Impact of 3D stacking on the TSV-induced stress and the CMOS characteristics

Authors: Dote, Aki, Tashiro, Hiroko, Kitada, Hideki, Tadaki, Shinji, Miyahara, Shoichi, Sakuyama, Seiki

Source: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-5 Dec, 2017

Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)

Development of high-performance ultra large scale 3D processor with high reliability packaging design

Authors: Tadaki, Shinji, Kitada, Hideki, Dote, Aki, Miyahara, Shouichi, Masuyama, Takumi, Kainuma, Norio, Nakamura, Naoaki, Kira, Hidehiko, Sakuyama, Seiki, Nakata, Tatsumi

Source: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2017 12th International. :81-84 Oct, 2017

Relation: 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Reducing relapse through maintenance steroid treatment can decrease the cancer risk in patients with IgG4‐sclerosing cholangitis: Based on a Japanese nationwide study

Authors: Kubota, Kensuke, Kamisawa, Terumi, Nakazawa, Takahiro, Tanaka, Atsushi, Naitoh, Itaru, Kurita, Yusuke, Takikawa, Hajime, Unno, Michiaki, Kawa, Shigeyuki, Masamune, Atsushi, Nakamura, Seiji, Okazaki, Kazuichi, Furumatsu, Keisuke, Sawai, Shigeaki, Goto, Takuma, Okumura, Toshikatsu, Suzuki, Daisuke, Otsuka, Masayuki, Kobori, Ikuhiro, Tamano, Masaya, Koizumi, Mitsuhito, Hiasa, Yoichi, Kawabe, Naoto, Hirooka, Yoshiki, Yamamoto, Satoshi, Asano, Yukio, Inui, Kazuo, Horiguchi, Akihiko, Watanabe, Hiroyuki, Toya, Daishu, Hatayama, Katsuko, Ueki, Toshiharu, Kinoshita, Norikatsu, Sugimoto, Mitsuru, Ohira, Hiromasa, Mukai, Tsuyoshi, Tomita, Eiichi, Iwata, Keisuke, Shimizu, Shogo, Suetsugu, Jun, Shimizu, Masahito, Tsuji, Keiji, Ishida, Ryoko, Ito, Masanori, Furukawa, Ryutaro, Sakamoto, Naoya, Araki, Masahiro, Tanno, Satoshi, Sakamoto, Yasunari, Ito, Tetsuhide, Takai, Satoshi, Ikeya, Shinichi, Yamada, Takanori, Kudara, Norihiko, Shimizu, Akinori, Hanada, Keiji, Ichiki, Yasunori, Kitada, Hideki, Hifumi, Michio, Kimura, Hiroyuki, Kurosaki, Masayuki, Izumi, Namiki, Sumi, Hajime, Haruta, Jun‐ichi, Hayashi, Katsumi, Harada, Ryo, Inoue, Masafumi, Nakamura, Shinichiro, Ito, Tetsuya, Tomishima, Ko, Isayama, Hiroyuki, Oura, Kyoko, Masaki, Tsutomu, Shimokawahara, Naoto, Tanoue, Shirou, Maemura, Kousei, Ido, Akio, Mizushima, Ichiro, Kawano, Mitsuhiro, Yoshida, Katsunori, Naganuma, Makoto, Murata, Miki, Nishio, Akiyoshi, Fujita, Yuji, Teratani, Takuma, Matsubara, Shohei, Tamai, Hironao, Yoshida, Yuu, Azemoto, Ryousaku, Kamata, Ken, Watanabe, Tomohiro, Kurosu, Takahiro, Koizumi, Wasaburou, Fujita, Jun, Seki, Hideyuki, Ueda, Yasuhiro, Fukumoto, Takumi, Kousaki, Takuhiro, Uchida, Kazushige, Ochiai, Toshimasa, Kawasaki, Takeshi, Tanaka, Motohiko, Ishida, Etsuji, Notohara, Kenji, Mori, Hideaki, Mori, Toshiyuki, Kawabata, Hideaki, Miyata, Masatoshi, Sakagami, Junichi, Itoh, Yoshito, Shiokawa, Masahiro, Seno, Hiroshi, Watanabe, Noriko, Kataoka, Hiromi, Aoki, Toshinori, Fujishiro, Mitsuhiro, Niihara, Toru, Nishimata, Hiroto, Mitoro, Akira, Yoshiji, Hitoshi, Yoshida, Motoyuki, Ikeda, Masafumi, Tomita, Kengo, Hokari, Ryota, Hayasaka, Kenji, Amano, Yuji, Shioji, Kazuhiko, Hayashi, Kazunao, Terai, Shuji, Nakajima, Michiko, Yamahana, Junya, Matsumoto, Ryusuke, Kikuchi, Hideaki, Kanamori, Akira, Kiriyama, Seiki, Iwatsu, Shinichi, Kato, Yuji, Horiguchi, Shigeru, Yagi, Takahito, Okada, Hiroyuki, Ohkawa, Kazuyoshi, Hirao, Motohiro, Hiramatsu, Naoki, Oza, Noriko, Imamura, Haruo, Baba, Takeshi, Nakano, Shigeru, Shinobi, Tetsuya, Ryozawa, Shomei, Motoya, Masayo, Nakase, Hiroshi, Kinoshita, Noboru, Ito, Kei, Miyake, Tatsuya, Kohge, Naruaki, Tobita, Hiroshi, Joshita, Satoru, Umemura, Takeji, Kawaguchi, Shinya, Ohno, Kazuya, Sonobe, Koichi, Satoh, Akihiko, Shimosegawa, Tooru, Miura, Fumihiko, Yagi, Minami, Sano, Keiji, Kin, Toshifumi, Katanuma, Akio, Koike, Kazuhiko, Miura, Shin, Kawashima, Youhei, Kagawa, Tatehiro, Azuma, Seishin, Watanabe, Mamoru, Honjyo, Mitsuyoshi, Itoi, Takao, Honda, Akira, Kobayashi, Katsumasa, Asano, Toru, Mizuno, Suguru, Nishino, Takayoshi, Taniguchi, Hideaki, Tajiri, Kazuto, Yasuda, Ichiro, Tanaka, Yoshiya, Oe, Shinji, Harada, Masaru, Kurata, Masanao, Fukasawa, Mituharu, Enomoto, Nobuyuki, Kawaji, Yuki, Kitano, Masayuki, Nishise, Yuko, Hirakawa, Hidetoshi, Ishizawa, Tetsuya, Ueno, Yoshiyuki, Kaino, Miyuki, Fujimoto, Yuko, Sakaida, Isao

