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  1. 1
    Conference

    Source: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2024 23rd IEEE Intersociety Conference on. :1-5 May, 2024

    Relation: 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

  2. 2
    Conference

    Source: 2022 10th International Conference on Affective Computing and Intelligent Interaction (ACII) Affective Computing and Intelligent Interaction (ACII), 2022 10th International Conference on. :1-8 Oct, 2022

    Relation: 2022 10th International Conference on Affective Computing and Intelligent Interaction (ACII)

  3. 3
    Conference

    Source: 2022 IEEE International Conference on Digital Health (ICDH) ICDH Digital Health (ICDH), 2022 IEEE International Conference on. :151-156 Jul, 2022

    Relation: 2022 IEEE International Conference on Digital Health (ICDH)

  4. 4
    Conference

    Source: 2020 International Joint Conference on Neural Networks (IJCNN) Neural Networks (IJCNN), 2020 International Joint Conference on. :1-8 Jul, 2020

    Relation: 2020 International Joint Conference on Neural Networks (IJCNN)

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    Academic Journal

    Authors: Huang, Pei-Hsing1 (AUTHOR), Hsu, Po-Chien1 (AUTHOR), Huang, Tzu-Hsiu2 (AUTHOR), Chou, Chuen-Shii2 (AUTHOR) cschou@mail.npust.edu.tw

    Source: Applied Physics A: Materials Science & Processing. Jan2020, Vol. 126 Issue 1, p1-15. 15p. 6 Diagrams, 1 Chart, 5 Graphs.

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