Atomic Layer Deposition of TiN in Horizontal Vias Using Hydrazine as Nitrogen Precursor

Authors: Fammels, Jannick, Lee, Ping-Che, Pal, Dipayan, Pilz, Julian, Solonenko, Dmytro, Spiegelman, Jeffrey, Kummel, Andrew C.

Source: 2024 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2024 IEEE International. :1-3 Jun, 2024

Relation: 2024 IEEE International Interconnect Technology Conference (IITC)

Nano-chemical characterization of SiO2 and Cu surfaces for Cu-Cu hybrid bonding

Authors: O'Reilly, Padraic, Yu, Beihang, Kuo, Chenghsuan, Kummel, Andrew C., Ruiz, Ricardo, Park, Sung

Source: 2024 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2024 IEEE International. :1-3 Jun, 2024

Relation: 2024 IEEE International Interconnect Technology Conference (IITC)

Ultrathin Gate Dielectric Enabled by Nanofog Aluminum Oxide on Monolayer MoS2

Authors: Ko, Jung-Soo, Zhang, Zichen, Lee, Sol, Jaikissoon, Marc, Bennett, Robert K. A., Kim, Kwanpyo, Kummel, Andrew C., Bandaru, Prabhakar, Pop, Eric, Saraswat, Krishna C.

Source: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :1-4 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

Selective Co ALD for Chiplet-to-Wafer and Wafer-to-Wafer Bonding

Authors: Kuo, Cheng-Hsuan, Manley, Madison, Pal, Dipayan, Sahay, Rohan, Kanjolia, Ravindra, Woodruff, Jacob, Bakir, Muhannad, Kummel, Andrew C., Moinpour, Mansour, Spiegelman, Jeff

Source: 2024 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2024 IEEE International. :1-2 Jun, 2024

Relation: 2024 IEEE International Interconnect Technology Conference (IITC)

Reverse Templating Effects of Low-Resistivity Ru ALD on Sputtered Ru

Authors: Wang, Victor, Kuo, Chenghsuan, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Simka, Harsono, Kummel, Andrew C.

Source: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023

Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)

Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition with TiCl4 and Metal-Organic Precursors in Horizontal Vias

Authors: Kuo, Cheng-Hsuan, Mcleod, Aaron J, Huang, James, Wang, Victor, Yun, SeongUK, Zhang, Zichen, Spiegelman, Jeffrey, Kummel, Andrew C.

Source: 2022 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2022 IEEE International. :76-78 Jun, 2022

Relation: 2022 IEEE International Interconnect Technology Conference (IITC)

Selective Dielectric on Dielectric (DOD) achieved on SiO2 in Preference to Wby 300°C Aniline Passivation and Water-free Chemical Vapor Deposition

Authors: Kummel, Andrew C.

Source: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023 International VLSI Symposium on. :1-1 Apr, 2023

Relation: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)

Low Resistivity Titanium Nitride Thin Film Fabricated by Atomic Layer Deposition on Silicon

Authors: Kuo, Cheng-hsuan, Wang, Victor, Zhang, Zichen, Spiegelman, Jeffrey, Alvarez, Daniel, Kummel, Andrew C., Yun, SeongUK, Simka, Harsono

Source: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021

Relation: 2021 IEEE International Interconnect Technology Conference (IITC)

Improved corrosion resistance and electrical characteristics of titanium, with atomic layer deposited (ALD) TiOx coating

Authors: Wang, Kesong ^a, Paxson, Adam ^b, Valdez, Thomas I. ^b, Erlat, Ahmet G. ^b, Lee, Ping-Che ^c, Yun, Seonguk ^c, Kummel, Andrew C. ^{c, d, ⁎}, Bandaru, Prabhakar R. ^{a, c, ⁎}

Source: In Applied Surface Science 30 May 2025 692

Control polarity of gallium nitride on Si (1 1 1) using atomic layer annealing and thermal atomic layer deposition

Authors: Yun, SeongUk, Lee, Ping-Che, Spiegelman, Jeffrey, Kummel, Andrew C.

