Sip Solder Paste with Superior Slump Resistance via Powder Cluster Mechanism

Authors: Xu, Zhengfeng, Zheng, Aixia, Wang, Jian, Wang, Ming, Lee, Ning-Cheng

Source: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-6 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

A Novel Lead-Free Low-Temperature Solder with Excellent Drop-Shock Re-sistance

Authors: Zhang, Hongwen, Lytwynec, Samuel, Lee, Ning-Cheng, Lim, Sze Pei

Source: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2021 16th International. :112-118 Dec, 2021

Relation: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Epoxy Flux Prevent Hot Tear at VIPPO Solder Joints

Authors: Zito, Elaina, Bedner, Dave, Lee, Ning-Cheng

Source: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-6 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop-Shock Resistance

Authors: Zhang, Hongwen, Lytwynec, Samuel, Wang, Huaguang, Geng, Jie, Mutuku, Francis, Lee, Ning-Cheng

Source: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :643-653 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction

Authors: Li, Yanfang, Li, Meng, Chen, Fen, Fan, Guangyu, Lee, Ning-Cheng

Source: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1399-1404 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Versatile TIM Solution with Chain Network Solder Composite

Authors: Mao, Runsheng, Chen, Sihai, Zito, Elaina, Bedner, David, Lee, Ning-Cheng

Source: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-6 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

Pressureless Sintering Process of Ag Sinter Paste Bonding Ag Si Die on Bare Cu DBC Using Convection Reflow Oven in Nitrogen for Die Attach

Authors: Fan, Guangyu, Labarbera, Christine, Lee, Ning-Cheng, Boushie, Zachary, Lockwood, Nicole

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1338-1343 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Highly Reliable Die-Attach Silver Joint with Pressure-Less Sintering Process

Authors: Chen, Sihai, Shambach, William, Palmer, Jordan, Labarbera, Christine, Ding, Xuanyi, Lee, Ning-Cheng

Source: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :2186-2193 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Nano-Cu Sintering Paste for High Power Devices Die Attach Applications

Authors: Zhao, Jinjin, Yao, Min, Lee, Ning-Cheng

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :557-563 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications

Authors: Lee, Ning-Cheng, Geng, Jie, Zhang, Hongwen, Mutuku, Francis

Source: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :2336-2344 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

Novel solder alloy with wide service temperature capability for automotive applications

Authors: Geng, Jie, Zhang, Hongwen, Mutuku, Francis, Lee, Ning-Cheng

Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :152-159 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Nano-Cu sintering paste for high power devices die attach applications

Authors: Zhao, Jinjin, Yao, Min, Lee, Ning-Cheng

Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :70-76 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Assessment of solder paste technology limitation at miniaturization for SIP and SMT application

Authors: Keck, Joanna, Lee, Ning-Cheng

Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :89-96 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Authors: Lau, John, Li, Ming, Tian, Dewen, Fan, Nelson, Kuah, Eric, Kai, Wu, Li, Margie, Hao, J., Cheung, Ken, Li, Zhang, Tan, Kim Hwee, Beica, Rozalia, Ko, Cheng-Ta, Chen, Yu-Hua, Lim, Sze Pei, Lee, Ning Cheng, Wee, Koh Sau, Ran, Jiang, Xi, Cao

Source: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :595-602 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

Effects of solder alloy compositions on microstructure and reliability of die-attach solder joints for automotive applications

Authors: Liu, Weiping, Lee, Ning-Cheng, Bachorik, Paul, LaBarbera, Christine

Source: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th. :1-7 Dec, 2015

Relation: 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

Achieving high reliability via pressureless sintering of nano-Ag paste for die-attach

Authors: Chen, Sihai, Fan, Guangyu, Yan, Xue, LaBarbera, Chris, Kresge, Lee, Lee, Ning-Cheng

Source: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :367-374 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

The risk and solution for no-clean flux not fully dried under component terminations

Authors: Chen, Fen, Lee, Ning-Cheng

Source: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :387-395 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

Achieving low-porosity sintering of nano Ag paste via pressureless process

Authors: Chen, Sihai, Fan, Guangyu, Yan, Xue, LaBarbera, Chris, Kresge, Lee, Lee, Ning-Cheng

Source: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1795-1802 May, 2015

Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

A novel epoxy flux on solder paste for assembling thermally warped POP

Authors: Hu, Ming, Kresge, Lee, Lee, Ning-Cheng

Source: 36th International Electronics Manufacturing Technology Conference Electronics Manufacturing Technology Conference (IEMT), 2014 IEEE 36th International. :1-8 Nov, 2014

Relation: 2014 IEEE 36th International Electronics Manufacturing Technology Conference (IEMT)

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

Authors: Arfaei, Babak, Mutuku, Francis, Sweatman, Keith, Lee, Ning-Cheng, Cotts, Eric, Coyle, Richard

Source: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :655-665 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)