Source: Journal of gastroenterology and hepatology. 38(4):556-564

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100182179288.0x000001&indx=1&recIds=ETOCvdc_100182179288.0x000001

Study of MOSFET thermal stability with TSV in operation temperature using novel 3D-LSI stress analysis

Authors: Kitada, Hideki, Tashiro, Hiroko, Miyahara, Shoichi, Ishitsuka, Takeshi, Dote, Aki, Tadaki, Shinji, Nakada, Tatsumi, Sakuyama, Seiki

Source: 2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016

Relation: 2016 IEEE International 3D Systems Integration Conference (3DIC)

Thermal stress reliability of copper through silicon via interconnects for 3D logic devices

Authors: Kitada, Hideki, Tashiro, Hiroko, Miyahara, Shoichi, Dote, Aki, Tadaki, Shinji, Sakuyama, Seiki

Source: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2016 IEEE 18th. :115-119 Nov, 2016

Relation: 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)

Study of Chip Stacking Process and Electrical Characteristic Evaluation of Cu Pillar Joint Between Chips Including TSV

Authors: Akamatsu, Toshiya, Tadaki, Shinji, Yamazaki, Kazutoshi, Kitada, Hideki, Sakuyama, Seiki

Source: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1827-1833 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Characterization of Warpages and Layout-Dependent Local-Deformations for Large Die 3D Stacking

Authors: Dote, Aki, Kitada, Hideki, Mizushima, Yoriko, Nakamura, Tomoji, Sakuyama, Seiki

