Mobile Health Initiatives in Vietnam: Scoping Study

Authors: Lam, Jeffrey A, Dang, Linh Thuy, Phan, Ngoc Tran, Trinh, Hue Thi, Vu, Nguyen Cong, Nguyen, Cuong Kieu

Source: JMIR mHealth and uHealth, Vol 6, Iss 4, p e106 (2018)

Subject Terms: Information technology, T58.5-58.64, Public aspects of medicine, RA1-1270

File Description: electronic resource

Relation: http://mhealth.jmir.org/2018/4/e106/; https://doaj.org/toc/2291-5222

Access URL: https://doaj.org/article/7f54b60c97fc441292425a6592a8f1a5

E-test Probe Mark Topology-induced Failure

Authors: Jong, Jf, Lim, Tw, Goh, Sh, Qu, Yang, Lam, Jeffrey

Source: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-5 Sep, 2021

Relation: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Preoperative assessment in patients presenting for elective surgery

Authors: Yam, Yin Lam Jeffrey

Source: In Anaesthesia & Intensive Care Medicine August 2024 25(8):519-525

Body temperature and its regulation

Authors: Yam, Yin Lam Jeffrey

Source: In Anaesthesia & Intensive Care Medicine August 2024 25(8):584-588

Prediction of Electrical and Physical Failure Analysis Success Using Artificial Neural Networks

Authors: Zhao, Lin, Goh, SH, Chan, YH, Yeoh, BL, Hu, Hao, Thor, MH, Tan, Alan, Lam, Jeffrey

Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

The Overview of the Impacts of Electron Radiation on Semiconductor Failure Analysis by SEM, FIB and TEM

Authors: Liu, Binghai, Hua, Younan, Dong, Zhili, Tan, Pik Kee, Zhao, Yuzhe, Mo, Zhiqiang, Lam, Jeffrey, Mai, Zhihong

Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-6 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Failure Analysis Methodology on Systematic MIM failure in Wafer Fabrication

Authors: Teo, Angela, Boon, Ang Ghim, Peng, Ng Hui, Qing, Chen Chang, Yun, Xu Nai, Dayanand, N., Seng, Tam Yong, Hong, Mai Zhi, Lam, Jeffrey

Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

A Demonstration on the Effectiveness of Wafer-level Thermal Microscopy as A Complementary Tool to Photon Emission Microscopy Using MBIST Failure Debug

Authors: Yeoh, BL, Goh, SH, Thor, MH, Hao, Hu, Tan, Alan, Chan, YH, Lin, Zhao, Neo, SP, Lam, Jeffrey, Chua, CM, Tan, SH

Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-5 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Invisible Defect Identification by Electrical Nanoprobing Analysis

Authors: Ng, P.T., Chen, C.Q., Tam, Y.S., Yip, K.H., Teo, Angela, Ang, G.H., Mai, Z.H., Lam, Jeffrey

Source: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-4 Jul, 2018

Relation: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Characterization of anti-stiction coatings for MEMS applications

Authors: Seetoh, Ian P., Teo, Han Wei, Mo, Zhi Qiang, Lo, Eddy, Mai, Zhi Hong, Lam, Jeffrey

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-4 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Fault isolation of digital scan logic without ‘scan diagnosis’

Authors: Yeoh, B. L., Goh, S. H., You, G. F., Hao, Hu, Tan, Alan, Chan, Y. H., Lin, Zhao, Lam, Jeffrey

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-5 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Study of Si nanocrystal growth and characterization for Si nanocrystal embeded nonvolatile memory

Authors: Liu, Bo, Huang, Maggie Yamin, Tan, P. K., Song, Zhen, Mai, Zhihong, Lam, Jeffrey

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-4 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

A controlled, mechanical method for MEMS decapsulation

Authors: Tan, Hao, Moyal, Efrat, Yap, Huei Hao, Zhao, Yu Zhe, He, Ran, Ma, Yin Zhe, Liu, Bing Hai, Chen, Chang Qing, Tan, Pik Kee, Lam, Jeffrey, Mai, Zhi Hong

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-4 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Uncovered the “hidden real defect” masked by “other anomaly seen” through deep dive FA in wafer fabrication

Authors: Teo, Angela, Peng, Ng Hui, Boon, Ang Ghim, Qing, Chen Chang, Yun, Xu Nai, Dayanand, N, Seng, Tam Yong, Hong, Mai Zhi, Lam, Jeffrey

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-5 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

A detailed analysis scheme to interpret multiple photon emissions micrograph for improved diagnostic resolution on open defects

Authors: Goh, S. H., Manlangit, Edmund C, Susanto, Edy, Yeoh, B. L., Hao, Hu, Tan, Alan, Ma, Hnin Hnin W, Lin, Zhao, Chan, Y. H., Lam, Jeffrey

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-6 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Self-compassion, but not compassion toward others, is associated with better physical health: A cross-sectional study

Authors: Ramsey, Arren, Govind, Tushara, Lam, Jeffrey A., Palmer, Barton W., Jeste, Dilip V., Lee, Ellen E.

Source: Schizophrenia research. 255:17-23

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100195217943.0x000001&indx=1&recIds=ETOCvdc_100195217943.0x000001

Determining the root cause of a neighbouring-cell-interaction-induced latch-up failure event

Authors: Ho, H. W., Lau, Wendy W. Y., Goh, S. H., Yeoh, B. L., Seungje, M., He, R., Lam, Jeffrey

Source: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :55-59 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Study on fab environment induced Al and Cu metal corrosion by TEM failure analysis

Authors: Liu, Binghai, Mai, Zhihong, Lam, Jeffrey, Yuzhe, Zhao, Kee, Tan Pik

Source: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2016 IEEE 23rd International Symposium on the. :422-426 Jul, 2016

Relation: 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Mechanism of abnormal dual-peak profiles in large tilt-angle ion implantation studied by SRIM analysis

Authors: Zhu, Lei, Tan, Pik Kee, Wang, Dandan, Huang, Yamin, Lam, Jeffrey, Mai, Zhi Hong

Source: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2017 IEEE 24th International Symposium on the. :1-3 Jul, 2017

Relation: 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Sexually Transmitted Infections & the Heart

Authors: Liblik, Kiera, Lam, Jeffrey, Pham, Alex, Byun, Jin, Farina, Juan M., Baranchuk, Adrian

Source: In Current Problems in Cardiology May 2023 48(5)