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1Conference
Authors: Riahi, S., Becan, G., Ammar, M., Bosseboeuf, A., Laourine, F., Boutaud, B., Bouville, D., Harouri, A., Coste, P., Lefeuvre, E.
Source: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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2Conference
Authors: Laourine, F., Cleymand, F., Marcos, G., Guilet, S., Czerwiec, T.
Source: Key engineering materials. 813:273-278