Source: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1899-1904 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Thermal stress destruction analysis in low-k layer by via-last TSV structure

Authors: Kitada, Hideki, Akamatsu, Toshiya, Mizushima, Yoriko, Ishitsuka, Takeshi, Sakuyama, Seiki

Source: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1840-1845 May, 2015

Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

An innovative bumpless stacking with through silicon via for 3D Wafer-on-Wafer (WOW) integration

Authors: Liao, Sue-Chen, Chen, Erh-Hao, Chen, Chien-Chou, Chen, Shang-Chun, Chen, Jui-Chin, Chang, Po-Chih, Chang, Yiu-Hsiang, Lin, Cha-Hsin, Ku, Tzu-Kun, Kao, Ming-Jer, Kim, Young Suk, Maeda, Nobuhide, Kodama, Shoichi, Kitada, Hideki, Fujimoto, Koji, Ohba, Takayuki

Source: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :1853-1856 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Steroid therapy still plays a crucial role and could serve as a bridge to the next promising treatments in patients with IgG4‐related sclerosing cholangitis: Results of a Japanese nationwide study

Authors: Kubota, Kensuke, Kamisawa, Terumi, Nakazawa, Takahiro, Tanaka, Atsushi, Naitoh, Itaru, Takikawa, Hajime, Unno, Michiaki, Kawa, Shigeyuki, Masamune, Atsushi, Nakamura, Seiji, Okazaki, Kazuichi, Furumatsu, Keisuke, Sawai, Shigeaki, Goto, Takuma, Okumura, Toshikatsu, Suzuki, Daisuke, Otsuka, Masayuki, Kobori, Ikuhiro, Tamano, Masaya, Koizumi, Mitsuhito, Hiasa, Yoichi, Kawabe, Naoto, Hirooka, Yoshiki, Yamamoto, Satoshi, Asano, Yukio, Inui, Kazuo, Horiguchi, Akihiko, Watanabe, Hiroyuki, Toya, Daishu, Hatayama, Katsuko, Ueki, Toshiharu, Kinoshita, Norikatsu, Sugimoto, Mitsuru, Ohira, Hiromasa, Mukai, Tsuyoshi, Tomita, Eiichi, Iwata, Keisuke, Shimizu, Shogo, Suetsugu, Jun, Shimizu, Masahito, Tsuji, Keiji, Ishida, Ryoko, Ito, Masanori, Furukawa, Ryutaro, Sakamoto, Naoya, Araki, Masahiro, Tanno, Satoshi, Sakamoto, Yasunari, Ito, Tetsuhide, Takai, Satoshi, Ikeya, Shinichi, Yamada, Takanori, Kudara, Norihiko, Shimizu, Akinori, Hanada, Keiji, Ichiki, Yasunori, Kitada, Hideki, Hifumi, Michio, Kimura, Hiroyuki, Kurosaki, Masayuki, Izumi, Namiki, Sumi, Hajime, Hayashi, Katsumi, Harada, Ryo, Inoue, Masafumi, Nakamura, Shinichiro, Ito, Tetsuya, Tomishima, Ko, Isayama, Hiroyuki, Oura, Kyoko, Masaki, Tsutomu, Shimokawahara, Naoto, Tanoue, Shirou, Maemura, Kousei, Ido, Akio, Mizushima, Ichiro, Kawano, Mitsuhiro, Yoshida, Katsunori, Naganuma, Makoto, Murata, Miki, Nishio, Akiyoshi, Fujita, Yuji, Teratani, Takuma, Matsubara, Shohei, Tamai, Hironao, Yoshida, Yuu, Azemoto, Ryousaku, Kamata, Ken, Watanabe, Tomohiro, Kurosu, Takahiro, Koizumi, Wasaburou, Fujita, Jun, Seki, Hideyuki, Ueda, Yasuhiro, Fukumoto, Takumi, Kousaki, Takuhiro, Uchida, Kazushige, Ochiai, Toshimasa, Kawasaki, Takeshi, Tanaka, Motohiko, Ishida, Etsuji, Notohara, Kenji, Mori, Hideaki, Mori, Toshiyuki, Kawabata, Hideaki, Miyata, Masatoshi, Sakagami, Junichi, Itoh, Yoshito, Shiokawa, Masahiro, Seno, Hiroshi, Watanabe, Noriko, Kataoka, Hiromi, Aoki, Toshinori, Fujishiro, Mitsuhiro, Niihara, Toru, Nishimata, Hiroto, Mitoro, Akira, Yoshiji, Hitoshi, Yoshida, Motoyuki, Ikeda, Masafumi, Tomita, Kengo, Hokari, Ryota, Hayasaka, Kenji, Amano, Yuji, Shioji, Kazuhiko, Hayashi, Kazunao, Terai, Shuji, Nakajima, Michiko, Yamahana, Junya, Matsumoto, Ryusuke, Kikuchi, Hideaki, Kanamori, Akira, Kiriyama, Seiki, Iwatsu, Shinichi, Kato, Yuji, Horiguchi, Shigeru, Yagi, Takahito, Okada, Hiroyuki, Ohkawa, Kazuyoshi, Hirao, Motohiro, Hiramatsu, Naoki, Oza, Noriko, Imamura, Haruo, Baba, Takeshi, Nakano, Shigeru, Shinobi, Tetsuya, Ryozawa, Shomei, Motoya, Masayo, Nakase, Hiroshi, Kinoshita, Noboru, Ito, Kei, Miyake, Tatsuya, Kohge, Naruaki, Tobita, Hiroshi, Joshita, Satoru, Umemura, Takeji, Kawaguchi, Shinya, Ohno, Kazuya, Sonobe, Koichi, Satoh, Akihiko, Shimosegawa, Tooru, Miura, Fumihiko, Yagi, Minami, Sano, Keiji, Kin, Toshifumi, Katanuma, Akio, Koike, Kazuhiko, Miura, Shin, Kawashima, Youhei, Kagawa, Tatehiro, Azuma, Seishin, Watanabe, Mamoru, Honjyo, Mitsuyoshi, Itoi, Takao, Honda, Akira, Kobayashi, Katsumasa, Asano, Toru, Mizuno, Suguru, Nishino, Takayoshi, Taniguchi, Hideaki, Tajiri, Kazuto, Yasuda, Ichiro, Tanaka, Yoshiya, Oe, Shinji, Harada, Masaru, Kurata, Masanao, Fukasawa, Mituharu, Enomoto, Nobuyuki, Kawaji, Yuki, Kitano, Masayuki, Nishise, Yuko, Hirakawa, Hidetoshi, Ishizawa, Tetsuya, Ueno, Yoshiyuki, Kaino, Miyuki, Fujimoto, Yuko, Sakaida, Isao

