, b, ⁎}

Source: In Engineering Analysis with Boundary Elements May 2025 174

Real-Time In Vivo Imaging of Human Liver Vasculature Using Coherent Flow Power Doppler: A Pilot Clinical Study

Authors: Li, Y.L., Hyun, D., Ducey-Wysling, J., Durot, I., D'Hondt, A., Patel, B.N., Dahl, J.J.

Source: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control IEEE Trans. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on. 68(9):3027-3041 Sep, 2021

Vertical Sandwich GAA FETs With Self-Aligned High-k Metal Gate Made by Quasi Atomic Layer Etching Process

Authors: Zhang, Y., Ai, X., Yin, X., Zhu, H., Yang, H., Wang, G.L., Li, J.J., Du, A.Y., Li, C., Huang, W.X., Xie, L., Li, Y.Y., Liu, Y.B., Zhang, Y.B., Jia, K.P., Wu, Z.H., Ma, X.L., Zhang, Q.Z., Mao, S.J., Xu, G.B., Xiang, J.J., Gao, J.F., He, X.B., Lu, Y.H., Bai, G.B., Zhao, J., Li, Y.L., Yang, T., Li, J.F., Yin, H.X., Radamson, H., Luo, J., Zhao, C., Wang, W.W., Ye, T.C.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(6):2604-2610 Jun, 2021

Enhanced Board Level Design Methodology by Statistical Analysis

Authors: Chen, D., Hsu, J., Su, T., Li, Y.L.

Source: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :236-238 Oct, 2020

Relation: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Design Technique on Reduction of Power Cross Regulation and Coupling in Data Center Microprocessor Power Design

Authors: Chang, P., Li, Y.L., Lee, F.

Source: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :342-345 Jun, 2019

Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

Advanced Channel Analysis Method using Channel Quality Comparison and Design of Experiments

Authors: Chen, D., Su, T., Hsu, J., Li, Y.L.

Source: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC), 2019 Joint International Symposium on. :187-190 Jun, 2019

Relation: 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC)

Atomic insights into the solid-state amorphization mechanism of amorphous/crystalline dual-phase Mg alloys

Authors: Li, X.Y., Song, H.Y., Li, Y.L.

Source: In Journal of Materials Research and Technology May-June 2024 30:7203-7213

Forecasting System Capability Using the Scenario-Based Experimental-Design Test Approach

Authors: Li, Y.L., Roberts, B., Grenn, M.W.

Source: IEEE Systems Journal Systems Journal, IEEE. 13(3):2142-2153 Sep, 2019

Advanced Channel Analysis Method using Channel Quality Comparison and Design of Experiments

Authors: Chen, D., Su, T., Hsu, J., Li, Y.L.

Source: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :279-281 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Signal Integrity Analysis of BMC Assisted Remote Debug Solution

Authors: Chen, D., Su, T., Hsu, J., Li, Y.L., Hsu, B.

Source: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :282-284 Oct, 2018

Relation: 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Harmonic-Suppressed LTCC Bandpass Filter Using a New Feeding Scheme

Authors: Li, Y.L., Zhu, Y. Y., Qin, W., Chen, J. X.

Source: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2018 International Conference on. :1-3 May, 2018

Relation: 2018 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

Studies on the 316/NiTi functionally gradient ultra-thick coatings fabricated with directed energy deposition: Microstructure, crystallography and wear mechanism

Authors: Nie, M.H., Jiang, P.F., Zhou, Y.X., Li, Y.L., Zhang, Z.H.

Source: In Applied Surface Science 1 September 2023 630