EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules

Authors: Wane, S., Dinh, T.V., Alkhalifeh, K., Bajon, D., Kendig, D., Shakouri, M., Gray, D., Shakouri, A., Bolomey, J.-Ch., Cabrera, A. E., de Ledinghen, E., Laban, P.

Source: 2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2024 IEEE Texas Symposium on. :1-6 Apr, 2024

Relation: 2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)

Dual Mode Split Ring Resonator Sensing and Hyperthermia Array for Skin

Authors: Gu, Y., Kendig, D., Shakouri, M., van der Weide, D.W.

Source: IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology IEEE J. Electromagn. RF Microw. Med. Biol. Electromagnetics, RF and Microwaves in Medicine and Biology, IEEE Journal of. 8(3):206-212 Sep, 2024

High-Speed Thermal Imaging Can Resolve Short RF Pulse Effects in Tissue Models

Authors: van der Weide, D.W., Kendig, D., Shakouri, M.

Source: IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology IEEE J. Electromagn. RF Microw. Med. Biol. Electromagnetics, RF and Microwaves in Medicine and Biology, IEEE Journal of. 8(3):201-205 Sep, 2024

Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis

Authors: Wane, S., Kendig, D., Dinh, T.V., Alkhalifeh, K., Cabrera, A. E., Tran, Q.H., Shakouri, M., Shakouri, A., Salmon, L., Molnar, G., Ridier, K., Bajon, D., Nyssens, L., Pip, A., Vanbrabant, M., Rack, M., Tihon, D., Craeye, C., Simon, P., Raskin, J.-P., Lederer, D., Bousseksou, A.

Source: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2023 IEEE Texas Symposium on. :1-6 Apr, 2023

Relation: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)

Dynamic Temperature Measurements of a GaN DC–DC Boost Converter at MHz Frequencies

Authors: Matei, C., Urbonas, J., Votsi, H., Kendig, D., Aaen, P.H.

Source: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 35(8):8303-8310 Aug, 2020

Thermal Performance of GaN/Si HEMTs Using Near-Bandgap Thermoreflectance Imaging

Authors: Pavlidis, G., Yates, L., Kendig, D., Lo, C., Marchand, H., Barabadi, B., Graham, S.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 67(3):822-827 Mar, 2020

Innovative submicron thermal characterization method for AlGaN/GaN power HEMTs with hyperspectral thermoreflectance imaging

Authors: Brocero, G., Kendig, D., Shakouri, A., Guhel, Y., Eudeline, Ph., Sipma, J-P, Boudart, B.

Source: 2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2017 IEEE. :1-4 Oct, 2017

Relation: 2017 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

Thermopower characterization of InSb nanowires using thermoreflectance

Authors: Chavez, R., Vakulov, D., Gazibegovic, S., Car, D., Kendig, D., Tay, A. A. O., Shakouri, A., Bakkers, E. P. A. M.

Source: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2017 23rd International Workshop on. :1-5 Sep, 2017

Relation: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

Transient Thermal Characterization of AlGaN/GaN HEMTs Under Pulsed Biasing

Authors: Pavlidis, G., Kendig, D., Heller, E.R., Graham, S.

Source: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 65(5):1753-1758 May, 2018

Measurement of MMIC gate temperature using infrared and Thermoreflectance thermography

Authors: Ling, J. H. L., Tay, A. A. O., Choo, K. F., Chen, W., Kendig, D.

Source: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :515-518 Dec, 2012

Relation: 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012)

Thermoreflectance imaging of defects in thin-film solar cells

Authors: Kendig, D., Alers, G. B., Shakouri, A.

Source: 2010 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2010 IEEE International. :499-502 May, 2010

Relation: 2010 IEEE International Reliability Physics Symposium (IRPS)

Sub-diffraction limit thermal imaging for HEMT devices

Authors: Ziabari, A., Bahk, J.-H., Xuan, Y., Ye, P.D., Kendig, D., Yazawa, K., Burke, P.G., Lu, H., Gossard, A.C., Shakouri, A.

Source: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :82-87 Mar, 2015

Relation: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

Temperature sensitivity and noise in thermoreflectance thermal imaging

Authors: Shakouri, A., El Sayed Kayed, M., Ziabari, A., Kendig, D., Vermeersch, B., Bahk, J.-H.

Source: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st. :216-220 Mar, 2015

Relation: 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

NASA Global Change Master Directory: an implementation of asynchronous management protocol in a heterogeneous distributed environment

Authors: Nagendra, K.S., Bukhres, O., Sikkupparbathyam, S., Areal, M., Miled, Z.B., Olsen, L., Gokey, C., Kendig, D., Northcutt, T., Kordova, R., Major, G.

Source: Proceedings 3rd International Symposium on Distributed Objects and Applications Distributed objects and applications Distributed Objects and Applications, 2001. DOA '01. Proceedings. 3rd International Symposium on. :136-145 2001

Relation: Proceedings 3rd International Symposium on Distributed Objects and Applications

Detrusor contractility to parasympathetic mediators is differentially altered in the compensated and decompensated states of diabetic bladder dysfunction

Authors: Klee, N. S., Moreland, R. S., Kendig, D. M.

Source: American journal of physiology. 317(2):F388-F398

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCRN621202428&indx=1&recIds=ETOCRN621202428

Demonstration: active asynchronous transaction management in high-autonomy federated environment using data agents: Global Change Master Directory v8.0

Authors: Bukhres, O., Sikkupparbathyam, S., Nagendra, K., Ben Miled, Z., Areal, M., Olsen, L., Gokey, C., Kendig, D., Cordova, R., Major, G., Savage, J.

Source: Proceedings 18th International Conference on Data Engineering Data engineering Data Engineering, 2002. Proceedings. 18th International Conference on. :333-334 2002

Relation: Proceedings 18th International Conference on Data Engineering

Transient Thermal Imaging Characterization of a Die Attached Optoelectronic Device on Silicon
Thermal and thermomechanical phenomena in electronic systems

Authors: Yazawa, K., Kendig, D., Al-hemyari, K., Shakouri, A.

Source: I THERM. 2:1308-1312

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN087902315&indx=1&recIds=ETOCCN087902315

Time-Resolved Thermoreflectance Imaging for Thermal Testing and Analysis
International symposium for testing and failure analysis; ISTFA 2013

Authors: Yazawa, K., Kendig, D., Shakouri, A.

Source: INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS. :194-202

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN087023082&indx=1&recIds=ETOCCN087023082

Fast Transient and Steady State Thermal Imaging of CMOS Integrated Circuit Chips Considering Package Thermal Boundaries
Thermal and thermomechanical phenomena in electronic systems; ITHERM 2012

Authors: Yazawa, K., Kendig, D., Christofferson, J., Marconnet, A., Shakouri, A.

Source: I THERM, ISSN. CONF 2012:1405-1411

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN082423835&indx=1&recIds=ETOCCN082423835

Transient Thermal Imaging of Si/SiGe Superlattice and Bulk Si Microrefrigerators
Energy harvesting : from fundamentals to devices

Authors: Michel, H., Coppard, R., Kendig, D., Christofferson, J., Maize, K., Shakouri, A.

Source: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS. 1218:7-12

Availability: http://explore.bl.uk/primo_library/libweb/action/display.do?tabs=detailsTab&gathStatTab=true&ct=display&fn=search&doc=ETOCCN077970069&indx=1&recIds=ETOCCN077970069