An ensemble learning-based machine learning with voting mechanism for chronic disease prediction

Authors: Njimbouom, S.N., Kim, J.-D., Zonyfar, C., Lee, H., Lee, T., Lee, J.-B.

Source: 2024 International Conference on Artificial Intelligence, Computer, Data Sciences and Applications (ACDSA) Artificial Intelligence, Computer, Data Sciences and Applications (ACDSA), 2024 International Conference on. :1-6 Feb, 2024

Relation: 2024 International Conference on Artificial Intelligence, Computer, Data Sciences and Applications (ACDSA)

Polite Centralized Random Backoff for Seamless Transition to Collision Free Wi-Fi Networks

Authors: Kim, J. D., Laurenson, D. I., Thompson, J. S.

Source: 2019 25th Asia-Pacific Conference on Communications (APCC) Communications (APCC), 2019 25th Asia-Pacific Conference on. :437-442 Nov, 2019

Relation: 2019 25th Asia-Pacific Conference on Communications (APCC)

Reducing Interference by Three Bit Scheduling Information in Wireless Local Area Networks

Authors: Kim, J. D., Laurenson, D. I., Thompson, J. S.

Source: 2019 IEEE 30th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC) Personal, Indoor and Mobile Radio Communications (PIMRC), 2019 IEEE 30th Annual International Symposium on. :1-6 Sep, 2019

Relation: 2019 IEEE 30th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)

Fair and efficient full duplex MAC protocol based on the IEEE 802.11 DCF

Authors: Kim, J. D., Laurenson, D. I., Thompson, J. S.

Source: 2016 IEEE 27th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC) Personal, Indoor, and Mobile Radio Communications (PIMRC), 2016 IEEE 27th Annual International Symposium on. :1-6 Sep, 2016

Relation: 2016 IEEE 27th Annual International Symposium on Personal, Indoor, and Mobile Radio Communications (PIMRC)

A 3-D Camera With Adaptable Background Light Suppression Using Pixel-Binning and Super-Resolution

Authors: Cho, J., Choi, J., Kim, S.-J., Park, S., Shin, J., Kim, J. D. K., Yoon, E.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 49(10):2319-2332 Oct, 2014

PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement

Authors: Kim, J.-D., Choi, W.-S., Park, K.-S., Kim, E.-H., Lee, S.-B., Kim, H.-G.

Source: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585) Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2004. IEEE/CPMT/SEMI 29th International. :40-44 2004

Relation: IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

An Energy Efficient Active RFID Protocol to Avoid Overhearing Problem

Authors: Lee, C.-S., Kim, D.-H., Kim, J.-D.

Source: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 14(1):15-24 Jan, 2014

Large area MoS2 van der Waals epitaxy on III-Ns and the epitaxial formation of a n-MoS2/p-InGaN diode

Authors: Jung, Kyooho, Liu, Che-Yu, Kim, J D, Choi, Wonsik, Zhou, Weidong, Kuo, Hao-Chung, Li, Xiuling

Source: 2016 IEEE Photonics Conference (IPC) Photonics Conference (IPC), 2016 IEEE. :657-658 Oct, 2016

Relation: 2016 IEEE Photonics Conference (IPC)

Wafer bumping technology for LDI application by electroless nickel plating

Authors: Kim, J.-D., Kim, Y.-N., Lee, J.-W., Park, J.-H., Kim, H.-G., Kim, J.-O.

Source: IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. Electronics manufacturing technology Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International. :319-322 2003

Relation: 28th International Electronics Manufacturing Technology Symposium

A CMOS Image Sensor Based on Unified Pixel Architecture With Time-Division Multiplexing Scheme for Color and Depth Image Acquisition

Authors: Kim, S.-J., Kim, J. D. K., Kang, B., Lee, K.

Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 47(11):2834-2845 Nov, 2012

Methodology to Predict Substrate Warpage and Different Techniques to Achieve Substrate Warpage Targets

Authors: Raghavan, S., Klein, K., Yoon, S., Kim, J.-D., Moon, K.-S., Wong, C. P., Sitaraman, S. K.

Source: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 1(7):1064-1074 Jul, 2011

Enhancement of Mechanical and Thermal Characteristics of Polyurethane-Based Composite with Silica Aerogel
Frontiers of composite materials (International conference)

Authors: Ahn, J. H., Kim, J. H., Kim, J. D., Kim, S. K., Park, K. H., Park, S. K., Lee, J. M.

Source: Materials science forum. 951:63-70

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN605193259&indx=1&recIds=ETOCCN605193259

A Cost-Effective MEMS Cavity Packaging Technology for Mass Production

Authors: Lee, J. S., Faheem, F. F., Kim, J. T., Jung, J. D., Kim, J. Y., Kim, J. D., Lee, C. H.

Source: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 32(2):453-460 May, 2009

Dynamic Formation of Diffraction Grating in a Photorefractive Liquid Crystal Cell With Mesoporous $\hbox{TiO}_{2}$ Layers

Authors: Jang, K.-S., Yang, H.-M., Kim, J., Kim, J.-D.

Source: IEEE Transactions on Nanotechnology IEEE Trans. Nanotechnology Nanotechnology, IEEE Transactions on. 7(2):115-119 Mar, 2008

An algorithmic approach to the improvement of efficiency for surface mounting machines

Authors: Hong, J.-M., Lee, S.-H., Kim, D.-W., Lee, B.-H., Kim, J.-D., Kim, J.-O.

Source: Proceedings of 1995 IEEE International Conference on Robotics and Automation Robotics and automation Robotics and Automation, 1995. Proceedings., 1995 IEEE International Conference on. 1:806-811 vol.1 1995

Relation: Proceedings of 1995 IEEE International Conference on Robotics and Automation

A Low-Power Single-Input Level Shifter for Oxide Thin-Film Transistors

Authors: Kim, S. Y., Kim, J. D., Kim, Y. K., Lym, H. K., Kim, J. T., Oh, H. S., Pi, J. E., Ryu, M. K., Hwang, C. S., Park, S.-H. K., Yu, B. G., Park, K. C.

Source: Journal of Display Technology J. Display Technol. Display Technology, Journal of. 9(2):71-73 Feb, 2013

Development of highly roughened porous Au electrode with Pt nano-particle for electrochemical sensor applications

Authors: Kim, J. D., Lee, Y. J., Park, J. Y., Kim, H., Kim, Y.

Source: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International. :228-231 Jun, 2009

Relation: TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference

Annealing Effect of Nafion-Propyl-1, 2, 3-Triazole Membrane by Autoclave Solution Processing
Electrochemical Society (Meeting)

Authors: Kim, J. D., Ghil, L. J., Ohira, A.

Source: ECS transactions. 85(13):943-960

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN603996667&indx=1&recIds=ETOCCN603996667

A Three-Dimensional Time-of-Flight CMOS Image Sensor With Pinned-Photodiode Pixel Structure

Authors: Kim, S.-J., Han, S.-W., Kang, B., Lee, K., Kim, J. D. K., Kim, C.-Y.

Source: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 31(11):1272-1274 Nov, 2010

MEMS packaging technology using a cavity structure for mass production

Authors: Lee, J. S., Faheem, F., Kim, J. T., Jung, J. D., Kim, J. Y., Kim, J. D., Lee, C. H.

Source: 2007 International Conference on Electronic Materials and Packaging Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on. :1-6 Nov, 2007

Relation: 2007 International Conference on Electronic Materials and Packaging (EMAP 2007)