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1Conference
Authors: Mori, Yuki, Cheon, Taehoon, Kotsugi, Yohei, Kim, Youn-Hye, Kwon, Woobin, Park, Young-Bae, Kim, Soo-Hyun
Source: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
Relation: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)
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2Conference
Authors: Kim, Youn-Hye, Kotsugi, Yohei, Cheon, Taehoon, Ramesh, Rahul, Kim, Soo-Hyun
Source: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021
Relation: 2021 IEEE International Interconnect Technology Conference (IITC)
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3Periodical
Authors: Sohn, Inkyu, An, Joungbin, Shin, Dain, Kim, Jaehyeok, Nakazawa, Tatsuya, Kotsugi, Yohei, Kim, Soo-Hyun, Yoon, Hwi, Shin, Won-Yong, Chung, Seung Min, Kim, Hyungjun
Source: IEEE sensors journal. 23(8):8154-8161
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4Periodical
Authors: Kotsugi, Yohei, Han, Seung-Min, Kim, Youn-Hye, Cheon, Taehoon, Nandi, Dip K., Ramesh, Rahul, Yu, Neung-Kyung, Son, Kirak, Tsugawa, Tomohiro, Ohtake, Shigeyuki
Source: Chemistry of materials. 33(14):5639-5651
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5Periodical
Authors: Mori, Yuki, Cheon, Taehoon, Kotsugi, Yohei, Kim, Youn‐Hye, Park, Yejin, Ansari, Mohd Zahid, Mohapatra, Debananda, Jang, Yujin, Bae, Jong‐Seong, Kwon, Woobin, Kim, Gahui, Park, Young‐Bae, Lee, Han‐Bo‐Ram, Song, Wooseok, Kim, Soo‐Hyun
Source: Small. 19(34)
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6Periodical
Authors: Kim, Youn‐Hye, Kim, Minsu, Kotsugi, Yohei, Cheon, Taehoon, Mohapatra, Debananda, Jang, Yujin, Bae, Jong‐Seong, Hong, Tae Eun, Ramesh, Rahul, An, Ki‐Seok, Kim, Soo‐Hyun
Source: Advanced functional materials. 32(44)
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7Academic Journal
Authors: Kim, Youn‐Hye, Kim, Minsu, Kotsugi, Yohei, Cheon, Taehoon, Mohapatra, Debananda, Jang, Yujin, Bae, Jong‐Seong, Hong, Tae Eun, Ramesh, Rahul, An, Ki‐Seok, Kim, Soo‐Hyun
Source: Advanced Functional Materials; 10/26/2022, Vol. 32 Issue 44, p1-9, 9p
Subject Terms: DIFFUSION barriers, ATOMIC layer deposition, MULTILAYERED thin films, DIFFUSION, THIN films, 3-D films
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8Academic Journal
Authors: Nakazawa, Tatsuya, Kim, Donghyun, Kim, Jaehyeok, Kotsugi, Yohei, Cheon, Taehoon, Chung, Seung-Min, Kim, Soo-Hyun, Kim, Hyungjun
Source: Rare Metals; Sep2022, Vol. 41 Issue 9, p3086-3099, 14p
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9Periodical
Authors: Sohn, Inkyu, An, Joungbin, Shin, Dain, Kim, Jaehyeok, Nakazawa, Tatsuya, Kotsugi, Yohei, Kim, Soo-Hyun, Yoon, Hwi, Shin, Won-Yong, Chung, Seung Min, Kim, Hyungjun
Source: IEEE Sensors Journal; 2023, Vol. 23 Issue: 8 p8154-8161, 8p
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10Periodical
Source: Japanese Journal of Applied Physics; August 2024, Vol. 63 Issue: 8 p085502-085502, 1p