A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors

Authors: Jouve, A., Lagoutte, E., Crochemore, R., Mauguen, G., Flahaut, T., Dubarry, C., Balan, V., Fournel, F., Bourjot, E., Servant, F., Scannell, M., Rohracher, K., Bodner, T., Faes, A., Hofrichter, J.

Source: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :201-209 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Authors: Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.

Source: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-5 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

Gold-tin bonding for 200mm wafer level hermetic MEMS packaging

Authors: Garnier, A., Lagoutte, E., Baillin, X., Gillot, C., Sillon, N.

Source: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1610-1615 May, 2011

Relation: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

Hermetic wafer-level packaging development for RF MEMS switch

Authors: Ferrandon, C., Greco, F., Lagoutte, E., Descours, P., Enyedy, G., Pellat, M., Gillot, C., Rey, P., Mercier, D., Cueff, M., Baillin, X., Perruchot, F., Sillon, N., Liu, L.J., Pacheco, S., Miller, M.

Source: 3rd Electronics System Integration Technology Conference ESTC Electronic System-Integration Technology Conference (ESTC), 2010 3rd. :1-6 Sep, 2010

Relation: 2010 3rd Electronic System-Integration Technology Conference (ESTC)

Wafer Level Thin Film Encapsulation for BAW RF MEMS

Authors: Pornin, J.L., Gillot, C., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Dumont, F.

Source: 2007 Proceedings 57th Electronic Components and Technology Conference Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th. :605-609 Jun, 2007

Relation: 2007 57th Electronic Components and Technology Conference

Wafer Level Thin Film Encapsulation for MEMS

Authors: Gillot, C., Lagoutte, E., Charvet, P.L., Souchon, F., Sillon, N.

Source: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis High Density Microsystem Design and Packaging and Component Failure Analysis, 2005 Conference on. :1-4 Jun, 2005

Relation: 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

Master regulators in primary skin fibroblast fate reprogramming in a human ex vivo model of chronic wounds

Authors: Noizet, M., Lagoutte, E., Gratigny, M., Bouschbacher, M., Lazareth, I., Roest Crollius, H., Darzacq, X., Dugast-Darzacq, C.

Source: WOUND REPAIR AND REGENERATION. 24(2):247-262

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN377384920&indx=1&recIds=ETOCRN377384920

p63/MT1-MMP axis is required for in situ to invasive transition in basal-like breast cancer

Authors: Lodillinsky, C., Infante, E., Guichard, A., Chaligne, R., Fuhrmann, L., Cyrta, J., Irondelle, M., Lagoutte, E., Vacher, S., Bonsang-Kitzis, H.

Source: ONCOGENE -BASINGSTOKE-. 35(3):344-357

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN374565514&indx=1&recIds=ETOCRN374565514

Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure

Authors: Imbert, B., Blot, X., Tauzin, A., Salvetat, T., Lagoutte, E., Lecouvey, C., Chaira, T., Larrey, V., Bridoux, C., Fournel, F.

Source: MICROSYSTEM TECHNOLOGIES. 21(5):973-977

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN369673440&indx=1&recIds=ETOCRN369673440

579 Clinical grade human pluripotent stem cells derived engineered skin substitutes promote keratinocytes wound closure in vitro

Authors: Domingues, S., Darle, A., Masson, Y., Saidani, M., Lagoutte, E., Bejanariu, A., Coutier, J., Ayata, R., Bouschbacher, M., Peschanski, M., Lemaitre, G., Baldeschi, C.

Source: Journal of investigative dermatology. 142(S):S280-S280

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100175700053.0x000001&indx=1&recIds=ETOCvdc_100175700053.0x000001

Endosomal WASH and exocyst complexes control exocytosis of MT1-MMP at invadopodia

Authors: Monteiro, P., Rosse, C., Castro-Castro, A., Irondelle, M., Lagoutte, E., Paul-Gilloteaux, P., Desnos, C., Formstecher, E., Darchen, F., Perrais, D.

Source: JOURNAL OF CELL BIOLOGY. 203(6):1063-1080

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN345497686&indx=1&recIds=ETOCRN345497686

Oxidation of hydrogen sulfide remains a priority in mammalian cells and causes reverse electron transfer in colonocytes

Authors: Lagoutte, E., Mimoun, S., Andriamihaja, M., Chaumontet, C., Blachier, F., Bouillaud, F.

