Investigation of a Finite-Difference-Method based real-time viscous heating compensation in a nozzle viscometer for inline viscosity measurement of phenol resins

Authors: Wappler, Peter, Kulkarni, Romit, Guenther, Thomas, Sahakalkan, Serhat, Fritz, Karl-Peter, Zimmermann, André

Source: In Polymer Testing November 2023 128

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

Authors: Soltani, Mahdi, Kulkarni, Romit, Scheinost, Tobias, Groezinger, Tobias, Zimmermann, Andre

Source: IEEE access. 7:56163-56173

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100080888153.0x000001&indx=1&recIds=ETOCvdc_100080888153.0x000001

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB

Authors: Soltani, Mahdi, Freyburger, Moritz, Kulkarni, Romit, Mohr, Rainer, Groezinger, Tobias, Zimmermann, Andre

Source: IEEE access. 6:51669-51679

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100080588857.0x000001&indx=1&recIds=ETOCvdc_100080588857.0x000001

Development of a nozzle capillary viscometer for inline viscosity measurement of thermoplastics.

Authors: Wappler, Peter, Horter, Tim, Kulkarni, Romit, Guenther, Thomas, Fritz, Karl-Peter, Zimmermann, André

Source: International Journal of Advanced Manufacturing Technology; Sep2022, Vol. 122 Issue 1, p105-116, 12p, 3 Color Photographs, 1 Black and White Photograph, 1 Illustration, 3 Diagrams, 1 Chart, 10 Graphs

Subject Terms: VISCOSIMETERS, INJECTION molding of plastics, THERMOPLASTICS, MEASUREMENT of viscosity, CAPILLARIES, CORRECTION factors, NOZZLES

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding.

Authors: Kulkarni, Romit¹, Romit.Kulkarni@Hahn-Schickard.de, Soltani, Mahdi^1,2, Mahdi.Soltani@ifm.uni-stuttgart.de, Wappler, Peter¹, Peter.Wappler@Hahn-Schickard.de, Guenther, Thomas^1,2, Thomas.Guenther@ifm.uni-stuttgart.de, Fritz, Karl-Peter¹, Karl-Peter.Fritz@Hahn-Schickard.de, Groezinger, Tobias¹, Tobias.Groezinger@Hahn-Schickard.de, Zimmermann, André^1,2, zimmermann@ifm.uni-stuttgart.de

Source: Journal of Manufacturing & Materials Processing; Mar2020, p1-14, 14p

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages.

Authors: Kulkarni, Romit¹, Romit.Kulkarni@Hahn-Schickard.de, PeterWappler¹, Peter.Wappler@Hahn-Schickard.de, Soltani, Mahdi², Mahdi.Soltani@ifm.uni-stuttgart.de, Haybat, Mehmet¹, Mehmet.Haybat@Hahn-Schickard.de, Guenther, Thomas², Thomas.Guenther@ifm.uni-stuttgart.de, Groezinger, Tobias¹, Tobias.Groezinger@Hahn-Schickard.de, Zimmermann, André^1,2, Andre.Zimmermann@Hahn-Schickard.de

Source: Journal of Manufacturing & Materials Processing; Mar2019, Vol. 3 Issue 1, p1-16, 16p

Heat dissipation for MID applications in lighting technology.

Authors: Barth, Maximilian, Kulkarni, Romit, Eberhardt, Wolfgang, Meibner, Thomas, Soltani, Mahdi, Zimmermann, Andre

Source: 2016 12th International Congress Molded Interconnect Devices (MID); 2016, p1-4, 4p