Source: In Applied Surface Science 15 December 2024 676

Tetravalent doping in hafnium-zirconium oxides to lower polarization switching voltage

Authors: Chae, Kisung, Kummel, Andrew C, Cho, Kyeongjae

Source: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

Crystalline Gallium Nitride Deposition by RF-Biased Atomic Layer Annealing

Authors: McLeod, Aaron J., Ueda, Scott T., Spiegelman, Jeff, Kummel, Andrew C.

Source: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2022 International Symposium on. :1-2 Apr, 2022

Relation: 2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

Grain Structure – Resistivity Relationship of Ru ALD Precursors

Authors: Breeden, Michael, Wang, Victor, Yu, Francis, Kummel, Andrew C.

Source: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2021 International Symposium on. :1-2 Apr, 2021

Relation: 2021 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

Gallium phosphide conformal film growth on in-situ tri-TBP dry-cleaned InGaP/GaAs using atomic hydrogen ALD

Authors: Yun, SeongUk, Lee, Ping-Che, Kuo, Cheng-Hsuan, Mcleod, Aaron J., Zhang, Zichen, Wang, Victor, Huang, James, Kashyap, Harshil, Winter, Charles H., Kummel, Andrew C.

Source: In Vacuum February 2024 220

Interfacial Oxide Layer Scavenging in Ferroelectric Hf0.5Zr0.5O2-Based MOS Structures With Ge Channel for Reduced Write Voltages

Authors: Park, Chinsung, Kashyap, Harshil, Das, Dipjyoti, Hur, Jae, Tasneem, Nujhat, Lombardo, Sarah, Afroze, Nashrah, Chern, Winston, Kummel, Andrew C., Yu, Shimeng, Khan, Asif Islam

Source: IEEE transactions on electron devices. 70(8):4479-4483

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100188635078.0x000001&indx=1&recIds=ETOCvdc_100188635078.0x000001

Deposition of High Thermal Conductivity AlN Heat Spreader Films

Authors: Ueda, Scott T., McLeod, Aaron, Chen, Michelle, Perez, Chris, Pop, Eric, Alvarez, Dan, Kummel, Andrew C.

Source: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) VLSI Technology, Systems and Applications (VLSI-TSA), 2020 International Symposium on. :110-111 Aug, 2020

Relation: 2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)

Inherent selective pulsed chemical vapor deposition of aluminum oxide in nm scale

Authors: Cho, Yunil, Huang, James, Zhang, Zichen, Wang, Kesong, Lee, Ping-che, Kim, Chanyoung, Wong, Keith, Nemani, Srinivas, Yieh, Ellie, Kummel, Andrew C.

Source: In Applied Surface Science 15 June 2023 622

Plasma enhanced atomic layer deposition of crystallized gallium phosphide on Si with tri-Ethylgallium and tri-tert-Butylphosphine

Authors: Yun, SeongUk, Kuo, Cheng-Hsuan, Lee, Ping-Che, Ueda, Scott T., Wang, Victor, Kashyap, Harshil, Mcleod, Aaron J., Zhang, Zichen, Winter, Charles H., Kummel, Andrew C.

Source: In Applied Surface Science 15 May 2023 619

Pulsed chemical vapor deposition for crystalline aluminum nitride thin films and buffer layers on silicon and silicon carbide

Authors: McLeod, Aaron J., Ueda, Scott T., Lee, Ping C., Spiegelman, Jeff, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Kummel, Andrew C.

Source: In Thin Solid Films 1 March 2023 768

Inherent selective pulsed chemical vapor deposition of amorphous hafnium oxide / titanium oxide nanolaminates

Authors: Cho, Yunil, Huang, James, Ahles, Christopher F., Zhang, Zichen, Wong, Keith, Nemani, Srinivas, Yieh, Ellie, Kummel, Andrew C.

Source: In Applied Surface Science 30 October 2022 600