Source: Journal of hepato-biliary-pancreatic sciences. 29(8):884-897

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100158983365.0x000001&indx=1&recIds=ETOCvdc_100158983365.0x000001

Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects

Authors: Nakamura, Tomoji, Kitada, Hideki, Mizushima, Yoriko, Maeda, Nobuhide, Fujimoto, Koji, Ohba, Takayuki

Source: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-4 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures

Authors: Nakatsuka, Osamu, Kitada, Hideki, Kim, Young Suk, Mizushima, Yoriko, Nakamura, Tomoji, Ohba, Takayuki, Zaima, Shigeaki

Source: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-4 Jan, 2012

Relation: 2011 IEEE International 3D Systems Integration Conference (3DIC)

Development of multi-stack process on wafer-on-wafer (WOW)

Authors: Fujimoto, Koji, Maeda, Nobuhide, Kitada, Hideki, Kim, Youngsuk, Kawai, Akihito, Arai, Kazuhisa, Nakamura, Tomoji, Suzuki, Kousuke, Ohba, Takayuki

Source: 2010 IEEE CPMT Symposium Japan CPMT Symposium Japan, 2010 IEEE. :1-4 Aug, 2010

Relation: 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan)

Clinical characteristics of immunoglobulin IgG4-related sclerosing cholangitis: Comparison of cases with and without autoimmune pancreatitis in a large cohort