Source: BIOCHIMICA ET BIOPHYSICA ACTA. 1797(8):1500-1511

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN272952319&indx=1&recIds=ETOCRN272952319

Wafer Level Thin Film Encapsulation for RF MEMS

Authors: Gillot, C., Pornin, J.L., Parat, G., Jacquet, F., Lagoutte, E., Sillon, N., Poupon, G., Ancey, P.

Source: ADVANCING MICROELECTRONICS. 35(2):14-19

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN224989206&indx=1&recIds=ETOCRN224989206

AB0144 PHARMACOLOGICAL CHARACTERIZATION OF GLPG3667, A SELECTIVE TYK2 INHIBITOR, SUPPORTS DEVELOPMENT IN DERMATOMYOSITIS AND SYSTEMIC LUPUS ERYTHEMATOSUS

Authors: Aggarwal, R. ¹, Morand, E.F. ², Blanque, R. ³, Shoji, K. ³, Jans, M. ⁴, Marsais, F. ³, Furio, L. ³, Colli, M. ⁴, Lavazais, S. ³, Cottereaux, C. ³, David, C. ³, Houvenaghel, N. ⁴, Parent, I. ³, Lagoutte, E. ³, Van de Water, A. ⁴, Perret, L. ³, Alves, S. ³, Amantini, D. ³, Van der Plas, S. ⁴, Galien, R. ³

Source: In Annals of the Rheumatic Diseases June 2023 82 Supplement 1:1251-1252

PHARMACOLOGICAL CHARACTERIZATION OF GLPG3667, A SELECTIVE TYK2 INHIBITOR, SUPPORTS DEVELOPMENT IN DERMATOMYOSITIS AND SYSTEMIC LUPUS ERYTHEMATOSUS.

Authors: Aggarwal, R., Morand, E. F., Blanque, R., Shoji, K., Jans, M., Marsais, F., Furio, L., Colli, M., Lavazais, S., Cottereaux, C., David, C., Houvenaghel, N., Parent, I., Lagoutte, E., Van de Water, A., Perret, L., Alves, S., Amantini, D., Van der Plas, S., Galien, R.

Source: Annals of the Rheumatic Diseases; 2023 Supplement, Vol. 82, p1251-1252, 2p

Recent development in pixel level packaging for uncooled IRFPA [7834-30]
Electro-optical and infrared systems: technology and applications VII

Authors: Rabaud, W., Dumont, G., Baillin, X., Carle, L., Lagoutte, E., Pellat, M., Goudon, V., Vialle, C., Arnaud, A.

Source: PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING. 7834:7834 0T-7834 0T

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN078827620&indx=1&recIds=ETOCCN078827620

Wafer Level Hermetic Packaging for Above-IC RF MEMS: Process and Characterization
International symposium on microelectronics

Authors: Sillon, N., Gillot, C., Robert, P., Dahan, E., Baillin, X., Lagoutte, E.

Source: PROCEEDINGS OF THE INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS. :106-106

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN062354535&indx=1&recIds=ETOCCN062354535

Low cost Thin Film packaging for MEMS over molded.

Authors: Pornin, J.-L., Gillot, C., Billard, C., Lagoutte, E., Pellat, M., Parat, G., Sillon, N.

Source: Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-4, 4p

Waste Stabilization Using Fly Ash and Portland Cement
Soil stabilization

Authors: Knox, D., Lagoutte, E., Liskowitz, J.

Source: :5-15-5-16

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN002436980&indx=1&recIds=ETOCCN002436980

p63/MT1-MMP axis is required for in situto invasive transition in basal-like breast cancer

Authors: Lodillinsky, C, Infante, E, Guichard, A, Chaligné, R, Fuhrmann, L, Cyrta, J, Irondelle, M, Lagoutte, E, Vacher, S, Bonsang-Kitzis, H, Glukhova, M, Reyal, F, Bièche, I, Vincent-Salomon, A, Chavrier, P

Source: Oncogene; January 2016, Vol. 35 Issue: 3 p344-357, 14p