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1Report
Authors: Ma, W., Huang, X. L., Wu, S. L.
Source: Phys. Rev. A 107, 032409 (2023)
Subject Terms: Quantum Physics
Access URL: http://arxiv.org/abs/2304.07959
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2Report
Authors: Wu, S. L., Huang, X. L., Yi, X. X.
Source: Phys. Rev. A 106, 052217 (2022)
Subject Terms: Quantum Physics
Access URL: http://arxiv.org/abs/2304.07956
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3Report
Authors: Wu, S. L., Ma, W., Huang, X. L., Yi, Xuexi
Source: Phys. Rev. Applied 16, 044028 (2021)
Subject Terms: Quantum Physics
Access URL: http://arxiv.org/abs/2103.12336
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4Conference
Authors: Xiang, Z. Q., Huang, X. L., Zou, Y. X.
Source: 2016 IEEE Second International Conference on Multimedia Big Data (BigMM) Multimedia Big Data (BigMM), 2016 IEEE Second International Conference on. :68-73 Apr, 2016
Relation: 2016 IEEE Second International Conference on Multimedia Big Data (BigMM)
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5Conference
Authors: Huang, X. L., Wang, L. J., Jia, S. L., Deng, J., Qian, Z. H., Shi, Z. Q., Schellenkens, H., Godechot, X.
Source: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :265-268 Sep, 2014
Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
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6Conference
Authors: Qian, Z. H., Wang, L. J., Jia, S. L., Wang, H. J., Huang, X. L., Shi, Z. Q., Schellenkens, H., Godechot, X.
Source: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :253-256 Sep, 2014
Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
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7Conference
Authors: Huang, X. L., Wang, L. J., Jia, S. L., Wang, H. J., Qian, Z. H., Shi, Z. Q.
Source: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on. :289-292 Sep, 2014
Relation: 2014 International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
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8Report
Authors: Huang, X. L., Guo, D. Y., Wu, S. L., Yi, X. X.
Source: Quantum Inf Process (2018) 17:27
Subject Terms: Quantum Physics, Condensed Matter - Statistical Mechanics
Access URL: http://arxiv.org/abs/1802.08428
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9Academic Journal
Authors: Huang, X. L.1 (AUTHOR), Li, Z. X.2 (AUTHOR) lizengxue@126.com, Li, Y.3 (AUTHOR), Liu, H. Y.2 (AUTHOR), Ma, M. Y.1 (AUTHOR), Zhang, H.4 (AUTHOR), Li, X. J.2 (AUTHOR), Zhao, H. G.2 (AUTHOR), Li, X. C.2 (AUTHOR), Feng, K.2 (AUTHOR)
Source: Australian Journal of Earth Sciences. Feb2025, Vol. 72 Issue 1, p118-135. 18p.
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10Report
Authors: Wu, S. L., Huang, X. L., Li, H., Yi, X. X.
Source: Phys. Rev. A 96, 042104 (2017)
Subject Terms: Quantum Physics
Access URL: http://arxiv.org/abs/1705.01695
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11Conference
Authors: Lin, S.-S., Kao, C.-L., Huang, J.-L., Lee, C.-C., Huang, X.-L.
Source: 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on. :393-398 Nov, 2013
Relation: 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
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12Conference
Authors: Lin, H.-J., Huang, X.-L., Huang, J.-L.
Source: 2013 18th IEEE European Test Symposium (ETS) Test Symposium (ETS), 2013 18th IEEE European. :1-6 May, 2013
Relation: 2013 18th IEEE European Test Symposium (ETS)
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13Conference
Authors: Chou, Y.-H., Huang, J.-L., Huang, X.-L.
Source: 2012 IEEE 21st Asian Test Symposium Test Symposium (ATS), 2012 IEEE 21st Asian. :284-289 Nov, 2012
Relation: 2012 21st Asian Test Symposium (ATS)
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14Conference
Authors: Huang, Jiun-Lang, Huang, X.-L., Chou, Y.-F., Kwai, D.-M.
Source: 2012 IEEE 30th VLSI Test Symposium (VTS) VLSI Test Symposium (VTS), 2012 IEEE 30th. :31-36 Apr, 2012
Relation: 2012 IEEE 30th VLSI Test Symposium (VTS)
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15Academic Journal
Authors: Palchetti, L., Brindley, H., Bantges, R., Buehler, S. A., Camy-Peyret, C., Carli, B., Cortesi, U., Del Bianco, S., Di Natale, G., Dinelli, B. M., Feldman, D., Huang, X. L., C.-Labonnote, L., Libois, Q., Maestri, T., Mlynczak, M. G., Murray, J. E., Oetjen, H., Ridolfi, M., Riese, M., Russell, J., Saunders, R., Serio, C.
Source: Bulletin of the American Meteorological Society, 2020 Dec 01. 101(12), E2030-E2046.
Access URL: https://www.jstor.org/stable/27137731
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16Academic Journal
Authors: Huang, X.-L., Ao, D.-W., Chen, T.-B., Chen, Y.-X., Li, F., Chen, S., Liang, G.-X., Zhang, X.-H., Zheng, Z.-H., Fan, P.
Source: In Materials Today Energy September 2021 21
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17Academic Journal
Authors: Huang, M.-F., Kuo, M.-C., Yang, T.-Y., Huang, X.-L.
Source: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 48(11):2827-2838 Nov, 2013
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18Academic Journal
Authors: Huang, X.-L., Wang, G., Hu, F.
Source: IEEE Transactions on Vehicular Technology IEEE Trans. Veh. Technol. Vehicular Technology, IEEE Transactions on. 62(2):809-823 Feb, 2013
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19Academic Journal
Authors: Huang, X.-L., Huang, J.-L.
Source: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 19(10):1765-1774 Oct, 2011
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20Academic Journal
Authors: Huang, X.-L., Wang, G., Hu, F., Kumar, S.
Source: IEEE Transactions on Multimedia IEEE Trans. Multimedia Multimedia, IEEE Transactions on. 13(4):748-761 Aug, 2011