Wafer Warpage Simulation and Correction for 3D Packaging

Authors: Chen, Xinpeng, Li, Baoxia

Source: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-3 Aug, 2024

Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

Warpage Prediction of Wafer-Level Interposer Packaging Using Equivalent Model

Authors: Sun, Guoli, Dai, Yanwei, Qin, Fei, Li, Baoxia

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array

Authors: Li, Kangrong, Li, Baoxia, Zhang, Zhiwei

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Effectiveness Validation on Equivalent Model for Wafer-Level Warpage Prediction

Authors: Sun, Guoli, Wei, Jiahui, Qin, Fei, Dai, Yanwei, Li, Kui, Li, Baoxia

Source: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Research on 3D interposer/chip stacking technology and reliability

Authors: Zhang, Ning, Li, Baoxia, Yan, Qiucheng, Wu, Daowei

Source: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

Keywords Extraction Method for Technological Demands of Small and Medium-Sized Enterprises Based on LDA

Authors: Liu, Xingbing, Zhang, Zhen, Li, Baoxia, Zhang, Fei

Source: 2019 Chinese Automation Congress (CAC) Chinese Automation Congress (CAC), 2019. :2855-2860 Nov, 2019

Relation: 2019 Chinese Automation Congress (CAC)

High-Voltage Driver for Fully-Integrated Piezoelectric Inkjet Printhead Module

Authors: Guo, Zhuoqi, Xu, Rui, Geng, Li, Li, Baoxia

Source: 2019 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2019 International Conference on. :1-4 Jun, 2019

Relation: 2019 International Conference on IC Design and Technology (ICICDT)

High Density Silicon Substrates for Processor-Memory Integration

Authors: Li, Baoxia, Sun, Chengcheng, Yang, Chunyan, Liu, Zongxi, Wang, Yanling, Su, Yanyan, Xue, Yahui

Source: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :808-811 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging

Authors: Tang, Lei ^a, Li, Kangrong ^{b, ∗}, Zhou, Xingshe ^a, Yang, Qiao ^b, Pan, Penghui ^b, Wu, Daowei ^b, Li, Baoxia ^b, Wang, Yanling ^b, Kuang, Nailiang ^b, Zhang, Liaoliao ^b

Source: In Microelectronics Journal January 2024 143

Effects of dust particle number on the structure and dynamics in a binary complex plasma system by Langevin dynamics simulation

Authors: Li, Baoxia, Liu, Yang, Tang, Xiaojiang, Shi, Guannan, Qi, Haoyu, Liu, Xin, Robert, Eric, Huang, Feng

Source: In Computer Physics Communications March 2023 284

Effects of temperature on the structures and dynamics of a binary complex plasma

Authors: Li, Baoxia, Liu, Yang, Qi, Haoyu, Tang, Hanyu, Huang, Feng

Source: In Computer Physics Communications January 2023 282

The study of different transmission lines in high speed optical module

Authors: He, Huimin, Li, Baoxia, Sun, Yu

Source: 2014 15th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2014 15th International Conference on. :1052-1055 May, 2014

Relation: 2014 15th International Conference on Electronic Packaging Technology (ICEPT)

CB-YOLO: Dense Object Detection of YOLO for Crowded Wheat Head Identification and Localization.

Authors: Chen, Wenzhuo^1,2, A, Lusi¹, Gao, Qinxiu¹, Bian, Shaohuang¹, Li, Baoxia¹, Guo, Junwei³, Zhang, Dan³, Yang, Cheng³, Hu, Wenzhuo⁴, Huang, Feng³, huangfeng@cau.edu.cn

Source: Journal of Circuits, Systems & Computers; 2/1/2025, Vol. 34 Issue 3, p1-22, 22p

A high-speed test board design for 40GHz Bandwidth die

Authors: Zhang, Di, Li, Baoxia, Wan, Lixi, Wang, Haidong, Sun, Yu, Du, Tianmin, Wang, Qibing, Yu, Zhongyao, Cao, Liqiang, Yu, Daquan

Source: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :60-63 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

Fabrication and analysis of 2D embedded passive devices in PCB

Authors: Zhang, Jing, Li, Baoxia, Wan, Lixi, Daniel, Guidotti, Cao, Liqiang, Cui, Zhiyong, Du, Tianmin, Hao, Hu

Source: 2013 14th International Conference on Electronic Packaging Technology Electronic Packaging Technology (ICEPT), 2013 14th International Conference on. :100-104 Aug, 2013

Relation: 2013 14th International Conference on Electronic Packaging Technology (ICEPT)

Optical vertical interconnect and integration based on Silicon carrier

Authors: Liu, Fengman, Chu, Yanbiao, Li, Baoxia, Song, Jian, Wang, Haidong, Du, Tianmin, Yang, Binbin, Wan, Lixi

Source: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :97-100 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

Design and analysis of 2D embedded passive devices in printed circuit boards

Authors: Zhang, Jing, Li, Baoxia, Lixiwan, Cao, Liqiang

Source: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on. :745-748 Aug, 2012

Relation: 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

A 9pJ/bit SOP optical transceiver with 80 Gbps two-way bandwidth

Authors: Liu, Fengman, Li, Baoxia, Li, Zhihua, Wan, Lixi, Gao, Wei, Chu, Yanbiao, Du, Tianmin, Song, Jian, Xiang, Haifei, Wang, Haidong, Yang, Kun, Yang, Binbin

Source: 2011 Asia Communications and Photonics Conference and Exhibition (ACP) Communications and Photonics Conference and Exhibition, 2011. ACP. Asia. :1-5 Nov, 2011

Relation: 2011 Asia Communications and Photonics Conference and Exhibition (ACP 2011)

Ultra-wideband noise isolation on power distribution network of high-speed package substrate

Authors: Li, Baoxia, Wan, Lixi

Source: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)

A new measurement method and electrical design for high density optoelectronics integration

Authors: Liu, Fengman, Li, Baoxia, Zhou, Yunyan, Gao, Wei, Xiang, Haifei, Wang, Haidong, Song, Jian, Li, Zhihua, Yang, Kun, Li, Jun, Cao, Liqiang, Wan, Lixi

Source: 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on. :1-4 Aug, 2011

Relation: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)