Showing 1 - 20 results of 1,749 Refine Results
  1. 1
    Academic Journal
  2. 2
    Academic Journal

    Source: IEEE Transactions on Knowledge and Data Engineering IEEE Trans. Knowl. Data Eng. Knowledge and Data Engineering, IEEE Transactions on. 35(1):141-153 Jan, 2023

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  3. 3
    Academic Journal
  4. 4
    Academic Journal

    Source: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 28(4):685-694 Aug, 2019

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  15. 15
    Conference

    Source: 2018 IEEE International Magnetics Conference (INTERMAG) Magnetics Conference (INTERMAG), 2018 IEEE International. :1-1 Apr, 2018

    Relation: 2018 IEEE International Magnetics Conference (INTERMAG)

  16. 16
    Conference

    Source: OFC 2014 Optical Fiber Communications Conference and Exhibition (OFC), 2014. :1-3 Mar, 2014

    Relation: 2014 Optical Fiber Communications Conference and Exhibition (OFC)

  17. 17
    Conference

    Source: 2005 International Symposium on System-on-Chip System-on-Chip, 2005. Proceedings. 2005 International Symposium on. :137-140 2005

    Relation: 2005 International Symposium on System-on-Chip

  18. 18
    Conference

    Source: 2005 International Symposium on Electronics Materials and Packaging Electronics Materials and Packaging Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on. :262-267 2005

    Relation: EMAP 2005. 2005 International Symposium on Electronics Materials and Packaging

  19. 19
    Conference

    Source: 2005 International Symposium on Electronics Materials and Packaging Electronics Materials and Packaging Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on. :150-155 2005

    Relation: EMAP 2005. 2005 International Symposium on Electronics Materials and Packaging

  20. 20
    Conference

    Source: 2005 International Symposium on Electronics Materials and Packaging Electronics Materials and Packaging Electronics Materials and Packaging, 2005. EMAP 2005. International Symposium on. :232-237 2005

    Relation: EMAP 2005. 2005 International Symposium on Electronics Materials and Packaging