Integrated Thermal Silica Micro-Resonator Waveguide System With Ultra-Low Fluorescence

Authors: Pyrlik, C., Schlegel, J., Bohm, F., Thies, A., Kruger, O., Benson, O., Wicht, A., Trankle, G.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 31(6):479-482 Mar, 2019

Manufacturable Low-Cost Flip-Chip Mounting Technology for 300–500-GHz Assemblies

Authors: Weimann, N.G., Monayakul, S., Sinha, S., Schmuckle, F., Hrobak, M., Stoppel, D., John, W., Kruger, O., Doerner, R., Janke, B., Krozer, V., Heinrich, W.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(4):494-501 Apr, 2017

Process robustness and reproducibility of sub-mm wave flip-chip interconnect assembly

Authors: Monayakul, S., Sinha, S., Schmuckle, F. J., Hrobak, M., Stoppel, D., Kruger, O., Janke, B., Weimann, N. G.

Source: 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015 IEEE 24th. :141-144 Oct, 2015

Relation: 2015 IEEE 24th Electrical Performance of Electronic Packaging and Systems (EPEPS)

A 250 GHz hetero-integrated VCO with 0.7 mW output power in InP-on-BiCMOS technology

Authors: Hossain, M., Weimann, N., Janke, B., Lisker, M., Meliani, C., Tillack, B., Kruger, O., Krozer, V., Heinrich, W.

Source: 2015 European Microwave Conference (EuMC) Microwave Conference (EuMC), 2015 European. :391-394 Sep, 2015

Relation: 2015 European Microwave Conference (EuMC 2015)

G-band frequency doubler based on InP transferred-substrate technology

Authors: Al-Sawaf, T., Hossain, M., Weimann, N., Kruger, O., Krozer, V., Heinrich, W.

Source: 2015 10th European Microwave Integrated Circuits Conference (EuMIC) Microwave Integrated Circuits Conference (EuMIC), 2015 10th European. :61-64 Sep, 2015

Relation: 2015 10th European Microwave Integrated Circuits Conference (EuMIC)

Multifinger Indium Phosphide Double-Heterostructure Transistor Circuit Technology With Integrated Diamond Heat Sink Layer

Authors: Nosaeva, K., Al-Sawaf, T., John, W., Stoppel, D., Rudolph, M., Schmuckle, F., Janke, B., Kruger, O., Krozer, V., Heinrich, W., Weimann, N.G.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(5):1846-1852 May, 2016

Flip-Chip Interconnects for 250 GHz Modules

Authors: Monayakul, S., Sinha, S., Wang, C.-T., Weimann, N., Schmuckle, F. J., Hrobak, M., Krozer, V., John, W., Weixelbaum, L., Wolter, P., Kruger, O., Heinrich, W.

Source: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 25(6):358-360 Jun, 2015

Epitaxial-Side Mounting of Terahertz Quantum- Cascade Lasers for Improved Heat Management

Authors: Kruger, O., Kreutzmann, S., Prasai, D., Wienold, M., Sharma, R., Pittroff, W., Weixelbaum, L., John, W., Biermann, K., Schrottke, L., Schnieder, F., Erbert, G., Grahn, H. T., Trankle, G.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 25(16):1570-1573 Aug, 2013

Bow Reduction of AlInGaN-Based Deep UV LED Wafers Using Focused Laser Patterning

Authors: Cho, H.K., Kulberg, A., Lobo Ploch, N., Rass, J., Ruschel, J., Kolbe, T., Knauer, A., Braun, A., Kruger, O., Einfeldt, S., Weyers, M., Kneissl, M.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 30(20):1792-1794 Oct, 2018

Electrical properties of SiGe layers grown by LPE and CVD

Authors: Kruger, O., Seifert, W., Kittler, M., Gutjahr, A., Silier, I., Konuma, M., Said, K., Caymax, M., Poortmans, J.