Authors: Furumatsu, Keisuke, Sawai, Shigeaki, Goto, Takuma, Okumura, Toshikatsu, Suzuki, Daisuke, Otsuka, Masayuki, Kobori, Ikuhiro, Tamano, Masaya, Koizumi, Mitsuhito, Hiasa, Yoichi, Kawabe, Naoto, Hirooka, Yoshiki, Yamamoto, Satoshi, Asano, Yukio, Inui, Kazuo, Horiguchi, Akihiko, Watanabe, Hiroyuki, Toya, Daishu, Hatayama, Katsuko, Ueki, Toshiharu, Kinoshita, Norikatsu, Sugimoto, Mitsuru, Ohira, Hiromasa, Mukai, Tsuyoshi, Tomita, Eiichi, Iwata, Keisuke, Shimizu, Shogo, Suetsugu, Jun, Shimizu, Masahito, Tsuji, Keiji, Ishida, Ryoko, Ito, Masanori, Furukawa, Ryutaro, Sakamoto, Naoya, Araki, Masahiro, Tanno, Satoshi, Sakamoto, Yasunari, Ito, Tetsuhide, Takai, Satoshi, Ikeya, Shinichi, Yamada, Takanori, Kudara, Norihiko, Shimizu, Akinori, Hanada, Keiji, Ichiki, Yasunori, Kitada, Hideki, Hifumi, Michio, Kimura, Hiroyuki, Kurosaki, Masayuki, Izumi, Namiki, Sumi, Hajime, Haruta, Jun-ichi, Hayashi, Katsumi, Harada, Ryo, Inoue, Masafumi, Nakamura, Shinichiro, Ito, Tetsuya, Tomishima, Ko, Isayama, Hiroyuki, Oura, Kyoko, Masaki, Tsutomu, Shimokawahara, Naoto, Tanoue, Shirou, Maemura, Kousei, Ido, Akio, Mizushima, Ichiro, Kawano, Mitsuhiro, Yoshida, Katsunori, Naganuma, Makoto, Murata, Miki, Nishio, Akiyoshi, Fujita, Yuji, Teratani, Takuma, Matsubara, Shohei, Tamai, Hironao, Yoshida, Yuu, Azemoto, Ryousaku, Kamata, Ken, Watanabe, Tomohiro, Kurosu, Takahiro, Koizumi, Wasaburou, Fujita, Jun, Seki, Hideyuki, Ueda, Yasuhiro, Fukumoto, Takumi, Kousaki, Takuhiro, Uchida, Kazushige, Ochiai, Toshimasa, Kawasaki, Takeshi, Tanaka, Motohiko, Ishida, Etsuji, Notohara, Kenji, Mori, Hideaki, Mori, Toshiyuki, Kawabata, Hideaki, Miyata, Masatoshi, Sakagami, Junichi, Itoh, Yoshito, Shiokawa, Masahiro, Seno, Hiroshi, Watanabe, Noriko, Naitoh, Itaru, Kataoka, Hiromi, Aoki, Toshinori, Fujishiro, Mitsuhiro, Niihara, Toru, Nishimata, Hiroto, Mitoro, Akira, Yoshiji, Hitoshi, Yoshida, Motoyuki, Ikeda, Masafumi, Tomita, Kengo, Hokari, Ryota, Hayasaka, Kenji, Amano, Yuji, Shioji, Kazuhiko, Hayashi, Kazunao, Terai, Shuji, Nakajima, Michiko, Yamahana, Junya, Matsumoto, Ryusuke, Kikuchi, Hideaki, Kanamori, Akira, Kiriyama, Seiki, Iwatsu, Shinichi, Kato, Yuji, Horiguchi, Shigeru, Yagi, Takahito, Okada, Hiroyuki, Ohkawa, Kazuyoshi, Hirao, Motohiro, Hiramatsu, Naoki, Oza, Noriko, Imamura, Haruo, Baba, Takeshi, Nakano, Shigeru, Shinobi, Tetsuya, Ryozawa, Shomei, Motoya, Masayo, Nakase, Hiroshi, Kinoshita, Noboru, Ito, Kei, Miyake, Tatsuya, Kohge, Naruaki, Tobita, Hiroshi, Joshita, Satoru, Umemura, Takeji, Kawaguchi, Shinya, Ohno, Kazuya, Sonobe, Koichi, Satoh, Akihiko, Shimosegawa, Tooru, Miura, Fumihiko, Yagi, Minami, Sano, Keiji, Tanaka, Atsushi, Kin, Toshifumi, Katanuma, Akio, Koike, Kazuhiko, Miura, Shin, Masamune, Atsushi, Kawashima, Youhei, Kagawa, Tatehiro, Azuma, Seishin, Watanabe, Mamoru, Honjyo, Mitsuyoshi, Itoi, Takao, Honda, Akira, Kobayashi, Katsumasa, Asano, Toru, Kamisawa, Terumi, Mizuno, Suguru, Nishino, Takayoshi, Taniguchi, Hideaki, Tajiri, Kazuto, Yasuda, Ichiro, Tanaka, Yoshiya, Oe, Shinji, Harada, Masaru, Kurata, Masanao, Fukasawa, Mituharu, Enomoto, Nobuyuki, Kawaji, Yuki, Kitano, Masayuki, Nishise, Yuko, Hirakawa, Hidetoshi, Ishizawa, Tetsuya, Ueno, Yoshiyuki, Kaino, Miyuki, Fujimoto, Yuko, Sakaida, Isao, Kubota, Kensuke, Nakazawa, Takahiro, Takikawa, Hajime, Unno, Michiaki, Kawa, Shigeyuki, Nakamura, Seiji, Okazaki, Kazuichi

