Showing 1 - 20 results of 10,713 Refine Results
  1. 1
    Conference

    Source: 2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023

    Relation: 2023 International Electron Devices Meeting (IEDM)

  2. 2
  3. 3
    Conference

    Source: 2021 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE) Applied Electromagnetics (APACE), 2021 IEEE Asia-Pacific Conference on. :1-4 Dec, 2021

    Relation: 2021 IEEE Asia-Pacific Conference on Applied Electromagnetics (APACE)

  4. 4
  5. 5
    Conference

    Source: 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021

    Relation: 2021 IEEE International Reliability Physics Symposium (IRPS)

  6. 6
    Conference

    Source: 2020 13th International UNIMAS Engineering Conference (EnCon) Engineering Conference (EnCon), 2020 13th International UNIMAS. :1-4 Oct, 2020

    Relation: 2020 13th International UNIMAS Engineering Conference (EnCon)

  7. 7
  8. 8
    Conference

    Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018

    Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

  9. 9
    Conference

    Source: 2019 34th International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC) Circuits/Systems, Computers and Communications (ITC-CSCC), 2019 34th International Technical Conference on. :1-3 Jun, 2019

    Relation: 2019 34th International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC)

  10. 10
    Report

    Authors: Arzoumanian, D., Furuya, R., Hasegawa, T., Tahani, M., Sadavoy, S., Hull, C. L. H., Johnstone, D., Koch, P. M., Inutsuka, S. -i., Doi, Y., Hoang, T., Onaka, T., Iwasaki, K., Shimajiri, Y., Inoue, T., Peretto, N., André, P., Bastien, P., Berry, D., Chen, H. -R. V., Di Francesco, J., Eswaraiah, C., Fanciullo, L., Fissel, L. M., Hwang, J., Kang, J. -h., Kim, G., Kim, K. -T., Kirchschlager, F., Kwon, W., Lee, C. W., Liu, H. -L., Lyo, A. -R., Pattle, K., Soam, A., Tang, X., Whitworth, A., Ching, T. -C., Coudé, S., Wang, J. -W., Ward-Thompson, D., Lai, S. -P., Qiu, K., Bourke, T. L., Byun, D. -Y., Chen, M., Chen, Z., Chen, W. P., Cho, J., Choi, Y., Choi, M., Chrysostomou, A., Chung, E. J., Dai, S., Diep, P. N., Duan, H. -Y., Duan, Y., Eden, D., Fiege, J., Franzmann, E., Friberg, P., Fuller, G., Gledhill, T., Graves, S., Greaves, J., Griffin, M., Gu, Q., Han, I., Hatchell, J., Hayashi, S., Houde, M., Jeong, I. -G., Kang, M., Kang, S. -j., Kataoka, A., Kawabata, K., Kemper, F., Kim, M. -R., Kim, K. H., Kim, J., Kim, S., Kirk, J., Kobayashi, M. I. N., Konyves, V., Kusune, T., Kwon, J., Lacaille, K., Law, C. -Y., Lee, C. -F., Lee, Y. -H., Lee, S. -S., Lee, H., Lee, J. -E., Li, H. -b., Li, D., Liu, J., Liu, T., Liu, S. -Y., Lu, X., Mairs, S., Matsumura, M., Matthews, B., Moriarty-Schieven, G., Nagata, T., Nakamura, F., Nakanishi, H., Ngoc, N. B., Ohashi, N., Park, G., Parsons, H., Pyo, T. -S., Qian, L., Rao, R., Rawlings, J., Rawlings, M., Retter, B., Richer, J., Rigby, A., Saito, H., Savini, G., Scaife, A., Seta, M., Shinnaga, H., Tamura, M., Tang, Y. -W., Tomisaka, K., Tram, L. N., Tsukamoto, Y., Viti, S., Wang, H., Xie, J., Yen, H. -W., Yoo, H., Yuan, J., Yun, H. -S., Zenko, T., Zhang, G., Zhang, C. -P., Zhang, Y., Zhou, J., Zhu, L., de Looze, I., Dowell, C. D., Eyres, S., Falle, S., Friesen, R., Robitaille, J. -F., van Loo, S.

    Source: A&A 647, A78 (2021)

  11. 11
  12. 12
    Report
  13. 13
    Conference

    Source: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

    Relation: 2021 Symposium on VLSI Technology

  14. 14
  15. 15
  16. 16
    Conference

    Source: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2017 International Conference on. :85-88 Sep, 2017

    Relation: 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

  17. 17
    Conference

    Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-7 Jul, 2017

    Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

  18. 18
    Conference

    Source: 2017 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2017 IEEE International. :387-396 May, 2017

    Relation: 2017 IEEE International Parallel and Distributed Processing Symposium (IPDPS)

  19. 19
  20. 20