Source: Semiconducting and Insulating Materials 1998. Proceedings of the 10th Conference on Semiconducting and Insulating Materials (SIMC-X) (Cat. No.98CH36159) Semiconducting and insulating materials Semiconducting and Insulating Materials, 1998. (SIMC-X) Proceedings of the 10th Conference on. :185-189 1998

Relation: Proceedings of 10th International Semiconducting and Insulating Materials

Change in cloud-top temperatures over Europe

Authors: Devasthale, A., Kruger, O., Grassl, H.

Source: IEEE Geoscience and Remote Sensing Letters IEEE Geosci. Remote Sensing Lett. Geoscience and Remote Sensing Letters, IEEE. 2(3):333-336 Jul, 2005

On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

Authors: Grass, E., Tittelbach-Helmrich, K., Jagdhold, U., Troya, A., Lippert, G., Kruger, O., Lehmann, J., Maharatna, K., Dombrowski, K.F., Fiebig, N., Kraemer, R., Mahonen, P.

Source: IEEE Personal Communications IEEE Pers. Commun. Personal Communications, IEEE. 8(6):48-57 Dec, 2001

Laser Scribing for Facet Fabrication of InGaN MQW Diode Lasers on Sapphire Substrates

Authors: van Look, J.-R., Einfeldt, S., Kruger, O., Hoffmann, V., Knauer, A., Weyers, M., Vogt, P., Kneissl, M.

Source: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 22(6):416-418 Mar, 2010

InP on BiCMOS technology platform for millimeter-wave and THz MMIC

Authors: Krozer, V., Jensen, T., Kramer, T., Ostermay, I., Weimann, N., Schmuckle, F. J., Kruger, O., Heinrich, W., Lisker, M., Elkhouly, M., Glisic, S., Tillack, B., Meliani, C.

Source: 2013 6th UK, Europe, China Millimeter Waves and THz Technology Workshop (UCMMT) Millimeter Waves and THz Technology Workshop (UCMMT), 2013 6th UK, Europe, China. :1-2 Sep, 2013

Relation: 2013 6th UK, Europe, China Millimeter Waves and THz Technology Workshop (UCMMT)

Laser-assisted processing of VIAs for AlGaN/GaN HEMTs on SiC substrates

Authors: Kruger, O., Schone, G., Wernicke, T., Lossy, R., Liero, A., Schnieder, F., Wurfl, J., Trankle, G.

Source: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 27(6):425-427 Jun, 2006

Thermal conductivity and heat capacity of monosulfide of uranium.

Authors: Moser, J. B., Kruger, O. L.

Source: Journal of Applied Physics; July 1967, Vol. 38, p3215-3222, 8p

Parameters for assessing the aquatic environmental impact of cosmetic products

Authors: Vita, N.A., Brohem, C.A., Canavez, A.D.P.M., Oliveira, C.F.S., Kruger, O., Lorencini, M., Carvalho, C.M.

Source: Toxicology letters. 287:70-82

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100181287328.0x000001&indx=1&recIds=ETOCvdc_100181287328.0x000001

Numerical Modeling and Validation of the Flow in a Fluidic Oscillator
Computational fluid dynamics

Authors: Kruger, O., Bobusch, B.C., Woszidlo, R., Paschereit, C.O.

Source: AIAA COMPUTATIONAL FLUID DYNAMICS CONFERENCE. Conf 21^s^t:3587-3599

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN085302230&indx=1&recIds=ETOCCN085302230

Large Eddy Simulation of Lean Blow Off
Computational fluid dynamics

Authors: Hodizc, E., Duwig, C., Szasz, R., Kruger, O., Fuchs, L.J., Alenius, E.

Source: AIAA COMPUTATIONAL FLUID DYNAMICS CONFERENCE. Conf 21^s^t:3466-3478

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN085302163&indx=1&recIds=ETOCCN085302163

Numerical Investigations and Modal Analysis of the Coherent Structures in a Generic Swirl Burner
Computational fluid dynamics

Authors: Kruger, O., Duwig, C., Terhaar, S., Paschereit, C.O.

Source: AIAA COMPUTATIONAL FLUID DYNAMICS CONFERENCE. Conf 21^s^t:2916-2931

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN085301833&indx=1&recIds=ETOCCN085301833