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1Conference
Authors: Adak, Debpratim, Lee, Hyokeun, Feinberg, Ben, Voskuilen, Gwendolyn, Hughes, Clayton, Zhou, Huiyang, Awad, Amro
Source: 2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS) ISPASS Performance Analysis of Systems and Software (ISPASS), 2024 IEEE International Symposium on. :304-306 May, 2024
Relation: 2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)
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2Conference
Authors: Nema, Shubham, Chunduru, Shiva Kaushik, Kodigal, Charan, Voskuilen, Gwendolyn, Rodrigues, Arun F., Hemmert, Scott, Feinberg, Ben, Lee, Hyokeun, Awad, Amro, Hughes, Clayton
Source: 2023 IEEE International Symposium on Workload Characterization (IISWC) IISWC Workload Characterization (IISWC), 2023 IEEE International Symposium on. :196-200 Oct, 2023
Relation: 2023 IEEE International Symposium on Workload Characterization (IISWC)
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3Conference
Authors: Plagge, Mark, Feinberg, Ben, McFarland, John, Rothganger, Fred, Agarwal, Sapan, Awad, Amro, Hughes, Clayton, Cardwell, Suma G.
Source: 2022 IEEE International Conference on Rebooting Computing (ICRC) ICRC Rebooting Computing (ICRC), 2022 IEEE International Conference on. :13-23 Dec, 2022
Relation: 2022 IEEE International Conference on Rebooting Computing (ICRC)
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4Conference
Authors: Alwadi, Mazen, Wang, Rujia, Mohaisen, David, Hughes, Clayton, Hammond, Simon David, Awad, Amro
Source: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2022 IEEE International. :258-268 May, 2022
Relation: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS)
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5Conference
Authors: Karamati, Sara, Hughes, Clayton, Hemmert, K. Scott, Grant, Ryan E., Schonbein, W. Whit, Levy, Scott, Conte, Thomas M., Young, Jeffrey, Vuduc, Richard W.
Source: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2022 IEEE International. :583-594 May, 2022
Relation: 2022 IEEE International Parallel and Distributed Processing Symposium (IPDPS)
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6Conference
Source: 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2021 IEEE International Symposium on. :453-466 Feb, 2021
Relation: 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA)
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7Conference
Source: 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA) HPCA High-Performance Computer Architecture (HPCA), 2021 IEEE International Symposium on. :139-152 Feb, 2021
Relation: 2021 IEEE International Symposium on High-Performance Computer Architecture (HPCA)
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8Report
Subject Terms: Computer Science - Hardware Architecture
Access URL: http://arxiv.org/abs/2207.12231
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9Conference
Source: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI) VLSI (ISVLSI), 2019 IEEE Computer Society Annual Symposium on. :104-110 Jul, 2019
Relation: 2019 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)
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10Conference
Authors: Ye, Mao, Hughes, Clayton, Awad, Amro
Source: 2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO) MICRO Microarchitecture (MICRO), 2018 51st Annual IEEE/ACM International Symposium on. :403-415 Oct, 2018
Relation: 2018 51st Annual IEEE/ACM International Symposium on Microarchitecture (MICRO)
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11Report
Subject Terms: Computer Science - Hardware Architecture
Access URL: http://arxiv.org/abs/2008.00171
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12Academic Journal
Authors: Li, Carol, Hughes, Clayton, Ding, Ruchuang, Snopkowski, Catherine, Salinas, Thalia, Schwartz, Joseph, Dadhania, Darshana, Suthanthiran, Manikkam
Source: In Journal of Immunological Methods October 2022 509
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13Conference
Source: ACM International Conference Proceeding Series; 9/30/2019, p417-427, 11p
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14Conference
Source: ACM International Conference Proceeding Series; 11/11/2018, p58-66, 9p
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15Report
Contributors: Hughes, Clayton [Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)]
File Description: Medium: ED; Size: 22 p.