Electrical performance characterization for novel multiple compartments shielding and verification on LTE modem SiP

Authors: Lin, Albert, Chen, Vincent, Chen, J J, Leou, Simon, Wang, Thomas, Chang, Harrison

Source: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th. :246-249 Dec, 2014

Relation: 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

Novel multiple compartments shielding for high performance RF design — LTE modem SiP

Authors: Chang, Harrison, Chen, J J, Chen, Vincent, Leou, Simon, Wang, Thomas

Source: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International. :200-203 Oct, 2014

Relation: 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Novel shielding structure for LTE and 3G RF design

Authors: Chang, Harrison, Chen, J J, Chen, Vincent, Leou, Simon

Source: 2012 Asia Pacific Microwave Conference Proceedings Microwave Conference Proceedings (APMC), 2012 Asia-Pacific. :920-922 Dec, 2012

Relation: 2012 Asia Pacific Microwave Conference (APMC)