Source: In Digestive and Liver Disease October 2021 53(10):1308-1314

Comparison of endoscopic submucosal resection with ligation and endoscopic submucosal dissection for small rectal neuroendocrine tumors: A multicenter retrospective study

Authors: Matsuno, Kenshi, Miyamoto, Hideaki, Kitada, Hideki, Yoshimatsu, Shinichi, Tamura, Fumio, Sakurai, Kouichi, Fukubayashi, Kotaro, Shono, Takashi, Setoyama, Hiroko, Matsuyama, Taichi, Suko, Shinichiro, Narita, Rei, Honda, Munenori, Tateyama, Masakuni, Naoe, Hideaki, Morinaga, Jun, Tanaka, Yasuhito, Gushima, Ryosuke

Source: DEN open. 3(1)

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100186405898.0x000001&indx=1&recIds=ETOCvdc_100186405898.0x000001

TSV (through silicon via) interconnection on wafer-on-a-wafer (WOW) with MEMS technology

Authors: Fujimoto, Koji, Maeda, Nobuhide, Kitada, Hideki, Suzuki, Kosuke, Nakamura, Tomoji, Ohba, Takayuki

Source: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International. :1877-1880 Jun, 2009

Relation: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference

Wafer-on-wafer (WOW) stacking with damascene-contact TSV for 3D integration

Authors: Maeda, Nobuhide, Kitada, Hideki, Fujimoto, Koji, Suzuki, Kousuke, Nakamura, Tomoji, Kawai, Akihito, Arai, Kazuhisa, Ohba, Takayuki

Source: Proceedings of 2010 International Symposium on VLSI Technology, System and Application VLSI Technology Systems and Applications (VLSI-TSA), 2010 International Symposium on. :158-159 Apr, 2010

Relation: 2010 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA)

History of Air Spring Development for Shinkansen Trains

Authors: Kitada, Hideki

Source: SEI technical review. 84:114-119

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN611128562&indx=1&recIds=ETOCRN611128562

Advanced wafer thinning technology and feasibility test for 3D integration

Authors: Kim, Young Suk, Maeda, Nobuhide, Kitada, Hideki, Fujimoto, Koji, Kodama, Shoichi, Kawai, Akihito, Arai, Kazuhisa, Suzuki, Kousuke, Nakamura, Tomoji, Ohba, Takayuki

Source: In Microelectronic Engineering July 2013 107:65-71

Semiconductor device with first and second semiconductor substrates