Inter Submesh Border Information Coding with Skip Mode in V-DMC

Authors: Kishimoto, Koki, Kawamura, Kei, Kato, Haruhisa

Source: 2024 IEEE International Conference on Visual Communications and Image Processing (VCIP) Visual Communications and Image Processing (VCIP), 2024 IEEE International Conference on. :1-5 Dec, 2024

Relation: 2024 IEEE International Conference on Visual Communications and Image Processing (VCIP)

Simulation of Space Charge Behavior in Silicone Gel Above Edge Termination Area of Power Chip

Authors: Kishimoto, Koki, Kadowaki, Kazutake, Shiota, Hiroki, Muto, Hirotaka

Source: 2024 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2024 IEEE Conference on. :1-4 Oct, 2024

Relation: 2024 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

A Novel Evaluation Method of the Effect of Space Charge in Insulating Materials to IGBTs Blocking Voltage

Authors: Muto, Hirotaka, Yamatake, Atsushi, Shiota, Hiroki, Kishimoto, Koki, Kitamura, Shuichi

Source: 2024 IEEE 5th International Conference on Dielectrics (ICD) Dielectrics (ICD), 2024 IEEE 5th International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE 5th International Conference on Dielectrics (ICD)

1D displacement coding for the displaced subdivision surface

Authors: Kishimoto, Koki, Kawamura, Kei, Kato, Haruhisa

Source: 2023 IEEE International Conference on Visual Communications and Image Processing (VCIP) Visual Communications and Image Processing (VCIP), 2023 IEEE International Conference on. :1-5 Dec, 2023

Relation: 2023 IEEE International Conference on Visual Communications and Image Processing (VCIP)

TCAD Simulation Modeling of Mold Epoxy Resin Applied for Encapsulation of Power Devices

Authors: Tamaki, Tomohiro, Ebihara, Kohei, Konishi, Kazuya, Kishimoto, Koki, Soneda, Shinya, Takahashi, Tetsuo, Nitta, Tetsuya, Watahiki, Tatsuro, Lee, Keunsam

Source: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2023 35th International Symposium on. :286-289 May, 2023

Relation: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

Safety Support System for Bicycles based on Sensor Network Consisting of Various Sensors

Authors: Kishimoto, Koki, Yamamoto, Hiroshi

Source: 2023 IEEE International Conference on Consumer Electronics (ICCE) Consumer Electronics (ICCE), 2023 IEEE International Conference on. :1-6 Jan, 2023

Relation: 2023 IEEE International Conference on Consumer Electronics (ICCE)

Overcoming barriers to proactive plastic recycling toward a sustainable future

Authors: Chapman, Andrew, Sen, Kanchan Kumar, Mochida, Takako, Yoshimoto, Yuuki, Kishimoto, Koki

Source: In Environmental Challenges December 2024 17

Binarized Canonical Polyadic Decomposition for Knowledge Graph Completion

Authors: Kishimoto, Koki, Hayashi, Katsuhiko, Akai, Genki, Shimbo, Masashi

Subject Terms: Computer Science - Machine Learning, Statistics - Machine Learning

Access URL: http://arxiv.org/abs/1912.02686

Binarized Knowledge Graph Embeddings

Authors: Kishimoto, Koki, Hayashi, Katsuhiko, Akai, Genki, Shimbo, Masashi, Komatani, Kazunori

Subject Terms: Computer Science - Machine Learning, Computer Science - Information Retrieval, Statistics - Machine Learning

Access URL: http://arxiv.org/abs/1902.02970

Treatment strategy for surgical site infection post posterior lumbar interbody fusion: A retrospective study

Authors: Nakamura, Shigeko, Nakai, Tsuyoshi, Hosozawa, Koki, Tanaka, Yudai, Kishimoto, Koki, Sakata, Kosuke, Iwata, Hirokazu, Okada, Seiji

Source: Journal of orthopaedics. 31:40-44

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100166529925.0x000001&indx=1&recIds=ETOCvdc_100166529925.0x000001

Binarized Embeddings for Fast, Space-Efficient Knowledge Graph Completion

Authors: Hayashi, Katsuhiko, Kishimoto, Koki, Shimbo, Masashi

Source: IEEE transactions on knowledge and data engineering. 35(1):141-153

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCvdc_100167493672.0x000001&indx=1&recIds=ETOCvdc_100167493672.0x000001

Toward Economically Efficient Carbon Reduction: Contrasting Greening Plastic Supply Chains with Alternative Energy Policy Approaches.

Authors: Yoshimoto, Yuuki, Kishimoto, Koki, Sen, Kanchan Kumar, Mochida, Takako, Chapman, Andrew

Source: Sustainability (2071-1050); Sep2023, Vol. 15 Issue 17, p13229, 19p

Binarized Embeddings for Fast, Space-Efficient Knowledge Graph Completion

Authors: Hayashi, Katsuhiko, Kishimoto, Koki, Shimbo, Masashi

Source: IEEE Transactions on Knowledge and Data Engineering; January 2023, Vol. 35 Issue: 1 p141-153, 13p

The start of a new generation of TBMs

Authors: Kondo, Yasunori¹, Iihara, Akihiko¹, Kishimoto, Koki¹

Source: Tunneling & Underground Space Technology. May2006, Vol. 21 Issue 3/4, p259-259. 1p.